JPS62248591A - Laser beam machine - Google Patents

Laser beam machine

Info

Publication number
JPS62248591A
JPS62248591A JP61091901A JP9190186A JPS62248591A JP S62248591 A JPS62248591 A JP S62248591A JP 61091901 A JP61091901 A JP 61091901A JP 9190186 A JP9190186 A JP 9190186A JP S62248591 A JPS62248591 A JP S62248591A
Authority
JP
Japan
Prior art keywords
intensity distribution
laser beam
screen
laser
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61091901A
Other languages
Japanese (ja)
Inventor
Hisatsugu Sawai
沢井 寿承
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP61091901A priority Critical patent/JPS62248591A/en
Publication of JPS62248591A publication Critical patent/JPS62248591A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To execute precise processing by providing a beam splitter, extracting part of a laser beam, and determining a laser beam intensity distribution by an image sensor and image signal processor. CONSTITUTION:A splitter 2 and a screen 3 are provided on the optical axis of a condenser lens 1 to conduct the greater part of the incident beam of the laser light onto a surface S to be processed and to conduct part thereof onto the screen 3. Since the distance between the screen 3 and the lens 1 is set equal to the distance between the surface S and the lens 1, the image equal to the irradiation beam on the surface S is obtd. on the screen 3. The laser light intensity distribution proportional to the irradiation light intensity distribution on the surface S is obtd. by the image sensor 5, an A/D converter 6 and the signal processor 7. Processing is executed while the laser light intensity distribution is kept monitored at all times, the precise processing is possible.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明はレーザ加工機に関する。[Detailed description of the invention] <Industrial application field> The present invention relates to a laser processing machine.

〈従来の技術〉 従来のレーザ加工機においては、被加工物表面への照射
光強度分布を測定するためには、例えば合成樹脂等のレ
ーザ光を吸収して溶融、気化する物質を被加工面上に置
き、レーザ光の照射によって生じた孔の深さ等の分布か
ら強度分布を求めていた。
<Conventional technology> In conventional laser processing machines, in order to measure the intensity distribution of irradiated light on the surface of a workpiece, a substance such as synthetic resin that absorbs laser light and melts and vaporizes is placed on the workpiece surface. The intensity distribution was determined from the distribution of the depth of holes created by laser beam irradiation.

〈発明が解決しようとする問題点〉 上述のような強度分布測定法によると、測定に非常に手
間がかかるとともに、瞬間的な強度分布測定が不可能で
あって、強度分布にゆらぎや振動等があってもこれを測
定することはできないという問題があった。更に、加工
面に上述のような物質を置いて測定するため、加工中で
の測定ができないという問題もある。
<Problems to be Solved by the Invention> According to the above-mentioned intensity distribution measurement method, measurement is very time-consuming, and instantaneous intensity distribution measurement is impossible, and the intensity distribution may have fluctuations, vibrations, etc. The problem is that even if there is, it cannot be measured. Furthermore, since the above-mentioned substance is placed on the processed surface for measurement, there is also the problem that measurement cannot be performed during processing.

本発明は上記諸問題点を一挙に解決すべくなされたもの
で、レーザ光の照射強度分布の測定に手間を要さず、瞬
間的な強度分布の測定が可能で、かつ、加工中における
強度分布をも測定することのできるレーザ加工機の提供
を目的としている。
The present invention has been made to solve the above-mentioned problems all at once. It does not require any effort to measure the irradiation intensity distribution of laser light, it is possible to measure the intensity distribution instantaneously, and it is possible to measure the intensity distribution during processing. The purpose of this invention is to provide a laser processing machine that can also measure distribution.

く問題点を解決するための手段〉 本発明の特徴とするところは、実施例図面に対応する第
1図に示すように、集光レンズlを経たレーザビームの
一部を抽出するビームスプリンタ2と、そのビームスプ
リンタ2により抽出されたレーザビームの結像データを
読み取るイメージセンサ5と、そのイメージセンサ5の
出力信号を導入して、集光レンズ1による結像の強度分
布情報を出力する画像信号処理装置7を備えたことにあ
る。
Means for Solving the Problems> As shown in FIG. 1 corresponding to the drawings of the embodiment, the present invention is characterized by a beam splinter 2 that extracts a part of the laser beam that has passed through the condenser lens l. , an image sensor 5 that reads the image data of the laser beam extracted by the beam splinter 2, and an image that outputs the intensity distribution information of the image formed by the condenser lens 1 by introducing the output signal of the image sensor 5. The reason is that the signal processing device 7 is provided.

