JPS62250136A - Cu合金製端子 - Google Patents
Cu合金製端子Info
- Publication number
- JPS62250136A JPS62250136A JP9420386A JP9420386A JPS62250136A JP S62250136 A JPS62250136 A JP S62250136A JP 9420386 A JP9420386 A JP 9420386A JP 9420386 A JP9420386 A JP 9420386A JP S62250136 A JPS62250136 A JP S62250136A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- conductivity
- terminal
- content
- thermal creep
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9420386A JPS62250136A (ja) | 1986-04-23 | 1986-04-23 | Cu合金製端子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9420386A JPS62250136A (ja) | 1986-04-23 | 1986-04-23 | Cu合金製端子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62250136A true JPS62250136A (ja) | 1987-10-31 |
JPH0379417B2 JPH0379417B2 (enrdf_load_stackoverflow) | 1991-12-18 |
Family
ID=14103743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9420386A Granted JPS62250136A (ja) | 1986-04-23 | 1986-04-23 | Cu合金製端子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62250136A (enrdf_load_stackoverflow) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6452034A (en) * | 1987-08-19 | 1989-02-28 | Mitsubishi Electric Corp | Copper alloy for terminal and connector |
JP2012251226A (ja) * | 2011-06-06 | 2012-12-20 | Mitsubishi Materials Corp | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
CN103890205A (zh) * | 2011-11-14 | 2014-06-25 | 三菱综合材料株式会社 | 铜合金以及铜合金塑性加工材 |
US9587299B2 (en) | 2011-10-28 | 2017-03-07 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
US10032536B2 (en) | 2010-05-14 | 2018-07-24 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62116742A (ja) * | 1985-11-14 | 1987-05-28 | Furukawa Electric Co Ltd:The | 高可撓性導電用銅合金 |
JPS62247039A (ja) * | 1985-12-16 | 1987-10-28 | Furukawa Electric Co Ltd:The | 電子機器用銅合金 |
-
1986
- 1986-04-23 JP JP9420386A patent/JPS62250136A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62116742A (ja) * | 1985-11-14 | 1987-05-28 | Furukawa Electric Co Ltd:The | 高可撓性導電用銅合金 |
JPS62247039A (ja) * | 1985-12-16 | 1987-10-28 | Furukawa Electric Co Ltd:The | 電子機器用銅合金 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6452034A (en) * | 1987-08-19 | 1989-02-28 | Mitsubishi Electric Corp | Copper alloy for terminal and connector |
US10032536B2 (en) | 2010-05-14 | 2018-07-24 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
US10056165B2 (en) | 2010-05-14 | 2018-08-21 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
JP2012251226A (ja) * | 2011-06-06 | 2012-12-20 | Mitsubishi Materials Corp | 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材 |
US9587299B2 (en) | 2011-10-28 | 2017-03-07 | Mitsubishi Materials Corporation | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
US10153063B2 (en) | 2011-11-07 | 2018-12-11 | Mitsubishi Materials Corporation | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
CN103890205A (zh) * | 2011-11-14 | 2014-06-25 | 三菱综合材料株式会社 | 铜合金以及铜合金塑性加工材 |
US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
Also Published As
Publication number | Publication date |
---|---|
JPH0379417B2 (enrdf_load_stackoverflow) | 1991-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |