JPS62259834A - Device for stretchingly fixing thin film - Google Patents

Abstract

PURPOSE:To prevent poor provisional fixing of the tip part of a thin film to a board from occurring by a structure wherein a thin film correcting device is provided on a device main body or on a supporting member near the travelling course of a provisionally fixing member. CONSTITUTION:A thin film correcting device 16 is provided on a device main body 8 (or on a conveying device 14 in a preceeding stage or on a supporting member 7) near the travelling course of the provisionally fixing member 6D of a main vacuum plate 6. The thin film correcting device 16 corrects the tip part of the supplying direction of a laminate 1B in the direction so as to adhere said tip part to the provisionally fixing member 6D. The thin film correcting device 16 consists of a fluid conveying tube 16A with a plurality of fluid blasting holes 16B, which are provided extending in the direction of the feeding width of the laminate 1B. The fluid blasting hole 16B blows fluid against the laminate 1B in the direction to correct the laminate 1B (as indicated with the arrows E). Accordingly, the tip part of the laminate 1B is surely adhered to the provisionally fixing member 6B so as to be able to surely provisionally fix (provisionally hot press) the tip part of the laminate 1B onto the electrically conductive layer of an insulating substrate 12.

Description

Detailed Description of the Invention (1) Purpose of the Invention [Field of Industrial Application] The present invention relates to thin film pasting technology, and in particular to thin film pasting technology in which a continuous thin film is cut into predetermined dimensions and pasted onto a substrate. The present invention relates to techniques that are effective when applied to attached devices.

[Prior art]

2. Description of the Related Art Printed wiring boards used in electronic devices such as computers have a predetermined pattern of wiring made of copper or the like formed on one or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by a first manufacturing process.

First, on a conductive layer provided on an insulating substrate.

A laminate consisting of a photosensitive resin (first resist) layer and a transparent resin film (protective film) for protecting it is laminated by thermocompression bonding. This thermocompression lamination is efficiently carried out using a thin film pasting device, a so-called laminator. Thereafter, a wiring pattern film is placed on the laminate, and the photosensitive resin layer is exposed to light for a predetermined period of time through the wiring pattern film and the transparent resin film. After the transparent resin film is peeled off using a peeling device, the exposed photosensitive resin layer is developed to form an etching mask pattern. After that, unnecessary portions of the conductive layer are removed by etching,
Furthermore, the remaining photosensitive resin layer is removed to form a printed wiring board having a predetermined wiring pattern.

[Problem that the invention seeks to solve]

In the manufacturing process of the above-mentioned printed wiring board, a process of automatically thermocompression-bonding a laminate onto a conductive layer of an insulating substrate using a thin film pasting device is required. The outline of this thermocompression lamination process is as follows.

First, the laminated body continuously provided on the supply roller of the thin film pasting device is supplied to the substrate by the main vacuum plate. The main vacuum plate has multiple suction holes on the stack supply surface.

It is configured to adsorb and supply the laminate to this suction hole. The tip of the laminate supplied to the substrate is attracted to the arc-shaped temporary attachment part provided at the tip of the main vacuum plate, and is temporarily attached (unbalanced) onto the conductive layer of the insulating substrate at this temporary attachment part. heat compression bonding).

The vCC rod is adsorbed to the temporary attachment part using a sub-vacuum plate.

Next, the laminate to which the tip has been tacked is thermocompression laminated to the substrate using a thermocompression roller. When a certain amount of Vt layer spring body is thermocompression laminated, the main vacuum plate supplies the laminate at a speed faster than the thermocompression lamination speed to give slack at the rear end of the laminate. This slack in the laminate is formed between the sub-vacuum plate and the rotary vacuum plate which rotates on the same rotation axis as the thermocompression roller due to their adsorption action. The laminate is made to have slack so that the portion of the laminate to be cut remains substantially stationary while thermocompression lamination is performed.

Thereafter, the laminate is cut into a predetermined size corresponding to the closing plate by a cutting device, and the rear end of the laminate is laminated by thermocompression using a thermocompression roller guided by a rotating vacuum plate.

However, in this type of thin film pasting device, the tip of the laminate is adsorbed to the tacking part so that it is removed from the supply path of the laminate, so there are cases where the laminate is not adsorbed to the tacking part. There was a problem of poor attachment.

In addition, in the step of forming slack in the laminate, slack may be formed in the direction of peeling from the rotating vacuum plate (the opposite direction to the direction of adhesion to the thermocompression roller), making it impossible to kite with the rotating vacuum plate. Therefore, there was a problem in that thermocompression lamination defects such as wrinkles occurred.

The above-mentioned and other problems and novel features to be solved by the present invention will become clear from the description of this specification and the accompanying drawings.

(2) Structure of the Invention [Means for Solving the Problems] Among the inventions disclosed in the water jug, a brief overview of typical inventions is as follows.

