JPS6224887Y2 - - Google Patents
Info
- Publication number
- JPS6224887Y2 JPS6224887Y2 JP1979051716U JP5171679U JPS6224887Y2 JP S6224887 Y2 JPS6224887 Y2 JP S6224887Y2 JP 1979051716 U JP1979051716 U JP 1979051716U JP 5171679 U JP5171679 U JP 5171679U JP S6224887 Y2 JPS6224887 Y2 JP S6224887Y2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- film
- conductive
- lead
- semiconductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 claims description 23
- 239000010409 thin film Substances 0.000 claims description 22
- 229920001971 elastomer Polymers 0.000 claims description 5
- 239000005060 rubber Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 description 15
- 238000005260 corrosion Methods 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 239000004744 fabric Substances 0.000 description 6
- 239000004952 Polyamide Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000006229 carbon black Substances 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCPYTNCQOSFKGG-UHFFFAOYSA-N 1-chlorobuta-1,3-diene Chemical compound ClC=CC=C PCPYTNCQOSFKGG-UHFFFAOYSA-N 0.000 description 1
- UPZFLZYXYGBAPL-UHFFFAOYSA-N 2-ethyl-2-methyl-1,3-dioxolane Chemical compound CCC1(C)OCCO1 UPZFLZYXYGBAPL-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920012485 Plasticized Polyvinyl chloride Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 229920001179 medium density polyethylene Polymers 0.000 description 1
- 239000004701 medium-density polyethylene Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Description
本考案は電気ケーブルに、耐薬品性の他防水
性、防湿性を付与することができる可撓性に優れ
た電気ケーブル用薄葉体に関するものである。
従来、絶縁体層をゴム或いはプラスチツク材を
もつて構成した電気ケーブルでは、電位傾度を緩
和するために導体上及び絶縁体上に半導電層を設
けている。
この半導電層としては、本来の目的である電界
緩和に適した導電性を有していることが第一に要
求されるが、その他、強度、可撓性等の一般特性
においても充分なる性能を有していることが必要
となる。
さらに、最近、電気ケーブルが、過酷な環境下
で使用されることが多くなつてきており、そのた
め電気ケーブルに使用する半導電層に防水性、防
湿性、耐薬品性が要求されるようになつてきてい
る。
従来防水性、防湿性、耐薬品性、可撓性に優れ
た半導電性合成樹脂フイルム等の薄葉体を得るに
は、下記の如き理由から困難であつた。
(1) 熱可塑性樹脂に導電性カーボンを配合するこ
とにより半導電性組成物となることは公知であ
るが、これらの導電性カーボンを用いて100〜
104Ω−cmといつた体積抵抗率を有する半導電
性組成物をうるには、該樹脂100重量部に対し
て80〜150重量部の如く多量のカーボンを配合
しなければならず、このように多量のカーボン
を配合した半導電性組成物を、例えばフイル
ム、テープの如く薄葉体に加工して得られた薄
葉体は機械的特性例えば引張強度、低温脆性、
可撓性が著しく劣り実用に供し得ないものであ
つた。
(2) 熱可塑性樹脂は、そのもの自体遮水性、耐薬
品性に優れているが、特殊な薬品や環境の厳し
いところでは長期に亘る水や薬品の遮蔽機能が
衰えて防水、防湿、耐薬品性等の機能が喪失す
るものである。
また熱可塑性樹脂を布体にし、導電性混和物
を塗着せしめた場合、防水、防湿、耐薬品性等
は若干改善されるものの、本考案の目的とする
完全な防水、防湿、耐薬品性能を得ることは困
難であつた。
本考案はかかる欠点を改善せんとして鋭意研究
を行つた結果、特に耐薬品性に優れた導電性薄葉
体を見出したものである。
即ち、本考案は鉛フイルムの片面又は両面に、
ゴム、又はプラスチツクを基材とした可撓性を有
する半導電性薄葉体を貼着せしめたものである。
そして好ましくは、電気ケーブルの電位傾度を緩
和するために、厚さ方向の体積抵抗率を100〜104
Ω−cmにすることである。尚、体積抵抗率が100
Ω−cm未満の場合は、可撓性が著しく低下し、所
