JPS62250971A - 基体の所定，所望区域からのパラ―キシリレン系樹脂被膜の除去方法 - Google Patents
基体の所定，所望区域からのパラ―キシリレン系樹脂被膜の除去方法Info
- Publication number
- JPS62250971A JPS62250971A JP62057011A JP5701187A JPS62250971A JP S62250971 A JPS62250971 A JP S62250971A JP 62057011 A JP62057011 A JP 62057011A JP 5701187 A JP5701187 A JP 5701187A JP S62250971 A JPS62250971 A JP S62250971A
- Authority
- JP
- Japan
- Prior art keywords
- coating
- tetrahydrofuran
- substance
- area
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 34
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 title claims 3
- 239000011347 resin Substances 0.000 title claims 2
- 229920005989 resin Polymers 0.000 title claims 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 74
- 238000000576 coating method Methods 0.000 claims description 65
- 239000011248 coating agent Substances 0.000 claims description 51
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000008119 colloidal silica Substances 0.000 claims description 3
- 229920000052 poly(p-xylylene) Polymers 0.000 description 23
- 239000002131 composite material Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000004641 Diallyl-phthalate Substances 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 125000006839 xylylene group Chemical group 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002562 thickening agent Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- 239000004243 E-number Substances 0.000 description 1
- 235000019227 E-number Nutrition 0.000 description 1
- 241000237502 Ostreidae Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 235000020636 oyster Nutrition 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Paints Or Removers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/840,286 US4734300A (en) | 1986-03-14 | 1986-03-14 | Methods for removing parylene coatings from predetermined, desired areas of a substrate |
| US840286 | 1986-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62250971A true JPS62250971A (ja) | 1987-10-31 |
| JPH03112B2 JPH03112B2 (enExample) | 1991-01-07 |
Family
ID=25281945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62057011A Granted JPS62250971A (ja) | 1986-03-14 | 1987-03-13 | 基体の所定，所望区域からのパラ―キシリレン系樹脂被膜の除去方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4734300A (enExample) |
| JP (1) | JPS62250971A (enExample) |
| DK (1) | DK127687A (enExample) |
| ES (1) | ES2004037A6 (enExample) |
| IL (1) | IL80919A (enExample) |
| TR (1) | TR24155A (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4946549A (en) * | 1989-10-27 | 1990-08-07 | At&T Bell Laboratories | Method for fabricating or modifying an article comprising the removal of a polymer coating |
| FR2709494A1 (fr) * | 1993-08-31 | 1995-03-10 | Shehadeh Gabriel | Nettoyant des outils de la mousse Polyuréthane (expansive) solide. |
| WO2002096389A1 (en) * | 2001-05-30 | 2002-12-05 | Microchips, Inc. | Conformal coated microchip reservoir devices |
| AU2002361545B2 (en) * | 2001-06-28 | 2007-03-15 | Microchips, Inc. | Methods for hermetically sealing microchip reservoir devices |
| US7179283B2 (en) * | 2001-11-02 | 2007-02-20 | Scimed Life Systems, Inc. | Vapor deposition process for producing a stent-graft and a stent-graft produced therefrom |
| US7413846B2 (en) * | 2004-11-15 | 2008-08-19 | Microchips, Inc. | Fabrication methods and structures for micro-reservoir devices |
| US7790493B2 (en) * | 2005-05-25 | 2010-09-07 | The Regents Of The University Of Michigan | Wafer-level, polymer-based encapsulation for microstructure devices |
| US8623071B2 (en) * | 2008-01-07 | 2014-01-07 | DePuy Synthes Products, LLC | Radiopaque super-elastic intravascular stent |
| US9728889B2 (en) * | 2015-08-04 | 2017-08-08 | Goodrich Corporation | Circuit card |
| WO2020142273A1 (en) * | 2018-12-31 | 2020-07-09 | Fourth Principle, Llc | Compositions and methods for removing coatings from surfaces |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3625763A (en) * | 1968-12-04 | 1971-12-07 | Bunker Ramo | Conformal coating stripping method and composition |
| US3705857A (en) * | 1971-01-25 | 1972-12-12 | Olin Corp | Composition and method for stripping polyvinyl butyral primed coatings |
| US3840387A (en) * | 1973-05-01 | 1974-10-08 | Union Carbide Corp | Masking process by thermal repelling of coating |
| US4116715A (en) * | 1977-07-18 | 1978-09-26 | Smiggen Frank J | Method for removing photopolymers from metal substrates |
-
1986
- 1986-03-14 US US06/840,286 patent/US4734300A/en not_active Expired - Lifetime
- 1986-12-09 IL IL80919A patent/IL80919A/xx not_active IP Right Cessation
-
1987
- 1987-01-02 ES ES8700007A patent/ES2004037A6/es not_active Expired
- 1987-03-11 TR TR87/0172A patent/TR24155A/xx unknown
- 1987-03-12 DK DK127687A patent/DK127687A/da not_active Application Discontinuation
- 1987-03-13 JP JP62057011A patent/JPS62250971A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| US4734300A (en) | 1988-03-29 |
| DK127687D0 (da) | 1987-03-12 |
| IL80919A (en) | 1990-08-31 |
| JPH03112B2 (enExample) | 1991-01-07 |
| DK127687A (da) | 1987-09-15 |
| IL80919A0 (en) | 1987-03-31 |
| TR24155A (tr) | 1991-04-25 |
| ES2004037A6 (es) | 1988-12-01 |
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