The present invention provides a thin film sticking device that cuts a continuous thin film into predetermined dimensions and sticks the cut thin film on a substrate, including a thin film supplying member that supplies the continuous thin film to the substrate;
A temporary attachment member for temporarily attaching the tip of the W film supplied by the thin film supply member to the substrate is provided on the apparatus main body via a support member that approaches and moves away from the substrate, and the temporary attachment member A thin film straightening device for straightening the tip of the thin film in the feeding direction in the direction of tight contact is provided on the device main body or on the supporting member near the moving path of the temporary attachment member.

Further, in the above configuration, after the pressure roller starts applying the thin film to the substrate, the thin film supplying speed of the thin film supplying member is made faster than the thin film application speed of the pressure roller, so that the rear end portion of the thin film is A thin film protrusion device t'? is provided with a thin film slack forming means to give slack, and protrudes the thin film in a direction in which the slack portion of the thin film formed by the kneaded film slack forming means is applied to the pressure bonding roller indicated by i'+ij. is provided on the device main body or on the support member near the moving path of the temporary attachment member.

[Effect]

According to the above-mentioned means, the thin film straightening device can reliably bring the tip of the thin film into close contact with the tacking member, so the tip of the thin film can be reliably tacking to the substrate and defective tacking can be avoided. It can be prevented.

In addition to the above-mentioned action, the thin film ejecting device allows the thin film with slack to be reliably adsorbed to the rotating suction member of the pressure roller, and the thin film can be attached to the substrate without wrinkles or the like. Possible to prevent poor adhesion 6 [Example of the invention] Hereinafter, the invention will be applied to a film adhesion device for thermocompression laminating a laminate consisting of a photosensitive resin layer and a translucent resin film on a printed wiring board. An embodiment of the present invention will be specifically described using one drawing.

In addition, in all the figures for explaining the embodiment, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

A thin film pasting device which is an embodiment of the present invention is shown in FIG. 1 (schematic configuration diagram) and FIG. 2 (enlarged configuration diagram of the main part of FIG. 1).

As shown in FIGS. 1 and 2, a translucent resin film,
A laminate 1 having a three-layer structure of a photosensitive resin layer and a transparent resin film is continuously wound around a supply roller 2 . The laminate 1 of the supply roller 2 is a laminate made of a transparent resin film (protective film) IA, a photosensitive resin layer with the - side (adhesive side) exposed, and a transparent resin film by the peeling roller 3. It is separated into body IB. The separated translucent resin film IA is configured to be wound up by a winding roller 4.

The leading end of the separated laminate IB in the supply direction is configured to be attracted to a main vacuum plate 6 through a tension roller 5.

The tension roller 5 is configured to apply appropriate tension to the stacked body IB between the supply roller 2 and the main vacuum plate 6. In other words, the tension roller 5 is configured so as not to cause wrinkles or the like on the laminate IB.

The main vacuum plate (thin film supply member) 6 is configured to supply the laminate IB from the supply roller 2 onto the conductive layer of the insulating substrate 12. The main vacuum plate 6 is supported by an apparatus main body (casing of the thin film applying apparatus) 8 via a support member 7 that is close to the insulating substrate 12 and moves away from it (moves in the direction of arrow A). The support member 7 includes a drive source 7A made of, for example, an air cylinder, which moves the main vacuum plate 6, and a support portion 7B which supports the drive source 7A on the main body 8 of the apparatus.

The drive 'g7A is not limited to an air cylinder, but can be configured with, for example, a hydraulic cylinder, an electromagnetic cylinder, a stamp motor and a transmission mechanism that transmits its displacement to the main vacuum plate 6.

As shown in FIG. 3 (partial cross-sectional perspective view), the main vacuum plate 6 is provided with a plurality of grooves 6A in the conveyance direction, which extend in the supply width direction that is substantially orthogonal to the supply direction of the laminate IB. The length of the groove 6A (the length of the laminate IB in the supply width direction) is approximately the same as the dimension of the laminate IB in the supply width direction, and the laminate IB is configured to cover the groove 6A. There is. A plurality of suction holes 6B for suctioning the laminate IB are provided at the bottom of the bent portion 6A. Although not shown, the suction hole 6B is connected through an exhaust pipe.

Connected to a vacuum source such as a vacuum pump. The end portion 6C of the groove portion 6A has a tapered shape that is dug from the end portion of the main vacuum plate 6 to the center portion. The end portion of the stacked body IB, which is attracted to the main vacuum plate 6, is located at this end portion 6G (tapered portion).

This tapered end portion 6C has a 114 portion 6A.
In addition to maximizing the adsorption area between the frC layer body IB and the adsorption effect, when adsorbing the frC layer body spring body, the groove portion 6A
Even if there is a slight deviation in the adsorption position between the stacked body IB and the stacked body IB, it is shallower than the groove portion 6A, so that the adhesion between the end portions of the stacked body IB and the end portion 6C is improved.

The adsorption effect between the groove portion 6A and the laminate IB can be further improved.

