JPS62257743A - Probing card for inspection device for integrated circuit - Google Patents

Abstract

PURPOSE:To apply uniform pressure to a probe through a insulator having fluidity, and to prevent the damage of a terminal section for a wafer by moving the probe and detecting the state of the contact of the probe and the wafer. CONSTITUTION:A cylinder section 1a filled with a viscous insulator 4 is shaped to a probe card main body 1, and a pressing plating 6 is inserted slidably into the cylinder section 1a. A plurality of small-diametral cylinder sections 1b are formed in response to each probe 2 in the bottom of the cylinder section 1a, guides 3 for two probing cards penetrating toward the lower sections of respective small-diametral cylinder section 1b are shaped, guide bars for support plates 2a slidably inserted into the small-diametral cylinder sections 1b are penetrated into the guides 3 and projected to the outside, and the base sections of the probes 2 are fitted to the projecting sections. Contact detecting sections 7 detecting contacts with a wafer 8 of the probes 2 are set up to the bottoms of the small-diametral cylinder sections 1b, and pressure sensors 5 detecting pressure applied to the probes 2 through the insulator 4 are fitted to the bottoms of the cylinder sections 1a, thus preventing the damage of a terminal section for the wafer.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a probing card installed in an integrated circuit testing device.

[Conventional technology]

In the conventional probing card, as shown in FIG. 3, the base of the probe 8 is attached to the probing card body 7 by soldering or the like, and the central part of the probe 8 is fixed to the support stand 9. The probe 8 and the wafer 10 are attached to an integrated circuit testing device, and the probe 8 and the wafer 10 come into contact with each other as the wafer stage 11 moves up and down, and signals from the integrated circuit testing device are transmitted to the circuit formed on the wafer, and the wafer 10 is It is used to receive signals from.

[Problem that the invention seeks to solve]

As explained above, since conventional probing cards make electrical connections through contact with the probe fixed to the card body, contact may be interrupted due to partial deformation of the probe or inclination when the probing card is installed. If it becomes perfect, it has drawbacks such as determining good integrated circuits as defective.

In order to prevent this, it is necessary to check the needle marks on the wafer after inspection, which makes the work complicated. Particularly in recent years, the number of terminals in integrated circuits has increased to over 200, and as the number of probes increases, problems in contact checks have become more of a problem.

Also, the probing card body may be installed at an angle,
Warpage of the wafer causes a difference in contact pressure between each probe,
When making contact with all the terminals, the contact pressure on some terminals becomes large, which has the disadvantage of damaging the terminals.

An object of the present invention is to provide a probing card that uniformizes the pressure applied to the probe and eliminates poor contact with the wafer, damage to the terminal portion of the wafer, etc.

[Means for solving problems]

The present invention includes a plurality of probes that appear and disappear while being guided by a guide provided in the main body of a probing card for integrated circuit testing equipment, and an insulator that has fluidity on the plurality of probes along the direction of movement of the probes. This is a probing card for an integrated circuit testing device, characterized in that it has a pressure mechanism that applies pressure via a pressure mechanism.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

As shown in FIGS. 1 and 2, the probing card body 1 is provided with a cylinder portion 1a filled with a viscous insulator 4 such as paraffin, and the pressure plate 6 is slidable into the cylinder portion la. insert.

A plurality of small diameter cylinder parts 1b and lb are provided at the bottom of the cylinder part 1a corresponding to each probe 2, and two guide holes 3 are provided at the bottom of each small diameter cylinder 1b to penetrate downward.
, 3 are provided, and the guide rod 2b of the support plate 2a slidably inserted into the small diameter cylinder portion 1b is made to penetrate through the guide hole 3°3 liquid-tightly and protrude to the outside, and the base of the probe 2 is attached to the protruding end. be installed in one piece. Further, a contact detection section 7 for detecting contact of the probe 2 with the wafer 8 is installed at the bottom of the small diameter cylinder section 1b. On the other hand, a pressure sensor 5 is installed at the bottom of the cylinder portion 1a to detect the pressure applied to the probe 2 via an insulator 4.

Next, the present invention will be explained in detail with reference to FIG.

When the probe card attached to the integrated circuit testing device gradually descends and comes into contact with the wafer 8, the probe 2 that was in contact with the contact detection section 7 is lifted up.

Thereby, for example, by outputting the signal line of the contact detection section 7 to the outside, it becomes possible to monitor the contact states between all deep needles and the wafer.

Next, the probe in contact with the wafer will lift up differently if, for example, the probing card body is installed at an angle or the wafer is warped. At this time, since the insulator has fluidity, it moves to fill in the unevenness caused by the lifting of the probe.

Thereafter, the pressure plate 6 is lowered to apply pressure to the probe 2 via the insulator 4. At this time, since the upper part of the insulator 4 is uniform, pressure is applied evenly to the insulator 4, and as a result, the probe 2 is also evenly pressurized.

In addition, in order to control the contact pressure between the probe 2 and the wafer 8, a pressure sensor 5 is installed facing the insulator 4.
Monitor the output of the pressure sensor.

It is easy to control the pressure by moving the pressure plate 6.

Although the cylinder portion 1a is filled with an insulator 4 such as paraffin, a fluid such as pure water may be used as the insulator while insulating it from the support plate 2a.

〔Effect of the invention〕

As explained above, the present invention can detect the contact state between the probe and the wafer by moving the probe.
In addition, by applying pressure to the probe via a fluid insulator, it is possible to apply uniform pressure to the probe, which has the effect of eliminating the possibility of part of the wafer's terminal being damaged. It has the following.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view explaining the operation, and FIG. 3 is a configuration diagram showing a conventional example.

Claims (1)

[Claims] (1) Multiple probes that appear and disappear while being guided by a guide provided inside the main body of a probing card for integrated circuit testing equipment, and fluid insulation for multiple probes along the direction of probe movement. 1. A probing card for an integrated circuit testing device, comprising a pressure mechanism that applies pressure through the body.