望の強度を有する薄葉体を得ることが困難とな
り、体積抵抗率104Ω−cmを超えて、電気ケーブ
ル用半導電層に適用した場合、ケーブルのtanδ
や部分放電といつた劣化の原因を生じ易くなり、
好ましくない。
本考案において半導電性薄葉体の厚さは0.05〜
3mm程度のもので、これは基材として低、中、高
密度ポリエチレン、ポリプロピレン、ポリアミ
ド、ポリブデン−1、ポリメチルペンテン、エチ
レンプロピレン共重合体、アイオノマー、エチレ
ン−エチルアクリレート共重合体、エチレン−酢
酸ビニル−塩化ビニルグラフト共重合体、塩素化
ポリエチレン、クロロスルホン化ポリエチレン、
可塑化ポリ塩化ビニル、ABS樹脂、酢酸ビニル
樹脂、アクリル樹脂、天然ゴム、ブタヂエンゴ
ム、イソプレンゴム、クロロプレンゴム、アクリ
ルニトリル−ブタジエンゴム、スチレン−ブタジ
エンゴム、等のプラスチツク或いはゴム弾性体を
使用し、これらの基材にカーボンブラツクを混和
せしめて体積抵抗率が100〜104Ω−cmの範囲の半
導電性とした混和物をフイルム化したもの、或は
これらの材質による繊維状物質、例えば布体に導
電性混和物を塗着せしめたりしてつくられる。な
おこのカーボンブラツクとしては、特に限定する
ものでなく、例えばオランダ国アクゾ社製のケツ
チエンブラツクEC(商品名)等の導電性カーボ
ンを使用することが好ましい。なおこの場合の半
導電性薄葉体の体積抵抗率は通常100〜104Ω−cm
を有するものである。
又、この薄葉体基材に鉛フイルムを貼着するも
のであるが特に鉛フイルムに限定した理由は例え
ばアルミ、銅、ステンレスに比し鉛は遮水性、耐
薬品性に優れていると共に、鉛はケーブルコアの
如く断面丸形状の外面によくなじみ、該面に微細
な凹凸があるとしてもこれによく追従して密着す
ることができる、これに対してアルミニウム、ス
テンレスでは水分存在下において半導電性組成物
中の導電性カーボンブラツクと接触することによ
り腐食をおこし遮水、耐薬品性の機能を長期に亘
り保持することが出来ないためである。
又上記の鉛フイルムに半導電性薄葉体を貼着せ
しめるには、これら両者をそのまま或は導電性接
着剤を介在せしめ貼着せしめてもよく、前者の場
合には鉛フイルムの表面をエンボス加工を施すこ
とにより容易に半導電性薄葉体を熱ロールで加圧
することによつて密着せしめることが出来る。
次に本考案を図面にもとづき詳細に説明する。
図面に示す如く鉛フイルム(厚さ0.05mm×幅
200mm×長さ500m)1の両面に、ポリアミドの基
布に導電性ブチルゴムを塗着せしめた半導電性薄
葉体(厚さ0.1mm×幅200mm×長さ500m)2を、
イソシアネート系接着剤3で貼り合せたもの(実
施例1)、鉛フイルム(厚さ0.05mm×幅200mm×長
さ500m)の両面に、エチレン−エチルアクリレ
ートコポリマーにケツチエンブラツクECを混和
せしめてなる導電性フイルム(厚さ0.1mm)を熱
ロールにて直接貼り合せて(実施例2)電気ケー
ブル用導電性薄葉体をえた。
なお本考案薄葉体と比較するために上記のポリ
アミドクロスのみ(比較例1)及びアルミニウム
(比較例2)、ステンレスフイルム(比較例3)、
銅フイルム(比較例4)の両面にも前記エチレン
−エチルアクリレートコポリマーにカーボンブラ
ツク(ケツチングブラツクEC)を混和せしめて
なる半導電性フイルム(厚さ0.1mmを貼着して比
較例導電性薄葉体をえた。
而して本考案導電性薄葉体と上記ポリアミドク
ロスのみとの機械的特性並に体積抵抗率を測定し
た結果は第1表に示す通りである。
又これらの導電性薄葉体を夫々50φのアルミニ
ウムパイプ(肉厚1.5mm)に縦沿えし、その両端
に鉛キヤツプを施し且つ該薄葉体同志の合せ目及
びこれと鉛キヤツプとの合せ目はすべてエポキシ
樹脂にて完全に固着密封せしめて耐腐食試験試料
を作製した。
これらの試料を1%NaOH,1%NaCl,1%
H2SO4の中に浸漬し、1時間、100時間、1000時
間と放置した後、これらを取出しAlパイプの腐
食変化を評価した。その結果を防食率%(100−
腐食率%)として第2表に示した。
なお防食率の試験方法は次式により行うための
ものである。
防食率%
=(1−腐食試験前後の重量変化/腐食試験前の重
量)×100
The present invention relates to a thin film material for electrical cables that has excellent flexibility and can provide chemical resistance as well as waterproof and moisture-proof properties to electrical cables. Conventionally, in electric cables in which the insulator layer is made of rubber or plastic material, semiconducting layers are provided on the conductor and the insulator in order to alleviate potential gradients. The first requirement for this semiconducting layer is that it has conductivity suitable for electric field relaxation, which is its original purpose, but it also has sufficient general properties such as strength and flexibility. It is necessary to have the following. Furthermore, recently, electrical