At the tip of the main vacuum plate 6 in the supply direction of the laminate IB, a temporary fixing member 6D is provided, in which the suction surface of the laminate IB is formed in an arc shape. Temporary attachment part FJ
6D is constructed integrally with the main vacuum plate. As shown in FIGS. 1 and 2, a heater 6E for heating the arc-shaped portion is provided inside the temporary attachment member 6D.

The temporary attaching member 6D is configured to temporarily attach the tip of the laminate IB supplied by the main vacuum plate 6 to the substrate 12 (biased heat compression bonding).

In addition, in the present invention, the main vacuum plate 6 and the temporary attachment member 6D are each constructed as separate members, and both are connected to the support member 7.
It may be provided in the main body 8 of the apparatus via a.

A position close to the temporary attachment member 6D, that is, the temporary attachment member 6
A sub-vacuum plate 9 is provided in the main body 8 of the apparatus near the supply path of the laminate IB between the substrate 12 and the substrate 12. The sub-vacuum plate 9 has a U-shaped configuration including an upper suction portion 9a and a lower suction portion 9b, although suction holes are not shown. The upper suction part 9a of the sub-vacuum plate 9 is configured to mainly suction the leading end of the stacked body IB in the supply direction, and to suction (hold) the top end of the stack IB to the temporary attachment member 6D. The sub-vacuum plate 9 is a laminate I
The main body of the apparatus is moved toward and away from the supply path of the laminate IB (moves in the direction of arrow B wJ) through a drive 89A made of, for example, an air cylinder so that the tip of B can be adsorbed to the temporary attachment member 6D. It is fixed to 8.

Moreover, the lower adsorption part 9b of the sub-vacuum plate 9 is
The continuous laminate IB is cut by a cutting device 10, and the rear end of the cut laminate IB is sucked. After starting the thermocompression bonding laminate, the lower suction part 9b is connected to the laminate 113 between the rotary vacuum plate 3 and the laminated body 113.
(Laminated body IB' with slack)
). The laminated body IB' having this slack can be formed by controlling the circumferential speed of the thermocompression roller 11 (thermocompression lamination speed) to be slower than the supply speed of the laminated body IB of the main vacuum plate 6. can. For example, when the circumferential speed of the thermocompression roller 11 is constant, the main vacuum plate 6
The speed at which the laminate IB is fed is set faster than the circumferential speed. Although not shown, both are controlled by a sequence control circuit.

Note that the drive source 9A for the sub-vacuum plate 9 may be configured with a hydraulic cylinder or the like, similar to the drive source 7A, in addition to an air cylinder.

The device main body 8 (or the front-stage conveyance device 11\14
) is provided with a cutting device 10.

More specifically, the cutting device 10 is configured at a position facing the sub-vacuum plate 9 with the stacked body IB interposed therebetween. The cutting device 10 is configured to cut the laminate IB continuously supplied by the main vacuum plate 6 into a predetermined length corresponding to the dimensions of the substrate work 2.

The specific structure of this cutting device 10 is shown in FIG.
- Cross-sectional view taken along line ■).

As shown in FIGS. 4 and 5, the cutting device 10 mainly includes a guide member 10A, a moving member 10B, and a disc-shaped cutter 10C.

The guide member 10A extends in the supply width direction of the laminate IB, and both ends (or one end) thereof are fixed to the apparatus main body 8. This fixation is done with screws and bolts.

This is done using fixing means such as nuts, screws, adhesives, etc.

The guide member 10A has a supply width direction (fourth direction) of the laminate IB.
In order to accurately move the moving member 10B in the direction of arrow 0 shown in the figure, a recess (or protrusion) 10b that fits into the protrusion (or recess) 10a of the second moving member 10F3 is provided.

The moving member 10B is configured to move along the guy 1 member 10A (in the supply width direction of the laminate IB). The moving member 10B is a hollow tube 10 that extends along the guide member 10A and has both ends supported by the device main body 8.
A hollow tube moving member 10 that moves within D in the direction of arrow C' force.
It is connected to E. The moving member 10E within the hollow tube is moved by blowing (or suctioning) fluid such as air from each end of the hollow tube 10D. In other words, the hollow tube contents 3'Jj member 10E moves from the left side to the right side when fluid is blown from the left side of the hollow tube 10D at the th.'tM, and when the fluid is blown from the right side of the hollow tube 10D, it moves from the right side. It is configured to move to the left.

The moving member 10E in the hollow tube is configured to move the moving member 10B. Air is used as the fluid blown into the hollow tube 10D. Further, as the fluid, a gas such as an inert gas, or a liquid such as water or oil may be used. Also,
The moving member 10B is.

It may be configured to move using an air cylinder, hydraulic cylinder, motor, or the like.

