JPS62263982A - Resist coater for etching - Google Patents

Abstract

PURPOSE:To uniform the film thickness of a resist on a work surface and to improve the resist coating operation by constituting a titled device into the construction consisting in shaking off an excess resist liquid at the timing of pulling up a material to be etched (work) from a resist vessel. CONSTITUTION:Immersion is executed at a uniform speed in a straight inclining part 12 which descends linearly according to the disposing position of guide rollers 4 of a conveying belt 2 and a horizontal moving part 11 which moves horizontally at the time of immersing the above-mentioned work supported by a holder 2 provided to the belt 2. The work 1 is pulled up while the speed is gradually increased in the curved inclining part which ascends at the gradually increasing speed at the time of pulling up the work 1 from the vessel 20 in succession thereto. The excess resist liquid 5 sticking to the surface of the work 1 is shaken off in the process of the pulling up by which the uniformly stuck resist state is obtd.

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The etching resist coating apparatus of the present invention is configured such that the workpiece conveyance belt runs in a curved line when pulling up the material to be etched from the resist tank.

As a result, the lifting speed of the work suspended on the conveyor belt is accelerated, and excess resist liquid is shaken off, so that the film thickness of the etching resist (hereinafter referred to as resist) is equalized.

[Industrial application field]

The present invention relates to an improvement of a resist coating device for applying an etching resist solution to the surface of a material to be etched such as a metal plate, and in particular, an etching resist coating device that is added with a function of equalizing the film thickness of the resist L-. Regarding.

[Conventional technology]

FIG. 3 is a side sectional view of a main part showing an example of the configuration of a conventional resist coating apparatus.

As shown in FIG. 3, the conventional resist coating device includes a main body 30 equipped with a vertically movable arm 31, and a main body 30 equipped with a vertically movable arm 31.
1 and a resist tank 20 disposed below the resist tank 1.

By raising and lowering the vertically movable arm 31,
A metal thin plate 2 whose surface is to be etched, for example, a thin metal plate 1 for forming nozzle holes of an inkjet head (hereinafter referred to as work) 1, which is suspended from a metal fitting 32, is immersed in the resist solution 5 in the resist tank 20. is applied.

[Problem that the invention seeks to solve]

However, in the case of the above conventional resist coating equipment,
There are the following problems.

(2) As shown in the resist film thickness distribution diagram of the workpiece in Fig. 4, the film thickness T of the resist 5 increases as it goes downward;
The size of the portion where an appropriate film thickness is ensured, that is, the effective area K, becomes small.

(2) Work efficiency is not good because it is necessary to attach and detach each workpiece 1 individually.

[Means for solving problems]

Figure 1+a1. fbl is a diagram of the principle of the present invention, Figure 1 fa) is a comparison diagram of the old and new rising curves of the material to be etched, and Figure 1 (b) is a side cross section showing the state of film thickness distribution of the resist obtained by the present invention. It is a diagram.

The etching resist coating device of the present invention is equipped with a curved slope portion that changes the rising speed of the material 1 to be etched as shown in the rising curve α in FIG. .

In FIG. 1 (al), the vertical axis indicates the vertical position of the material to be etched, and the horizontal axis indicates time.

[Effect]

According to the resist coating apparatus of the present invention configured in this manner, the excess resist liquid 5a is shaken off downward in the direction of the arrow due to the speed change that occurs while the material to be etched is rising, so that the excess resist liquid 5a is shaken off downward (in the direction of the arrow), as shown in FIG. 1(b). As shown in the figure, the film thickness T of the resist liquid 5 is made uniform over a wide range, and as a result, the effective area K is expanded.

In addition, in FIG. 1 fal, the dotted line β indicates the conventional rise curve of the material to be etched, in which the speed changed linearly.

In addition, S in the figure indicates the starting point of the rise of the material to be etched, T1
and T2 indicate the end points of the rise of the rise curves α and β, respectively.

〔Example〕

Hereinafter, the present invention will be described in detail based on embodiment figures.

FIG. 2 is a sectional side view of essential parts of an embodiment of the etching resist coating apparatus of the present invention, in which the same parts as in FIGS. 1 and 3 are given the same reference numerals.

As shown in FIG. 2, the etching resist coating apparatus of the present invention consists of a conveyor belt 2 on which holders 3 for hanging a metal plate (hereinafter referred to as a work), which is a material to be etched, are arranged at regular intervals. and a resist tank 20 for applying resist liquid 5 to the workpiece 1 conveyed by the conveyor belt 2.

The conveyor belt 2 is moved in a straight line (
It is divided into a horizontal slope section 12, a horizontal movement section 1) that moves horizontally, and a curved slope section 10 that rises at an increased speed.

Therefore, when the workpiece 1 supported by the holder 3 attached to the conveyor belt 2 is immersed in the resist liquid 5 in the resist tank 20, it is immersed at a constant speed, and when it is pulled up from the resist tank 20, it is gradually immersed. It will be pulled up while increasing its climbing speed.

In the process of being pulled up, the excess resist liquid 5a adhering to the surface of the work 1 is shaken off, and the first resist liquid 5a is shaken off.
As shown in the principle diagram in Figure fb), the resist is evenly adhered.

Note that the form of the workpiece rise curve α shown in FIG. It will be done.

〔Effect of the invention〕

As explained above, the present invention has a structure in which excess resist liquid is shaken off when the material to be etched is pulled up from the resist tank, so that the thickness of the resist applied to the surface of the material to be etched is equalized. In addition, since the resist coating operation can be performed continuously, there is an advantage that the resist coating operation can be made more efficient.

[Brief explanation of drawings]

FIG. 1(a), crest) is a diagram of the principle of the present invention, FIG. 2 is a sectional side view of a main part showing an embodiment of the present invention, and FIG. 3 is a schematic diagram showing an example of the configuration of a conventional resist coating device. FIG. 4 is a side sectional view showing the distribution state of the resist film. In the figure, 1 is the material to be etched (workpiece), 2 is the transport heddle, 3 is the holder, 4 is the belt guide roller, 5 is the resist liquid, 5a is the excess resist liquid, 10 is the curved vA slope, 1) is the horizontal movement 12 is a linear slope part, 20 is a resist tank, K is an effective area, T is a film thickness, S is a rising start point, T, , T2 is a rising end point, α and β are workpiece rising curves, respectively. + b) 1000 e uterus f \ concavity 2 to j 9 mi day gestation - fruit j 1 color down θ] Figure 2

Claims (1)

[Scope of Claims] A resist coating device that applies an etching resist solution (6) to the surface of a material to be etched (1) by immersing the material to be etched (1) in a resist bath (20), comprising: The resist coating device for etching is characterized in that the resist coating device is equipped with a curved slope portion (10) that changes the lifting speed of the workpiece (1) when the workpiece (1) is lifted from the resist tank (20).