cables have been increasingly used in harsh environments, and as a result, semiconducting layers used in electrical cables are required to be waterproof, moisture-proof, and chemical-resistant. It's coming. Conventionally, it has been difficult to obtain thin materials such as semiconductive synthetic resin films that are excellent in waterproofness, moistureproofness, chemical resistance, and flexibility for the following reasons. (1) It is known that a semiconductive composition can be obtained by blending conductive carbon with a thermoplastic resin.
In order to obtain a semiconductive composition having a volume resistivity of 10 4 Ω-cm, a large amount of carbon, such as 80 to 150 parts by weight, must be added to 100 parts by weight of the resin. The thin sheets obtained by processing a semiconductive composition containing a large amount of carbon into thin sheets such as films and tapes have mechanical properties such as tensile strength, low temperature brittleness,
The flexibility was so poor that it could not be put to practical use. (2) Thermoplastic resin itself has excellent water-shielding properties and chemical resistance, but when exposed to special chemicals or in harsh environments, its ability to shield water and chemicals over a long period of time deteriorates, resulting in its waterproof, moisture-proof, and chemical-resistant properties. etc. functions will be lost. Furthermore, if a thermoplastic resin is used as a fabric and coated with a conductive mixture, the waterproof, moisture-proof, chemical-resistant properties, etc. will be slightly improved, but the complete waterproof, moisture-proof, and chemical-resistant properties that are the objective of this invention will not be achieved. It was difficult to obtain. In the present invention, as a result of extensive research aimed at improving these drawbacks, we have discovered a conductive thin film material that has particularly excellent chemical resistance. That is, in the present invention, on one or both sides of the lead film,
A flexible semiconductive thin film made of rubber or plastic is attached.
And preferably, the volume resistivity in the thickness direction is 10 0 to 10 4 to alleviate the potential gradient of the electric cable.
It is to set it to Ω-cm. In addition, the volume resistivity is 10 0
If the volume resistivity is less than 104 Ω-cm, the flexibility will be significantly reduced and it will be difficult to obtain a thin film with the desired strength. If the tanδ of the cable
cause of deterioration such as partial discharge and partial discharge.
