JPS62252147A - Semiconductor wafer transferring device - Google Patents

Semiconductor wafer transferring device

Info

Publication number
JPS62252147A
JPS62252147A JP9451186A JP9451186A JPS62252147A JP S62252147 A JPS62252147 A JP S62252147A JP 9451186 A JP9451186 A JP 9451186A JP 9451186 A JP9451186 A JP 9451186A JP S62252147 A JPS62252147 A JP S62252147A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
wafer
surface
attracting
plate
dusts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9451186A
Inventor
Ryokichi Kaji
Hideaki Kanbara
Toshiaki Kobari
Shinjiro Ueda
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To prevent dusts from being adhered to the surface of a semiconductor wafer by injecting gas stream from a nozzle along the surface of the wafer simultaneously at the time of attracting and holding the wafer.
CONSTITUTION: An attracting plate 1 is opposed to the rear surface of a semiconductor wafer 5 to be supported and steadily inserted. The attracting surface of the plate 1 has many pores. A switch 6 is turned ON in the vicinity that the top of a nozzle base 3 is inserted into the vicinity of the top of the wafer 5 to evacuate a pipe 2 in negative pressure, compressed air is fed from the pipe 4, the plate 1 attracts the wafer 5, and air is diffused along the surface of the wafer from many nozzle holes formed at the base 3. The air diffusing can protect a semiconductor against dusts floating in the space, and dusts already adhered can be blown away to reduce improper semiconductors.
COPYRIGHT: (C)1987,JPO&Japio
JP9451186A 1986-04-25 1986-04-25 Semiconductor wafer transferring device Pending JPS62252147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9451186A JPS62252147A (en) 1986-04-25 1986-04-25 Semiconductor wafer transferring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9451186A JPS62252147A (en) 1986-04-25 1986-04-25 Semiconductor wafer transferring device

Publications (1)

Publication Number Publication Date
JPS62252147A true true JPS62252147A (en) 1987-11-02

Family

ID=14112344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9451186A Pending JPS62252147A (en) 1986-04-25 1986-04-25 Semiconductor wafer transferring device

Country Status (1)

Country Link
JP (1) JPS62252147A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6431184B1 (en) 1997-08-05 2002-08-13 Tokyo Electron Limited Apparatus and method for washing substrate
US6454517B1 (en) * 1998-12-25 2002-09-24 Disco Corporation Wafer carrier device
US6474712B1 (en) * 1999-05-15 2002-11-05 Applied Materials, Inc. Gripper for supporting substrate in a vertical orientation
US6558476B2 (en) 1998-11-03 2003-05-06 Tokyo Electron Limited Substrate processing method

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6431184B1 (en) 1997-08-05 2002-08-13 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6276378B1 (en) 1997-08-18 2001-08-21 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6558476B2 (en) 1998-11-03 2003-05-06 Tokyo Electron Limited Substrate processing method
US6454517B1 (en) * 1998-12-25 2002-09-24 Disco Corporation Wafer carrier device
US6474712B1 (en) * 1999-05-15 2002-11-05 Applied Materials, Inc. Gripper for supporting substrate in a vertical orientation

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