The disc-shaped cutter 10G rotates according to the movement of the moving member 10B, and is provided with a blade portion on at least its circumferential portion for cutting the laminate IB. The disc-shaped cutter 10C is rotated by a gear (pinion) IOG provided on the rotating shaft 10F.
The rack IOJ is provided by fitting the rack IOJ with a gear 10I provided on the rotating shaft 10. The rack IOJ has both ends (or one end) fixed to the device main body 8.

The rack IOJ and the gear 10I are fitted together by the moving member 10B.
It is stably held by a holding roller IOL provided on the holder.

The disc-shaped cutter 10G is made of a metal material such as high-speed tool steel, and polytetrafluoroethylene is coated on at least the surface of the blade. Polytetrafluoroethylene is inert to chemicals, has excellent thermal stability, has a small coefficient of friction, and is difficult to adhere to other materials. In particular, in the thin film pasting device, minute chips containing various chemicals generated by cutting the laminate IB adhere to the blade portion of the disc-shaped cutter 10.
Since the sharpness of C tends to deteriorate, coating with polytetrafluoroethylene is effective.

The movable member 10B near the disc-shaped cutter tOC is provided with a disc-shaped cutter 1 mainly to ensure the safety of the worker.
A protective cover 10K is provided to cover 0C.

In this cutting device 10, the movable member 10B is a guide member 10.
By moving A in one direction, the laminated body 1B can be cut into a size corresponding to the length of the insulating substrate 12 by the rotation of the disc-shaped cutter 10C caused by this movement. Moreover, since the disc-shaped cutter 10C can cut the laminate IB by moving in one direction, the cutting time for the laminate IB can be shortened.

In the thin film pasting device configured in this way, the main vacuum plate 6 and the temporary pasting member 6D.

A cutting device 10, which is installed in the main body 8 of the apparatus via a support member 7 that approaches and moves away from the substrate 12 and cuts the laminate IB, is installed near the supply path of the laminate IB between the tacking member 6D and the substrate 12. By fixing it to the device main body 8, the weight of the member supported by the support member 7 is reduced, so the support member 7 can be driven by the driver 1FlJ source 7A having a small driving ability (capacity).

Further, since the number of parts supported by the support member 7 can be reduced, the structure of the support member 7 and its surroundings can be simplified, and the thin film pasting device can be downsized.

Further, since the drive aD 7 A and the like can be downsized, the manufacturing cost of the thin film sticking device can be reduced.

Note that in this embodiment, one sub-vacuum plate 9 is supported by the device main body 8, but the cutting device i! Since it is much lighter than the main vacuum plate 6, it may be provided on the support member 7 together with the main vacuum plate 6.

In addition, instead of the configuration in which the one disk-shaped cutter 10C is moved, the cutting device 10 may be a beam cutter using ultrasonic waves, laser beams, etc. A cutter having a blade portion of approximately the same size or larger size may be used, such as a guillotine cutter, a strip cutter, a heated or non-heated wire cutter, a knife cutter, etc. This cutting device 10
can cut the laminate IB at one time.

The tip of the main vacuum plate 6 is temporarily attached onto the conductive layer of the insulating substrate 12 using the temporary attaching member 6D (biased heat compression bonding).
The Sakuru M spring body IB is configured such that its entirety is thermocompression laminated using a thermocompression roller 11. The thermocompression roller 11 is placed and rotated at the position shown by the dotted line 11' in FIG. 1 during the tacking operation of tacking the tip of the laminate IB at the tacking portion H6D. The thermocompression roller 11 is configured so as not to come into contact with the tacking member 6D during the tacking operation. After the tacking operation, the thermocompression roller 11 is configured to move from the position indicated by the dotted line 11' to the position indicated by the solid line, that is, the position where it clamps the substrate 12 with the laminate IB interposed therebetween. There is. The thermocompression bonding roller 11 sandwiching the substrate 12 with the laminate IB interposed therebetween is a second
It is configured to rotate in the direction of the arrow shown in the figure to heat-press and laminate the laminate IB onto the conductive layer of the insulating substrate 12 and to transport the substrate 12. During the thermocompression bonding lamination process, the suction operation of the main vacuum plate 6 and the sub-vacuum plate 9 on the stacked body IB is stopped. That is, the thermocompression roller 11 is configured such that the stacked body IB is automatically supplied from the supply roller 2 by its rotational force and the clamping force between the thermocompression roller 11 and the substrate 12 .

The rear end of the laminate IB cut by the cutting device 10 is
It is configured to be guided by a triangular rotating vacuum plate 13 to prevent wrinkles, etc., and to be laminated by thermocompression bonding with a thermocompression roller 11. As shown in FIG. 6 (perspective view of main parts), the rotary vacuum plate 13 is supported on the same axis as the thermocompression roller 11 and is configured to rotate around it, and faces the laminate IB. A plurality of suction holes 13A are provided on the suction surface.

The structure of the suction surface on which the suction holes 13A are arranged is similar to the suction surface of the main vacuum plate 6 shown in FIG. Although not shown, a suction hole may also be provided on the upper surface of the rotary vacuum plate 13. With this configuration, the slack IB' can be brought into a state as shown in FIG. 2.