Undesirable. In this invention, the thickness of the semiconductive thin film is 0.05~
Approximately 3 mm, the base materials include low, medium, and high density polyethylene, polypropylene, polyamide, polybutene-1, polymethylpentene, ethylene propylene copolymer, ionomer, ethylene-ethyl acrylate copolymer, and ethylene-acetic acid. Vinyl-vinyl chloride graft copolymer, chlorinated polyethylene, chlorosulfonated polyethylene,
Using plastic or rubber elastic bodies such as plasticized polyvinyl chloride, ABS resin, vinyl acetate resin, acrylic resin, natural rubber, butadiene rubber, isoprene rubber, chloroprene rubber, acrylonitrile-butadiene rubber, styrene-butadiene rubber, etc. A film made of a semiconductive mixture with a volume resistivity of 10 0 to 10 4 Ω-cm by mixing carbon black into a base material, or a fibrous material made of these materials, such as cloth. It is made by coating the body with a conductive mixture. Note that the carbon black is not particularly limited, and it is preferable to use conductive carbon such as Ketchen Black EC (trade name) manufactured by Akzo of the Netherlands. In this case, the volume resistivity of the semiconductive thin film is usually 10 0 to 10 4 Ω-cm.
It has the following. In addition, although a lead film is attached to this thin substrate, the reason why we chose to use lead film in particular is that lead has excellent water-shielding properties and chemical resistance compared to aluminum, copper, and stainless steel, as well as lead It adapts well to the outer surface of a round cross-section like a cable core, and even if there are minute irregularities on the surface, it can follow and adhere closely to it. In contrast, aluminum and stainless steel have a semi-conducting property in the presence of moisture. This is because contact with the conductive carbon black in the conductive composition causes corrosion, making it impossible to maintain water-shielding and chemical-resistant functions for a long period of time. In addition, in order to attach the semiconductive thin film to the above-mentioned lead film, both of them may be attached as is or with a conductive adhesive interposed between them. In the former case, the surface of the lead film may be embossed. By applying this, the semiconductive thin film can be easily brought into close contact by pressing with a hot roll. Next, the present invention will be explained in detail based on the drawings. As shown in the drawing, lead film (thickness 0.05mm x width
200 mm x length 500 m) 1, semi-conductive thin film material (thickness 0.1 mm x width 200 mm x length 500 m) 2 made of polyamide base fabric coated with conductive butyl rubber,
A product bonded with isocyanate adhesive 3 (Example 1), consisting of ethylene-ethyl acrylate copolymer mixed with Kettien Black EC on both sides of a lead film (thickness 0.05 mm x width 200 mm x length 500 m). A conductive thin film for an electric cable was obtained by directly bonding a conductive film (thickness: 0.1 mm) using a hot roll (Example 2). For comparison with the thin film of the present invention, the above-mentioned polyamide cloth alone (Comparative Example 1), aluminum (Comparative Example 2), stainless steel film (Comparative Example 3),
On both sides of the copper film (Comparative Example 4), a semiconductive film (0.1 mm thick) made by mixing the ethylene-ethyl acrylate copolymer with carbon black (Ketting Black EC) was pasted to form a comparative conductive thin film. The results of measuring the mechanical properties and volume resistivity of the conductive thin film of the present invention and the above polyamide cloth alone are shown in Table 1. Each is placed vertically on a 50φ aluminum pipe (wall thickness 1.5 mm), with lead caps applied to both ends, and the joints between the thin sheets and the joints between the thin sheets and the lead caps are completely sealed with epoxy resin. Finally, corrosion resistance test samples were prepared. These samples were mixed with 1% NaOH, 1% NaCl, and 1%
After being immersed in H 2 SO 4 and left for 1 hour, 100 hours, and 1000 hours, they were taken out and the corrosion changes of the Al pipes were evaluated. The results are shown as corrosion protection percentage (100−
Corrosion rate (%) is shown in Table 2. The corrosion protection rate test method is based on the following formula. Corrosion protection rate % = (1 - weight change before and after corrosion test / weight before corrosion test) x 100
【表】
上表より明らかの如く鉛フイルムにポリアミド
クロスあるいは半導電性フイルムを貼着すること
により体積抵抗率が下り優れていることを示し
た。[Table] As is clear from the above table, it was shown that the volume resistivity was lowered and the volume resistivity was excellent by attaching polyamide cloth or semiconductive film to the lead film.
