JPS62263700A - Electronic parts mounting - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an effective electronic component mounting method for mounting electronic components on an object to be mounted.

2. Description of the Related Art An example of a method for creating positioning data in a conventional electronic component mounting machine will be described below with reference to the drawings. FIG. 3 is a mounting surface view of the object to be mounted. 1 is the object to be mounted, 2
3 is an electronic component mounting position (area), and 3 is a bottle hole for holding an object to be mounted. When electronic components are mounted using an electronic component mounting machine, the position data given by the control program requires that the positional relationship between the bottle hole 3 and the electronic component mounting position 2 be in a certain position. However, the fourth
As shown in the figure, if the positional relationship between the pin hole 3 and the electronic component mounting position 2 is out of the prescribed position, place a position display recognition mark 4 inside the electronic component mounting position 2. Through this recognition, the relative positional deviation of the object to be mounted is calculated, and the positional data given by the control program is converted and used as positional data for actually mounting the electronic component.

Problems to be Solved by the Invention However, after performing the position data conversion process for mounting electronic components using the method described above, when attempting to actually mount the electronic components, 1) the recognition device may misrecognize the components; 2) If the object to be mounted is deformed due to heat treatment etc. and the recognition mark position shifts and the positional relationship between the recognition marks changes, either of the above two events will occur. If this occurs, there is a problem in that the position data conversion process does not give correct results.

In view of the above-mentioned problems, the present invention provides the positional relationship of recognition marks on the object to be mounted in advance, thereby preventing erroneous recognition.

The present invention provides a method for detecting deformation of an object to be mounted before mounting the component.

Means for Solving the Problems In order to solve the above problems, the electronic component mounting method of the present invention includes a first step of recognizing a predetermined position on an object to be mounted, and a second step of defining a predetermined positional relationship. The first step during the process and mounting operation.
A third process that recognizes the position read in the process, a fourth process that calculates the positional relationship in the third process, and a match between the positional relationship specified in the second process and the positional relationship calculated in the fourth process. This configuration consists of a fifth step of determining whether the

The present invention has the above-described configuration, and can be used even when there is a positional shift in the object to be mounted and when an attempt is made to effectively mount an electronic component using a recognition device, erroneous recognition or deformation of the object to be mounted occurs. Without actually mounting electronic components, it is possible to effectively detect and quickly remove recognition errors or deformations of objects to be mounted, resulting in improved operating rates and a reduction in defective mounting.

Example An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a flowchart showing the procedure for mounting electronic components by applying the present invention. In this embodiment, first, the position display recognition marks shown in FIG. 2 are recognized, and the mark positions on the object to be mounted and their first positional relationship are defined. (
Step 1).

Next, the position specified in step 1 is recognized using a recognition device, and a second positional relationship 2 is calculated. (Step 2).

Thereafter, the first positional relationship and the second positional relationship are compared 1 to examine whether the values are within a predetermined range. (Step 3). If the value is within the range, it is determined to be normal, and the mounting operation is started while taking positional deviation correction into consideration. (
Step 4).

If the value is outside the range, it is determined that there is a misrecognition or a defect in the mounted object, and an error is displayed. (Step 6).

An example of an implementation method for defining and calculating the positional relationship among the above-described procedures will be described. The three points on the object to be mounted are recognized and their positions are taken as coordinate data. As shown in Figure 5, the recognition result in step 1 is A("1").
, yl ) + B(x2.y2) I C(x3.y
3) As the recognition result in step 2, A'('1
+7'1)+B'(x'2.y'2), C'(x
'3. y′3). The first implementation method will be explained.

First, from three points A, B, and C, vector A B = (X
2-x-+.

72-71 ) * 80 = ("3-"1 r 73
-71) and using the inner product relationship of the vectors, h'V, A"c cosθ=-1~---...(1
)lABjlAcl, so similarly for the positional relationship in step 2, 8B'・NC/cosθ2= , , . . . (
Since it can be calculated as A'Bi l A'C'1, cosθ, -E<cosθ-<cosθ-ten, C(f
:TA-I"T-sound f7'l Someyumi'舅'古) is compared as shown in step 3. In this example of the implementation method,
A feature is that the values of cos θ and cos θ2 can be calculated independently of each other's coordinate data.

Next, a second implementation method will be explained. The coordinate position data A' of step 2 is translated in parallel to the coordinate position data A point of step 1. Same amount of simultaneous B' and C' (p, 7D)
Move to new coordinates 33 // (x\y//).

C′texS, y//) is constructed. After that/B”A
Check the value of B, /C”AC.

(3) + From (4), tan(/B/'AB)-εri n(/c%c)<tan
The comparison shown in step 3 is performed to satisfy (/B″AB)+ε or /B″AB−δ</C″AC−/B″AB+δ.

(ε and δ are arbitrary set values) Above 1. In the second implementation method, even when the object to be mounted contracts or expands due to heat treatment or the like, the relationship between the position recognition marks is given as an angle, so there is no influence.

Next, a third example of the implementation method will be described. Step 1.
The amount of positional deviation of the object to be mounted is calculated from the recognition mark position coordinate data obtained in step 2, and the position of the corrected descendant coordinate data is compared with the position data given in step 1.

Effects of the Invention As described above, the present invention includes the steps of recognizing a predetermined position and defining the positional relationship between the recognition marks, and recognizing the predetermined position based on the position data and calculating the positional relationship. By being prepared, even if there is a misalignment of the object to be mounted and an attempt is made to effectively mount electronic components using a recognition device, the recognition device may misrecognize it, the object to be mounted may be deformed, etc. Without mounting electronic components, it is possible to effectively detect and quickly remove erroneous recognition or deformation of the object to be mounted, thereby improving the operating rate and reducing the number of defective mountings.

[Brief explanation of drawings]

Fig. 1 is a flowchart of an electronic component mounting method according to an embodiment of the present invention, Fig. 2 is a supplementary flowchart to the flowchart shown in Fig. 1, Figs. FIG. 6 is a schematic explanatory diagram showing the position of the recognition mark on the object to be mounted. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4

Claims (3)

[Claims] (1) In an electronic component mounting method in which components are sequentially taken out from a component supply section according to instructions from a control program, and the components are mounted using a mounting head on an object to be mounted placed on a flat table positioned by the control program. , a first step of recognizing a predetermined position on the object to be mounted, a second step of realizing the relationship between the predetermined positions, and a third step of recognizing the position read in the first step during the mounting operation, An electronic component consisting of a fourth step of calculating the positional relationship in the third step, and a fifth step of determining whether the positional relationship specified in the second step and the positional relationship calculated in the fourth step are compatible. How to implement. (2) The step of calculating the positional relationship in the second step and the fourth step is characterized in that the position on the object to be mounted is read for three points and defined by the angle formed there. Electronic component mounting method described in section. (3) The method of determining whether the positional relationship is compatible in the fifth step is to set a predetermined range based on the positional relationship specified in the second step, and then calculate the amount calculated in the fourth step within that range. 2. The electronic component mounting method according to claim 1, further comprising verifying whether a positional relationship is established.