The substrate 12 is conveyed to the temporary attachment position of the laminate IB of the thin film attachment device by a heavy film conveyance device 14 comprising a conveyance roller (lower stage) 14A and a conveyance roller (upper stage) 14B.

In addition, the conveyance roller (lower stage) 15A and the conveyance roller (upper stage)
15B is configured to transport the substrate 12 on which the laminate IB is laminated by thermocompression bonding using the thermocompression roller 11 of the film pasting device to the exposure device where a wiring pattern is formed. There is.

A thin film straightening device 16 is provided in the apparatus main body 8 (or the front-stage conveying device 14 or the supporting member 7) near the movement path (thin film supply path) of the temporary attachment member 6D of the main vacuum plate 6. The thin film straightening device 16 is configured to straighten the leading end of the laminate IB in the supply direction in the direction of bringing it into close contact with the temporary attachment member 6D. The specific configuration of the thin film correction device 16, as shown in FIGS. 2 and 7 (perspective views of main parts), includes a fluid conveying pipe 16A extending in the supply width direction of the laminate IB; The fluid transport pipe 16A is configured with a plurality of fluid spray holes 16B.

The fluid transport pipe 16A has a hollow interior and is configured to flow fluid at a pressure higher than normal pressure. Although the fluid transport pipe 16A has a substantially circular cross-sectional shape in this embodiment, it is not limited thereto, and may be rectangular or elliptical.

The fluid spray holes 16B are arranged in a direction (second direction) for straightening the laminate IB.
It is provided so as to spray fluid in the direction of arrow E shown in FIGS.

Air is used as the fluid in the thin ll5I correction device 1G. Further, as the fluid, a gas such as an inert gas, or a liquid such as water or oil may be used.

In this way, in the A-film pasting device, the thin 11 straightening device 16 that straightens the tip of the stacked body 113 in the supply direction in the direction of bringing it into close contact with the tacking member 6D is placed near the moving path of the tacking member 6D. By providing this in the device main body 8 (or the supporting member 7 or the pre-transfer device i!714), the leading end of the laminate IB can be reliably brought into close contact with the tacking member 6D, so that the electrical conductivity of the insulating substrate 12 can be reduced. The tip of the spring body B of the layer A can be reliably tack-bonded (biased heat compression bonding) onto the layer.

Further, the JA neck main body 8 (or the pre-stage conveyance device 14, or the support member 7).

A thin film ejection device 17 is provided. That is, the thin film ejecting device 17 is configured to eject the laminated body IB' having the slack in the direction of bringing it into close contact with the thermocompression roller 11. As shown in FIGS. 2 and 7, the specific configuration of the thin film ejecting device 17 includes a fluid transport pipe 17A extending in the supply width direction of the stacked body IB, and a fluid transport pipe 17A provided in the fluid transport pipe 17A. It is composed of a plurality of fluid spray holes 17B.

The fluid transport pipe 17A has a hollow interior and is configured to flow fluid at a pressure higher than normal pressure. Although the fluid transport pipe 17A has a substantially circular cross-sectional shape in this embodiment, the cross-sectional shape is not limited to this like the fluid transport pipe 16A, and the cross-sectional shape may be rectangular or elliptical.

The fluid spray hole 17B is provided so as to spray fluid in a direction (direction of arrow F shown in FIGS. 2 and 7) in which the slack of the laminate IB'' is made to protrude as described above.

As the fluid used in the thin film ejection device 17, air is used as in the thin film correction device 16. Further, as the fluid, a gas such as an inert gas, or a liquid such as water or oil may be used.

In this way, in the thin film pasting device, the thermocompression roller 1
The laminate IB' has the slack in the direction in which it comes into close contact with the laminate IB'.
The thin film protrusion device 17 for correcting the
By providing this, it is possible to provide a slack in the direction in which the laminated body IB' is reliably brought into close contact with the thermocompression roller 11, so that the rear end of the laminated body IB can be surely attracted to the one-rotation vacuum plate 13 in particular. be able to. Therefore, the rear end portion of the laminate IB can be reliably thermocompressed and laminated onto the conductive layer of the insulating substrate 12 without causing wrinkles or the like.

Note that the present invention relates to a thin film correction device 16 or a thin film protrusion device 1.
7 may be constituted by a plurality of fluid spray nozzles provided in the supply width direction of the laminate IB, which spray fluid so as to straighten or protrude the laminate IB in an appropriate direction as described above.

Further, the present invention provides a thin film correction device 16 or a thin film protrusion device 1.
7 to a suction tube extending in the supply width direction of the laminated body IB, and a plurality of suction tubes provided in this suction tube to suck the laminated body IB in a direction to straighten or protrude it in an appropriate direction as described above. It may also be configured with a suction hole.

In addition, one aspect of the present invention is a thin film correction device 16 or a thin film protrusion device 1.
7 may be constituted by a protruding member that straightens or protrudes the laminate IB in an appropriate direction as described above.