【表】【table】
【表】
上表より明らかの如く本考案導電性薄葉体は次
の如き効果を奏するものである。
(1) 導電性カーボンブラツクの配合量を増加せし
めることなく(通常樹脂又はゴム100重量部に
対し、カーボンブラツク30〜70重量部)、貼り
合せた鉛フイルムの優れた導電特性にて体積抵
抗率を下げることが出来る。
(2) 防水、防湿、耐薬品の機能を鉛フイルムによ
つて保持するため長期に亘り安定した優れた遮
水並に耐薬品性を有する。
(3) 鉛フイルムと半導電性薄葉体との貼り合せ構
造によつて導電性カーボンブラツク量が少量で
よくしかも鉛フイルムの厚さを適当に選択する
ことによつて優れた可撓性をうることが出来
る。
(4) 鉛フイルムを使用することにより機械的特性
を著しく向上せしめることが出来る。
以上詳述した如く本考案導電性薄葉体は耐薬品
性その他の性能が優れているため電線、ケーブル
などの絶縁体或は導体の外側あるいは防食層の内
側に耐薬品性の他、防水性、防湿性を有する導電
性遮水層として適用したり或いは電線、ケーブル
の接続部、端末部などの遮水テープ等に適用して
極めて有用なものである。[Table] As is clear from the above table, the conductive thin film of the present invention has the following effects. (1) Without increasing the amount of conductive carbon black (usually 30 to 70 parts by weight of carbon black per 100 parts by weight of resin or rubber), the excellent conductive properties of the bonded lead film can improve the volume resistivity. can be lowered. (2) Since the lead film maintains its waterproof, moisture-proof, and chemical-resistant functions, it has excellent water-proofing and chemical resistance that are stable over a long period of time. (3) Due to the bonded structure of lead film and semiconductive thin film, only a small amount of conductive carbon black is required, and excellent flexibility can be achieved by appropriately selecting the thickness of the lead film. I can do it. (4) Mechanical properties can be significantly improved by using lead film. As detailed above, the conductive thin film of the present invention has excellent chemical resistance and other properties, so it can be used on the outside of insulators or conductors such as electric wires and cables, or on the inside of anti-corrosion layers, as well as being waterproof. It is extremely useful when applied as a conductive water-shielding layer having moisture-proof properties, or as a water-shielding tape for connection parts, terminal parts, etc. of electric wires and cables.
図面は本考案の電気ケーブル用導電性薄葉体の
1例を示す断面図である。
1…鉛フイルム、2,2…半導電性薄葉体、3
…接着剤。
The drawing is a sectional view showing an example of the conductive thin film for electric cables of the present invention. 1... Lead film, 2, 2... Semiconductive thin film, 3
…glue.
Claims (1)
ラスチツクを基材とした可撓性を有する半導電
性薄葉体を貼着せしめてなる電気ケーブル用導
電性薄葉体。 (2) 電気ケーブル用導電性薄葉体の厚さ方向の体
積抵抗率が100Ω−cmから104Ω−cmの範囲にあ
ることを特徴とする実用新案登録請求の範囲第
1項記載の電気ケーブル用導電性薄葉体。[Scope of Claim for Utility Model Registration] (1) A conductive thin film for electric cables made by attaching a flexible semiconductive thin film based on rubber or plastic to one or both sides of a lead film. . (2) A utility model according to claim 1, characterized in that the volume resistivity in the thickness direction of the conductive thin film for electric cables is in the range of 10 0 Ω-cm to 10 4 Ω-cm. Conductive thin film for electrical cables.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979051716U JPS6224887Y2 (en) | 1979-04-18 | 1979-04-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1979051716U JPS6224887Y2 (en) | 1979-04-18 | 1979-04-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55152607U JPS55152607U (en) | 1980-11-04 |
JPS6224887Y2 true JPS6224887Y2 (en) | 1987-06-25 |
Family
ID=28941578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1979051716U Expired JPS6224887Y2 (en) | 1979-04-18 | 1979-04-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6224887Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6210897Y2 (en) * | 1981-06-12 | 1987-03-14 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4957391A (en) * | 1972-10-04 | 1974-06-04 |
-
1979
- 1979-04-18 JP JP1979051716U patent/JPS6224887Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4957391A (en) * | 1972-10-04 | 1974-06-04 |
Also Published As
Publication number | Publication date |
---|---|
JPS55152607U (en) | 1980-11-04 |
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