JPS62265789A - Structure of mounting parts on printed board - Google Patents

Structure of mounting parts on printed board

Info

Publication number
JPS62265789A
JPS62265789A JP10843986A JP10843986A JPS62265789A JP S62265789 A JPS62265789 A JP S62265789A JP 10843986 A JP10843986 A JP 10843986A JP 10843986 A JP10843986 A JP 10843986A JP S62265789 A JPS62265789 A JP S62265789A
Authority
JP
Japan
Prior art keywords
vibration resistance
printed board
mounting
mounting parts
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10843986A
Other languages
Japanese (ja)
Inventor
辻 典俊
赤羽 照信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10843986A priority Critical patent/JPS62265789A/en
Publication of JPS62265789A publication Critical patent/JPS62265789A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プリント基板の搭載部品の実装方法に係り、
特に耐振強度の弱い部品を搭載する“ 場合に適した実
装構造に関する。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for mounting components on a printed circuit board,
In particular, it relates to a mounting structure suitable for mounting components with weak vibration resistance.

〔従来の技術〕[Conventional technology]

従来にも耐振強度の弱い部品をプリント基板上に実装す
ることがあったが、このような場合には接着剤あるいは
シリコンゴム等で固定するようにしていた。
In the past, components with weak vibration resistance were sometimes mounted on printed circuit boards, but in such cases they were fixed using adhesives, silicone rubber, or the like.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

このように接着剤等で固定すると、この部品を交換する
ことができにくくなり、メンテナンスがやりにくくなる
。又、接着剤等で固定する作業時間も無視できなくなっ
ている。
If the parts are fixed with adhesive or the like in this way, it becomes difficult to replace the parts, making maintenance difficult. Furthermore, the time required to fix the parts with adhesive or the like cannot be ignored.

見た目にもきたない。It doesn't look good either.

本発明の目的は、前述の従来技術の項で述にた耐振強度
の弱いプリント基板の搭載部品を、接着剤等の固定剤を
用いることなく、耐振強度を強くすることができる実装
構造を提供することにある。
An object of the present invention is to provide a mounting structure that can increase the vibration resistance of the components mounted on a printed circuit board with low vibration resistance as described in the prior art section without using a fixing agent such as an adhesive. It's about doing.

c問題点を解決するための手段〕 上記目的は、耐振強度の弱い搭載部品に対してその弱い
方向側に耐振強度の強い部品を配置し、耐振強度の弱い
部品を強い部品にて支えるような実装とすることにより
達成される。
c) Means for solving the problem] The above purpose is to place a component with strong vibration resistance on the side of the mounting component with weak vibration resistance, and to support the component with weak vibration resistance with the strong component. This is achieved by implementation.

〔実施例〕〔Example〕

以下、本発明の一実施例を第1図第2図により説明する
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. FIG.

1はプリント基板であり、2はモジュールでありこの部
品はaあるいはb方向への振動に対する強度が弱いもの
である。3a、3bはそ九ぞれプリント板搭載用のリレ
ーであり、耐振強度が強いものである。
Reference numeral 1 is a printed circuit board, and 2 is a module, and these parts have low strength against vibrations in the a or b direction. 3a and 3b are relays for mounting on a printed board, and have strong vibration resistance.

2のモジュールは、背が高く、又固定点が直線となって
いるためa方向あるいはb方向の曲げに対する強度が弱
い部品となっている。そこで、このa方向あるいはb方
向に2のモジュールが曲げられた時、この2のモジュー
ルを支えるように3a、3bのリレーを配置する。この
ようにすると、2のモジュールは第3図の点線で描かれ
た所までしか曲がらなくなり、更に2のモジュールと3
8.3bのリレーとの距離a、   bを短くすれば、
曲がりがほとんどなくなるため結果的にa方向、b方向
に対する曲げの強度が強くなったことになる。
Module No. 2 is tall and has a straight fixing point, so it is a component with weak strength against bending in the a direction or the b direction. Therefore, when the second module is bent in the a direction or the b direction, the relays 3a and 3b are arranged so as to support the two modules. In this way, module 2 will only bend as far as the dotted line in Figure 3, and module 2 and 3
8. If you shorten the distances a and b from the relay in 3b,
Since there is almost no bending, the bending strength in the a direction and the b direction is increased as a result.

本実施例によれば、2のモジュールの曲げに対する強度
、耐振強度が強くなったため、2のモジュールの接着剤
等での固定作業が不要となる。
According to this embodiment, the bending strength and vibration resistance of the second module are increased, so that fixing the second module with an adhesive or the like is not necessary.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、耐振強度の弱い部品をプリント基板上
に搭載する場合でも、接着剤等で固定する必要がなくな
り1作業工数を低減でき。
According to the present invention, even when parts with weak vibration resistance are mounted on a printed circuit board, there is no need to fix them with adhesive or the like, and the number of work steps can be reduced.

更に部品交換等のメンテナンスもやり易くなる見た目も
きれいである。
Furthermore, it has a clean appearance that makes maintenance such as parts replacement easier.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例の部品実装の状態を示す平面
図であり、第2図はその側面図、第3図は部品の曲がる
状態を示した図である。 1・・・本発明の一実施例のプリント基板を示す。 2・・・同上、モジュール部品を示す。 3a、3b・・・同上、基板搭載用リレー示す。 代理人 弁理士  小 川 勝 男 系 1 図 第 3 図 $ 2 図
FIG. 1 is a plan view showing a state in which components are mounted in an embodiment of the present invention, FIG. 2 is a side view thereof, and FIG. 3 is a diagram showing a state in which the components are bent. 1...A printed circuit board according to an embodiment of the present invention is shown. 2...Same as above, module parts are shown. 3a, 3b...Same as above, relays for board mounting are shown. Agent Patent Attorney Masaru Ogawa Male Lineage 1 Figure 3 Figure $2 Figure

Claims (1)

【特許請求の範囲】[Claims] 1、プリント基板の実装において、耐振強度の弱い搭載
部品を、他の部品にてはさみこむことを特徴とするプリ
ント基板への搭載部品実装構造。
1. A structure for mounting components on a printed circuit board, which is characterized by sandwiching mounted components with low vibration resistance between other components in mounting the printed circuit board.
JP10843986A 1986-05-14 1986-05-14 Structure of mounting parts on printed board Pending JPS62265789A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10843986A JPS62265789A (en) 1986-05-14 1986-05-14 Structure of mounting parts on printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10843986A JPS62265789A (en) 1986-05-14 1986-05-14 Structure of mounting parts on printed board

Publications (1)

Publication Number Publication Date
JPS62265789A true JPS62265789A (en) 1987-11-18

Family

ID=14484799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10843986A Pending JPS62265789A (en) 1986-05-14 1986-05-14 Structure of mounting parts on printed board

Country Status (1)

Country Link
JP (1) JPS62265789A (en)

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