Further, the present invention provides the thin film correction device 16 with the thin film protrusion device 17.
Alternatively, it is also possible to use the thin film straightening device 16 as the thin film ejecting device 17.

A substrate guide member 18 is provided in the apparatus main body 8 (or the subsequent conveyance device 15) between the thermocompression bonding roller 11 and the conveyance roller 15A of the subsequent conveyance device 15. The substrate guide member 18 is configured to guide the substrate 12 on which the laminate IB is laminated by thermocompression bonding from the thermocompression bonding position to the positions of the transport rollers 15A and 15B.

In particular, as shown in FIG. 6, the substrate guide member 18 has a comb-shaped configuration in which a plurality of rod-shaped portions extending in the conveying direction of the substrate 12 are arranged in the conveying width direction. The comb-shaped substrate guide member 18 can reduce the contact area with the substrate 12 and reduce frictional resistance when the substrate 12 is transported.

The substrate 12 can be guided smoothly.

In this way, the thermocompression roller 11 and the latter transport bag S! 1
By providing the substrate guide member 18 between the conveyance rollers 15A of No. 5 and the conveyance rollers 15A, especially in the case of thin substrates 12, it is possible to prevent the tip of the substrate 12 from sagging in the conveyance direction after thermocompression lamination, and to ensure that the conveyance rollers 15A and 15B are Since the substrate can be guided and transported, troubles in the subsequent transport device 15 (transport route of the substrate 12) can be prevented. Particularly, in the conveyance device of the thin film pasting apparatus of this embodiment, a space is required for the thermocompression roller 11 to move from the position indicated by the dotted line marked 11' to the position shown by the solid line in order to perform the tacking operation. Therefore, the thermocompression roller 11 and the conveyance roller 15
The substrate guide member 18 is effective because a considerable space is formed between the substrate guide member A and the substrate guide member 18.

Note that in the present invention, the substrate guide member 18 may have a net-like structure.

Further, in the present invention, the substrate guide member 18 may be configured in a plate-like structure.

Next, a method of thermocompression laminating the laminate IB using the thin film pasting apparatus of this embodiment will be briefly described.

First, the tip of the laminate IB separated by the peeling roller 3 in the feeding direction is manually placed between the sub-vacuum plate 9 and the cutting device 10.

Next, the conveyance rollers 14A and 14B of the former conveyance device 14
When the leading edge of the substrate 12 in the conveying direction is conveyed to the temporary attachment position, the sub-vacuum plate 9
Attach the tip of the After adsorption of laminate IB, drive g9A
, move the sub-vacuum plate 9 to a position away from the supply path of the laminate IB, and attach the laminate IB to the temporary attachment member 6D.
Attach the tip of the At this time, the suction operation of the main vacuum plate 6 and the temporary attachment member 6D is performed, and
Since the laminate IB can be straightened by the thin film straightening device 16, the tip of the laminate IB can be reliably adsorbed to the temporary attachment member 6D. Note that when the continuous operation is performed, the tip of the laminate IB cut by the cutting device 10 is attached to the temporary attachment member 6D.
is adsorbed to.

Thereafter, the main vacuum plate 6 is moved in the direction closer to the substrate 12 by driving @7A. As a result of this movement, the tip of the laminate IB adsorbed by the tacking member 6D is tacking (celestial compression bonding) onto the conductive layer of the insulating substrate 12.

After temporarily attaching the laminate IB, the main vacuum plate 6
Then, the suction operation of the temporary attachment member 6D is stopped, and the main vacuum plate 6 and the temporary attachment member 6D are separated from the temporary attachment position by driving @7A. As described above, this drive source 7A fixes the cutting device 10 to the device main body 8, so
It is configured to be small in size or to be able to operate at high speed by increasing the driving ability.

Thereafter, the thermocompression roller 11 is moved from the position indicated by the dotted line with the reference numeral 11' to the temporary attachment position indicated by the solid line. Then, by holding and rotating the insulating substrate 12 to which the tip of the laminate IB is temporarily attached by the thermocompression roller 11,
The vI layer weight B is laminated by thermocompression on the conductive layer of the insulating substrate 12. At this time, since the suction operations of the main vacuum plate 6, temporary attachment member 6D, and sub-vacuum plate 9 are stopped, the thermocompression roller 11 has its rotational force and the clamping force with the base f212. The laminate IB is self-supplied from the supply roller 2.

When a certain amount of the laminate IB is laminated by thermocompression bonding, the suction operation of the main vacuum plate 6 and the rotary vacuum plate 13 is started, and the main vacuum plate 6 supplies the laminate IB to the substrate 12 by the driving source 7A. . This supply speed is set faster than the thermocompression laminating speed (peripheral speed of the thermocompression roller 11) by the thermocompression roller 11.

