JPH04112597A - Protective system of printed board - Google Patents
Protective system of printed boardInfo
- Publication number
- JPH04112597A JPH04112597A JP23070390A JP23070390A JPH04112597A JP H04112597 A JPH04112597 A JP H04112597A JP 23070390 A JP23070390 A JP 23070390A JP 23070390 A JP23070390 A JP 23070390A JP H04112597 A JPH04112597 A JP H04112597A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- printed board
- parts
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title 1
- 238000000034 method Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 description 2
- 235000010575 Pueraria lobata Nutrition 0.000 description 1
- 241000219781 Pueraria montana var. lobata Species 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板保護方式に係り、特に、プリント
基板に実装される部品、またはプリント基板から露出す
る電極部を保護するのに好適なプリント基板保護方式に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed circuit board protection system, and particularly to a printed circuit board suitable for protecting components mounted on a printed circuit board or electrode parts exposed from a printed circuit board. Regarding board protection method.
従来のこの種の方式は、特開昭５９−２０２６８０号に
記載のように、プリント基板に絶縁板を接着することに
より、プリント基板から露出する電極部を保護していた
。In the conventional method of this type, as described in Japanese Patent Application Laid-Open No. 59-202680, an insulating plate is adhered to the printed circuit board to protect the electrode portion exposed from the printed circuit board.
上記従来技術は、プリント基板に電子部品を実装、半田
付は後にプリント基板に絶縁板を接着するため、手間が
かかり高価格となる。また、絶縁板を接着してしまうた
め、後でプリント基板に実装されている部品を取り外す
ことが不可能もしくは困難であるという問題があった。In the above-mentioned conventional technology, electronic components are mounted on a printed circuit board, and an insulating plate is bonded to the printed circuit board after soldering, which is time-consuming and expensive. Further, since the insulating plate is bonded, there is a problem in that it is impossible or difficult to later remove components mounted on the printed circuit board.
本発明の目的は、手間がかからず低価格なプリント基板
保護方式を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board protection method that is hassle-free and inexpensive.
本発明の他の目的は、組み立て後でもプリント基板に実
装されている部品を簡単に取り外すことが可能なプリン
ト基板保護方式を提供することにある。Another object of the present invention is to provide a printed circuit board protection system that allows components mounted on the printed circuit board to be easily removed even after assembly.
上記目的は、プリント基板に実装される部品、またはプ
リント基板から露出する電極部より高さが高く、チップ
部品と同一形状のリフローパッドを持つ絶縁用部品をプ
リント基板に実装することにより、達成される。The above objective is achieved by mounting on the printed circuit board an insulating component that is higher in height than the component mounted on the printed circuit board or the electrode part exposed from the printed circuit board and has a reflow pad of the same shape as the chip component. Ru.
絶縁用部品は、プリント基板に実装される部品、または
プリント基板から露出する電極部より高さが高いため、
プリント基板を直接机上等に置いた場合でも、絶縁用部
品がプリント基板を支えるため、プリント基板に実装さ
れている部品、またはプリント基板から露出している電
極部を保護できる。The insulation parts are higher than the parts mounted on the printed circuit board or the electrodes exposed from the printed circuit board, so
Even when the printed circuit board is placed directly on a desk or the like, the insulating parts support the printed circuit board, so the components mounted on the printed circuit board or the electrode parts exposed from the printed circuit board can be protected.
また絶縁部品には、チップ部品と同一形状のリフローパ
ッドが取り付けられているため、簡単に基板に実装でき
る。Furthermore, since the insulating parts are attached with reflow pads that have the same shape as the chip parts, they can be easily mounted on the board.