く作用〉 ビームスプリンタ2により、集光レンズ1を経たレーザ
ビームの一部を抽出してイメージセンサ5上に結像させ
ることにより、イメージセンサ5上には被加工面S上に
照射されるレーザビームと比例したレーザビームが照射
され、この強度分布を測定することにより、被加工面S
上のレーザビームの強度分布を間接的に測定したことに
なる。
Effect> The beam splinter 2 extracts a part of the laser beam that has passed through the condensing lens 1 and forms an image on the image sensor 5, so that the laser beam irradiated onto the surface S to be processed is displayed on the image sensor 5. A laser beam proportional to the beam is irradiated, and by measuring this intensity distribution, the surface to be processed S
This means that the intensity distribution of the above laser beam was indirectly measured.

〈実施例〉 本発明の実施例を、以下、図面に基づいて説明する。<Example> Embodiments of the present invention will be described below based on the drawings.

第1図は本発明実施例の要部構成図である。FIG. 1 is a block diagram of main parts of an embodiment of the present invention.

レーザから出力されたレーザビームは、集光レンズ1に
よって集光され、ビームスプリ7タ2に入射する。ビー
ムスプリッタ2は、その入射ビームの大半を被加工面S
上に導き、一部をスクリーン3上に導く。このスクリー
ン3は、集光レンズlに対して、集光レンズ1と被加工
面S間の光路長に等しい距離を隔てて配設されており、
従って、被加工面S上への照射ビーム分布と等しい像が
このスクリーン3上に結ばれることになる。
A laser beam output from the laser is focused by a condensing lens 1 and enters a beam splitter 2 . The beam splitter 2 directs most of the incident beam to the workpiece surface S.
Lead it up and lead a part onto screen 3. This screen 3 is arranged at a distance equal to the optical path length between the condenser lens 1 and the surface S to be processed with respect to the condenser lens l,
Therefore, an image equal to the irradiation beam distribution on the surface S to be processed is formed on the screen 3.

スクリーン3上に現われた明暗パターンは、次段の結像
レンズ4によって、例えば2次元のイメージセンサ5上
に投影される。イメージセンサ5の出力はA−D変換器
6によってデジタル化され、画像信号処理装置7に取り
込まれる。
The bright and dark pattern appearing on the screen 3 is projected onto, for example, a two-dimensional image sensor 5 by an imaging lens 4 at the next stage. The output of the image sensor 5 is digitized by an A-D converter 6 and taken into an image signal processing device 7.

画像信号処理装置7は、例えばマイクロコンピュータを
主体とする公知の信号処理装置で、イメージセンサ5か
らの撮像信号を一部メモリ内に格納し、イメージセンサ
5に入射された光の強度を2次元座標軸上の分布データ
に解析することができる。
The image signal processing device 7 is a known signal processing device mainly composed of a microcomputer, for example, and stores a part of the imaging signal from the image sensor 5 in a memory, and calculates the intensity of light incident on the image sensor 5 in two dimensions. It can be analyzed into distribution data on the coordinate axes.

以上の本発明実施例によると、レーザビームの照射時に
、常時、集光レンズ1による被加工面S上への照射光強
度分布と比例する強度分布のビームがイメージセンサ5
上に人力されることになり、画像信号処理装置7を動作
させるだけで、被加工面S上へのレーザ光強度分布の瞬
時値を間接的に随時に測定することができる。
According to the above-described embodiment of the present invention, when the laser beam is irradiated, a beam with an intensity distribution proportional to the intensity distribution of the irradiated light onto the surface S to be processed by the condenser lens 1 is always emitted onto the image sensor 5.
By simply operating the image signal processing device 7, the instantaneous value of the laser light intensity distribution on the surface S to be processed can be indirectly measured at any time.

なお、以上の実施例においては、イメージセンサ5上に
レーザビームを結像させるために、スクリーン3および
結像レンズ4を用いた例を示したが、第1図においてス
クリーン3は必ずしも必要ではなく、また、結像系はこ
れに限られることな(、例えば第2図および第3図にそ
れぞれ本発明の他の実施例の要部構成図を示すように、
ビームスプリッタ2の後段にハーフミラ−21を設けて
、スクリーン3からの反射光を結像レンズ4によってイ
メージセンサ5上に結像させることもでき、更には、ビ
ームスプリッタ2の後段に、直接イメージセンサ5を設
けて、集光レンズ1を経たレーザビームを直接イメージ
センサ5上に結像させることもできる。更にまた、以上
の各実施例において、ビームスプリンタ2の透過光で加
工を行い、反射光で強度分布を測定するよう構成し得る
ことは云うまでもない。
In addition, in the above embodiment, an example was shown in which the screen 3 and the imaging lens 4 were used to form an image of the laser beam on the image sensor 5, but the screen 3 is not necessarily necessary in FIG. In addition, the imaging system is not limited to this (for example, as shown in FIGS. 2 and 3, which are diagrams of main parts of other embodiments of the present invention,
It is also possible to provide a half mirror 21 after the beam splitter 2 so that the reflected light from the screen 3 forms an image on the image sensor 5 using the imaging lens 4. 5 may be provided so that the laser beam that has passed through the condenser lens 1 can be directly focused on the image sensor 5. Furthermore, in each of the above embodiments, it goes without saying that the processing can be performed using the transmitted light of the beam splinter 2 and the intensity distribution can be measured using the reflected light.