After supplying the stacked body IB, the suction operation of the main vacuum plate 6 is stopped, and the main vacuum plate 6 is separated by the drive source 7A. Along with this separation movement,
The suction operation of the sub-vacuum plate 9 is started, and the sub-vacuum plate 9 is brought close to the supply path of the laminate IB to suction and hold the rear end (cut portion) of the laminate IB. Due to this adsorption, it is possible to form a laminated body IB' with slack between the sub-vacuum plate 9 and the rotary vacuum plate 13. By straightening the thin film straightening device 17, both ends of the laminated body IB' with the slack in the supply direction can be reliably attracted to each of the lower suction portion 9b1 of the sub-vacuum plate 9 and the rotary vacuum plates 1-13. can.

When the rear end of the stacked body IY3 is held by the sub-vacuum plate 9, iJ is generated by the cutting portion fr110.

The rear end portion of the laminate IB is cut to a predetermined size corresponding to the size of the substrate 12.

After that, when the rear end of the IRJ-cut stacked body IB is attracted to the rotating vacuum 11 plate 13 by the cutting device 10,
The rotary vacuum plate 13 rotates at a speed slightly slower than the rotational speed of the thermocompression roller 11, and applies appropriate tension to the thin film between the thin film application portion by the thermocompression roller 11 and the rear end of the thin film, thereby preventing wrinkles in the laminate IB. The rear end of the laminate IB can be thermocompression-bonded and laminated on the conductive layer of the insulating substrate 12 without causing any problems.

The substrate 12 on which the laminate IB is thermocompression laminated is passed through the substrate guide member 18 by the rotational force of the thermocompression roller 11 without causing any trouble.

Backstage transport bag! i! The substrate 12, which is transported by the 15 transport rollers 15A and 15B to the 6 rear transport devices 15, is transported to the exposure device.

The invention made by the present inventor has been specifically explained based on the above embodiments, but the present invention is as follows.

It goes without saying that the invention is not limited to the embodiments described above, and that various modifications may be made without departing from the spirit thereof.

For example, in the present invention, the sub-vacuum plate 9
The sub-vacuum plate may be composed of a sub-vacuum plate that adsorbs the tip end of the laminate IB in the supply direction to the tacking member 6D, and a sub-vacuum plate that is used as a holder for the cutting device 10, and each may be independently controlled.

Further, in one aspect of the present invention, after preheating the substrate 12 of the above embodiment,
The present invention can be applied to a thin film pasting device that heat-presses and laminates the laminate IB on the substrate 12 using a non-heated pressure roller.

Further, the present invention can be applied to a thin film pasting device for pasting a protective film on a decorative board used as a construction material.

(3) Effects of the invention According to the invention, a continuous thin film is cut into predetermined dimensions,
In the thin film adhering device for adhering the cut thin film to the substrate, there is a thin film supplying member that supplies the continuous thin film to the substrate, and a tip of the thin film in the feeding direction supplied by the thin film supplying member is temporarily attached to the substrate. A thin film straightening device is provided on the main body of the apparatus via a support member that approaches and moves away from the substrate, and a thin film straightening device that straightens the tip of the thin film in the feeding direction in the direction of bringing it into close contact with the temporary mounting member. By providing it on the device main body or the support member near the moving path of the member, the tip of the thin film can be reliably brought into close contact with the temporary attachment member.
The tip of the thin film can be reliably tack-attached to the substrate, and defective tack-attachment can be prevented.

According to the present invention, in the above structure, after the pressure roller starts applying the thin film to the substrate, the thin film supplying speed of the thin film supplying member is made faster than the thin film application speed of the pressure roller, and the rear end of the thin film is A thin film slack forming means is provided, and a thin film protruding device is provided for protruding the thin film in a direction in which the slack portion of the thin film formed by the thin film slack forming means is brought into close contact with the pressure roller. In addition to the above-mentioned effects, by providing the thin film on the device body or the supporting member near the path, the thin film with slack can be reliably adsorbed to the rotating suction member of the pressure roller, and the thin film can be attached to the substrate without wrinkles or the like. can be pasted, so poor pasting can be prevented.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of a thin film pasting device according to an embodiment of the present invention, FIG. 2 is an enlarged diagram of the main part of FIG. 1, and FIG. FIG. 4 is a partial cross-sectional perspective view of the vacuum plate; FIG. 4 is a schematic plan view seen from the direction of the arrow {circle around (2)} in FIG. 2; 5 is a cross-sectional view of the main parts taken along the line V-■ in FIG. 4; FIG. 6 is a perspective view of the main parts of the thermocompression roller and substrate guide member shown in FIGS. 1 and 2; FIG. 7 is a perspective view of essential parts of the thin film correction device and thin film protrusion device shown in FIGS. 1 and 2. FIG. In the figure, IB...Laminated body (thin film), 2... Supply roller, 6... Main vacuum plate (thin film supply member)
, 6D...Temporary attachment member, 7...Supporting member, 7A, 9A
. . . Drive source, 8 . , 11...Thermocompression bonding roller, 12...t@green substrate, 13...Rotating vacuum plate (rotating suction member), 14.15...Transporting device, 14A, 14B, 15A
, 15B... Conveyance roller, 16... Thin film correction device,
17... Thin film protrusion device, 18... Substrate guide member.