以下本発明の一実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第２図において１はプリント基板、２はチップ部品実装
用のパッドである。プリント基板１の半田面の端４ケ所
にチップ部品実装用パッド２を第２図の様にプリント基
板設計時にあらかじめ設けておく。プリント基板に電子
部品実装時、他のチップ部品と同時に、あらかじめプリ
ント基板の端４ケ所に設けであるパッドに第３図に示す
チップ部品と同一形状のリフローパッドを持つ絶縁用部
品３を実装し、半田付けする。これにより、第１図に示
すように、プリント基板を机等に直装置いた場合におい
ても、絶縁用部品３は、プリント基板に実装される電子
部品４、またはプリント基板から露出する電極部５より
高さが高いためプリント基板を支え、電子部品、電極部
を保護する。絶縁用部品３は、プリント基板に実装され
る他の電子部品４と同時に実装され、半田付けにより固
定されるため、装着は簡単で手間がかからない。また絶
縁用部品３は、チップ部品と同一形状のリフローパッド
を持ち、チップ部品用のパッドに半田付けするため、プ
リント基板にチップ部品用のパッドを設けておくだけで
よく、絶縁用部品取り付けのためにプリント基板に特殊
な加工は不要である。In FIG. 2, 1 is a printed circuit board, and 2 is a pad for mounting chip components. Chip component mounting pads 2 are provided in advance at four ends of the solder surface of the printed circuit board 1 as shown in FIG. 2 when the printed circuit board is designed. When mounting electronic components on a printed circuit board, at the same time as other chip components, insulating components 3 having reflow pads having the same shape as the chip components shown in FIG. , to solder. As a result, as shown in FIG. 1, even when the printed circuit board is mounted directly on a desk or the like, the insulating component 3 is not connected to the electronic component 4 mounted on the printed circuit board or the electrode part 5 exposed from the printed circuit board. Due to its high height, it supports printed circuit boards and protects electronic components and electrodes. The insulating component 3 is mounted simultaneously with other electronic components 4 mounted on the printed circuit board and fixed by soldering, so mounting is easy and requires no effort. In addition, the insulating component 3 has a reflow pad with the same shape as the chip component and is soldered to the pad for the chip component, so it is only necessary to provide a pad for the chip component on the printed circuit board, and it is easy to install the insulating component. Therefore, no special processing is required on the printed circuit board.
また第１図に示す様に組み立て後もプリント基板に実装
されている部品、電極部は露出しているため、部品の取
り外しも容易である。Furthermore, as shown in FIG. 1, even after assembly, the parts and electrodes mounted on the printed circuit board are exposed, making it easy to remove the parts.
本発明によれば、手間がかからず低価格でプリント基板
の保護ができるという効果がある。According to the present invention, there is an effect that printed circuit boards can be protected without much effort and at low cost.
また、プリント基板組み立て後でもプリント基板に実装
されている部品を簡単に取り外すことが可能である。Further, even after the printed circuit board is assembled, components mounted on the printed circuit board can be easily removed.
第１図は本発明により絶縁用部品がプリント基板を支え
ている状態を示す側面図、第２図はプリント基板半田面
の正面図、第３図は絶縁用部品の見取り図である。
１・・・プリント基板、２・・・チップ部品実装用パッ
ド、３・・・絶縁用部品、４・・・電子部品、５・・・
電極部。
纂 Ｉ 図
英 ２旧
葛３ 図FIG. 1 is a side view showing a state in which an insulating component supports a printed circuit board according to the present invention, FIG. 2 is a front view of the soldered surface of the printed circuit board, and FIG. 3 is a sketch of the insulating component. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Chip component mounting pad, 3... Insulating component, 4... Electronic component, 5...
Electrode part. Collection I Illustration 2 Old kudzu 3 Illustration
Claims (2)
装される部品、またはプリント基板から露出する電極部
より高さが高く、チップ部品と同一形状のリフローパッ
ドを持つ絶縁用部品を半田付実装することを特徴とする
プリント基板保護方式。1. The printed circuit board protection method is characterized by soldering and mounting insulating components that are higher than the components mounted on the printed circuit board or the electrodes exposed from the printed circuit board and have reflow pads that have the same shape as the chip components. Printed circuit board protection method.
板から露出する電極部より高さが高く、チップ部品と同
一形状のリフローパッドを持つことを特徴とする絶縁用
部品。2. An insulating component that is higher than a component mounted on a printed circuit board or an electrode portion exposed from a printed circuit board, and has a reflow pad that has the same shape as a chip component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23070390A JPH04112597A (en) | 1990-09-03 | 1990-09-03 | Protective system of printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23070390A JPH04112597A (en) | 1990-09-03 | 1990-09-03 | Protective system of printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04112597A true JPH04112597A (en) | 1992-04-14 |
Family
ID=16911995
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23070390A Pending JPH04112597A (en) | 1990-09-03 | 1990-09-03 | Protective system of printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04112597A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4326015A1 (en) * | 2022-08-17 | 2024-02-21 | Delta Electronics Inc. | Pcb pad for smt process |
-
1990
- 1990-09-03 JP JP23070390A patent/JPH04112597A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4326015A1 (en) * | 2022-08-17 | 2024-02-21 | Delta Electronics Inc. | Pcb pad for smt process |
| US20240064896A1 (en) * | 2022-08-17 | 2024-02-22 | Delta Electronics, Inc. | Pcb pad for smt process |
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