〈発明の効果〉 以上説明したように、本発明によれば、レーザビームを
被加工面S上に集光させるための集光レンズ1の後段に
ビームスプリッタ2を設けて、この集光レンズlを経た
ビームの一部をイメージセンサ5上に導いて結像させ、
このイメージセンサ5の出力信号から、間接的に被加工
面S上の照射光強度分布を測定し得るよう構成したから
、レーザビームの被加工面S上の照射スポット位置や強
度分布を、容易に短時間で測定することができる。
<Effects of the Invention> As explained above, according to the present invention, the beam splitter 2 is provided after the condenser lens 1 for condensing the laser beam onto the surface S to be processed, and the condenser lens l A part of the beam that has passed through is guided onto the image sensor 5 to form an image,
Since the configuration is such that the irradiation light intensity distribution on the processing surface S can be indirectly measured from the output signal of the image sensor 5, the irradiation spot position and intensity distribution on the processing surface S of the laser beam can be easily determined. Can be measured in a short time.

また、イメージセンサ5の出力をメモリに記憶させるこ
とにより、瞬時的な強度分布の測定が可能となるばかり
でなく、間接的な測定を行うので、被加工物を装着した
状態での測定ができ、更に、加工中においても瞬時に測
定が可能となって、被加工物とレーザ光照射スポットと
の相対的位置の精密測定や、被加工面Sへの照射スポッ
トの変動や、強度分布の経時的変化等に対応して、例え
ばサーボ機構によって補正したり、i報信号を出力する
等、加工の精密化に対処することも可能となった。
In addition, by storing the output of the image sensor 5 in memory, it is not only possible to measure the intensity distribution instantaneously, but also to perform indirect measurement, so measurement can be performed with the workpiece attached. Furthermore, instant measurement is possible even during processing, allowing precise measurement of the relative position between the workpiece and the laser beam irradiation spot, fluctuations in the irradiation spot on the workpiece surface S, and changes in intensity distribution over time. It has also become possible to respond to changes in the precision of processing by, for example, making corrections using a servo mechanism or outputting an i-report signal.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明実施例の要部構成図、第2図および第3
図はそれぞれ本発明の他の実施例の要部構成図である。
Figure 1 is a configuration diagram of main parts of an embodiment of the present invention, Figures 2 and 3.
Each figure is a main part configuration diagram of another embodiment of the present invention.

Claims (1)

【特許請求の範囲】[Claims] レーザからの出力ビームを集光レンズにより被加工物表
面に集光させ、被加工物の加工を行う装置において、上
記集光レンズを経たレーザビームの一部を抽出するビー
ムスプリッタと、そのビームスプリッタにより抽出され
たレーザビームの結像データを読み取るイメージセンサ
と、そのイメージセンサの出力信号を導入して、上記集
光レンズによる結像の強度分布情報を出力する画像信号
処理装置を備えたことを特徴とする、レーザ加工機。
A beam splitter that extracts a part of the laser beam that has passed through the condensing lens, and a beam splitter for extracting a part of the laser beam that has passed through the condensing lens, in a device that processes the workpiece by condensing the output beam from a laser onto the surface of the workpiece using a condensing lens. and an image signal processing device that inputs the output signal of the image sensor and outputs intensity distribution information of the image formed by the condensing lens. Features: Laser processing machine.
JP61091901A 1986-04-21 1986-04-21 Laser beam machine Pending JPS62248591A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61091901A JPS62248591A (en) 1986-04-21 1986-04-21 Laser beam machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61091901A JPS62248591A (en) 1986-04-21 1986-04-21 Laser beam machine

Publications (1)

Publication Number Publication Date
JPS62248591A true JPS62248591A (en) 1987-10-29

Family

ID=14039473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61091901A Pending JPS62248591A (en) 1986-04-21 1986-04-21 Laser beam machine

Country Status (1)

Country Link
JP (1) JPS62248591A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012035276A (en) * 2010-08-04 2012-02-23 Disco Corp Laser beam characteristic control method
JP2013128944A (en) * 2011-12-20 2013-07-04 Disco Corp Laser machining device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012035276A (en) * 2010-08-04 2012-02-23 Disco Corp Laser beam characteristic control method
JP2013128944A (en) * 2011-12-20 2013-07-04 Disco Corp Laser machining device

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