Claims (13)

[Claims] (1) In a thin film attachment device that cuts a continuous thin film into predetermined dimensions and attaches the cut thin film to a substrate,
A thin film supply member that supplies the continuous thin film to the substrate, a temporary attachment member that temporarily attaches the tip of the thin film in the supply direction supplied by the thin film supply member to the substrate, and a support member that approaches and moves away from the substrate. A thin film straightening device is provided on the apparatus main body through the tacking member and corrects the tip of the thin film in the feeding direction in a direction in which it comes into close contact with the tacking member, and is provided on the apparatus main body or the supporting member near the moving path of the tacking member. A thin film pasting device characterized by: (2) The thin film supplying member is provided with a plurality of suction holes for adsorbing the thin film, and the temporary attachment member is configured integrally with the thin film supplying member and has an arc shape. A device for applying a thin film according to claim 1. (3) The thin film straightening device includes a fluid transport pipe provided extending in a width direction substantially perpendicular to the supply direction of the continuous thin film, and a plurality of thin films provided in the fluid transport pipe. 2. The thin film application device according to claim 1, further comprising a fluid spray hole for spraying fluid in a straightening direction. (4) The thin film straightening device is comprised of a plurality of fluid spray nozzles that spray fluid in a direction to straighten the thin film, which are provided in a width direction substantially perpendicular to the supply direction of the continuous thin film. A device for applying a thin film according to claim 1. (5) The thin film straightening device includes a suction tube extending in a width direction substantially perpendicular to the supply direction of the continuous thin film, and a plurality of thin films provided in the suction tube for straightening the thin films. The thin film application device according to claim 1, characterized in that the device comprises a suction hole for suctioning in a direction. (6) The thin film applying device according to claim 1, wherein the thin film straightening device is comprised of a protruding member that projects in the direction of straightening the thin film. (7) A thin film attachment device that cuts a continuous thin film into predetermined dimensions and attaches the cut thin film to a substrate,
A thin film supply member that supplies the continuous thin film to the substrate, a temporary attachment member that temporarily attaches the tip of the thin film in the supply direction supplied by the thin film supply member to the substrate, and a support member that approaches and moves away from the substrate. A pressure roller is provided at a predetermined part of the apparatus main body, and after the pressure roller starts applying the thin film to the substrate, A thin film supplying speed of the thin film supplying member is made faster than a thin film applying speed of the pressure roller, and a thin film slack forming means is provided to provide slack at the rear end of the thin film, and the leading end in the supplying direction is closely attached to the temporary attachment member. A thin film straightening device for straightening the thin film in a direction in which the thin film is straightened is provided on the apparatus main body or the supporting member near the moving path of the temporary attachment member, and the slack portion of the thin film formed by the thin film slack forming means is brought into close contact with the pressure roller. 1. A thin film sticking device, characterized in that a thin film projecting device for projecting the thin film in a direction in which the temporary bonding member is moved is provided on the main body of the device or in the support member near the moving path of the temporary bonding member. (8) The thin film supplying member is provided with a plurality of suction holes for adsorbing the thin film, and the temporary attachment member is configured integrally with the thin film supplying member and has an arc shape. A device for applying a thin film according to claim 7. (9) The pressure roller is provided with a rotary suction member that rotates in accordance with the rotation of the pressure roller and suctions the rear end of the thin film, and the thin film ejection device is connected to the thin film supply member and the rotary suction member. 8. The thin film application device according to claim 7, wherein the device is configured to spray a fluid onto the thin film between the two. (10) The thin film straightening device or the thin film protruding device includes a fluid conveyance pipe extending in a width direction substantially perpendicular to the supply direction of the continuous thin film, and a plurality of fluid conveyance pipes provided in the fluid conveyance pipe. The thin film application device according to claim 7, further comprising a fluid spray hole for spraying fluid in a direction to straighten or protrude the thin film. (11) The thin film straightening device or the thin film protruding device is a plurality of fluid spray nozzles that are provided in a width direction substantially perpendicular to the supply direction of the continuous thin film and spray fluid in a direction to straighten or protrude the thin film. 8. The thin film application device according to claim 7, characterized in that the device comprises: (12) The thin film correction device or the thin film protrusion device includes a suction tube extending in a width direction substantially perpendicular to the supply direction of the continuous thin film, and a plurality of suction tubes provided in the suction tube. 8. The thin film applying device according to claim 7, further comprising a suction hole that sucks the thin film in a direction to straighten or protrude the thin film. (13) The thin film adhesion device according to claim 7, wherein the thin film correction device or the thin film protrusion device is constituted by a protruding member that corrects or protrudes the thin film.