JPS62241352A - Package for ic - Google Patents

Package for ic

Info

Publication number
JPS62241352A
JPS62241352A JP61084720A JP8472086A JPS62241352A JP S62241352 A JPS62241352 A JP S62241352A JP 61084720 A JP61084720 A JP 61084720A JP 8472086 A JP8472086 A JP 8472086A JP S62241352 A JPS62241352 A JP S62241352A
Authority
JP
Japan
Prior art keywords
marks
package
zips
mark
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61084720A
Other languages
Japanese (ja)
Inventor
Mutsumi Kano
加納　睦
Teijiro Otsuki
大槻　貞二郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61084720A priority Critical patent/JPS62241352A/en
Publication of JPS62241352A publication Critical patent/JPS62241352A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To discriminate marks for ZIPs easily from the upper section of a substrate even when the ZIPs are mounted onto the substrate with high density by forming the marks for the ZIPs on the side surface of a main body and a surface except the side surface. CONSTITUTION:Marks 3 are shaped to mark sections 3a in the side surfaces of a main body, and marks 4 are formed to mark sections 4a in surfaces except the side surfaces. Marks having recessed surfaces or projecting surfaces are shaped on the molding of a package by forming the type name or the like of an IC by the projected surfaces or the recessed surfaces in a molding die for an IC package in the marks 4. Accordingly, the marks are shaped not only on the side surfaces of a package body but also on the surfaces except the side surfaces, thus easily discriminating the marks for ZIPs from the upper section of a substrate even when the ZIPs are mounted onto the substrate with high density.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明はプラスチックＺＩＧ　ＺＡＧ　ＩＮＬＩＮＥ
！　ＰＡＣＫＡＧＥ　　（ジグ　ジグ　インライン　パ
ッケージ）型集積回路（以下ＺＩＰと称す）のパッケー
ジに関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to plastic ZIG ZAG INLINE.
! This invention relates to a package for a PACKAGE (zig in-line package) type integrated circuit (hereinafter referred to as ZIP).

板上に高密度に実装した状態を表わした図である。FIG. 3 is a diagram showing a state in which the devices are mounted on a board with high density.

図において、１はＩＣ本体（ＺＩＰ単体）、２はリード
部、３は型名等の識別を行うためのマーり、３ａはマー
ク部５は実装用の基板、６は高密度に実装されたＺＩＰ
である。In the figure, 1 is the IC body (ZIP alone), 2 is the lead part, 3 is the mark for identifying the model name, etc. 3a is the mark part 5 is the board for mounting, 6 is the high-density mounting ZIP
It is.

このような従来のＺＩＰでは型名等の識別を行うための
マークは、ＺＩＰ本体の側面にのみインクにより印刷さ
れていた。In such conventional ZIPs, marks for identifying the model name and the like are printed with ink only on the side surfaces of the ZIP body.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のＺＩＰでは、本体側面にマークがあるために、第
２図のように、基板上にＺＩＰが高密度に実装された場
合は、上部からのマークの識別が非常に困難であるとい
う問題点があった。Conventional ZIPs have marks on the side of the main body, so when ZIPs are densely mounted on a board as shown in Figure 2, it is very difficult to identify the marks from above. was there.

この発明は上記のような問題点を解消するためになされ
たもので、ＺＩＰを高密度に実装した場合でも、マーク
の識別を容易に行うことができるＩＣパッケージを得る
ことを目的とする。This invention was made to solve the above-mentioned problems, and aims to provide an IC package in which marks can be easily identified even when ZIPs are densely mounted.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るＩＣパッケージは、その側面だけでなく
側面以外の面にもマークを形成したものである。The IC package according to the present invention has marks formed not only on its side surfaces but also on surfaces other than the side surfaces.

〔作用〕[Effect]

この発明においては、そのパッケージ本体の側面だけで
なく側面以外の面にもマークを形成したから、ＺＩＰを
高密度に実装した場合にもＺＩＰφマークの識別を容易
にできる。In this invention, since the mark is formed not only on the side surface of the package body but also on surfaces other than the side surface, the ZIPφ mark can be easily identified even when ZIPs are densely mounted.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.

第１図は本発明の一実施例によるＩＣパッケージの外形
を示し、図において、１はＩＣ本体、２はリード部、３
は側面のマーク部３ａに形成されたマーク、４は側面以
外の面のマーク部４ａに形成されたマークである。FIG. 1 shows the external shape of an IC package according to an embodiment of the present invention. In the figure, 1 is an IC main body, 2 is a lead part, and 3
4 is a mark formed on the mark portion 3a on the side surface, and 4 is a mark formed on the mark portion 4a on a surface other than the side surface.

このマーク４は、ＩＣパッケージのモールド金型にＩＣ
の型名等を凸面または凹面で作ることにより、パッケー
ジのモールド時に凹面または凸面のマークが作られる。This mark 4 is placed on the mold of the IC package.
By making the model name etc. on a convex or concave surface, a concave or convex mark is created when the package is molded.

このように本実施例ではマークがパッケージの本体側面
だけでなくそれ以外の面にも形成されているので、ＺＩ
Ｐが基板上に高密度に実装された場合においても基板上
部からＺＩＰのマークを容易に識別できる。In this way, in this example, the mark is formed not only on the side surface of the main body of the package but also on other surfaces, so that the ZI
Even when P is mounted on a board with high density, the ZIP mark can be easily identified from the top of the board.

なお上記実施例では、側面以外のマークをモールド金型
によって作る方法を示したが、これは従来通りのインク
による印刷や、レーザービームによる加工によって行っ
てもよい。In the above embodiment, a method for forming marks other than the side marks using a mold was shown, but this may be done by conventional ink printing or laser beam processing.

〔発明の効果〕〔Effect of the invention〕

以上のように、この発明によれば、ＺＩＰのマークを本
体側面及び該側面以外の面に形成したので、ＺＩＰが基
板上に高密度に実装された場合においても基板上部から
ＺＩＰのマークを容易に識別できるという効果がある。As described above, according to the present invention, the ZIP mark is formed on the side surface of the main body and on surfaces other than the side surface, so even when the ZIP is mounted on the board with high density, the ZIP mark can be easily marked from the top of the board. It has the effect of being able to be identified.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明の一実施例によるＺｒＰの外形図、第
２図は従来のＺＩＰの外形及びＺＩＰを基板上に高密度
に実装した状態を示す図である。 図において、ｌはＩＣ本体、２はリード部、３は本体側
面のマーク、４は本体側面以外の面に作られたマーク、
３ａ、４ａはマーク部である。 なお図中同一符号は同−又は相当部分を示す。FIG. 1 is an outline diagram of ZrP according to an embodiment of the present invention, and FIG. 2 is a diagram showing the outline of a conventional ZIP and a state in which the ZIP is densely mounted on a substrate. In the figure, l is the IC body, 2 is the lead part, 3 is a mark on the side of the main body, 4 is a mark made on a surface other than the side of the main body,
3a and 4a are mark parts. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims] （１）プラスチックジグザグインラインパッケージ型集
積回路のパッケージにおいて、上記パッケージの本体側
面及び該側面以外の面にマークを形成したことを特徴と
するＩＣパッケージ。(1) An IC package of a plastic zigzag in-line package type integrated circuit, characterized in that a mark is formed on a side surface of the package body and on a surface other than the side surface.
JP61084720A 1986-04-11 1986-04-11 Package for ic Pending JPS62241352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61084720A JPS62241352A (en) 1986-04-11 1986-04-11 Package for ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61084720A JPS62241352A (en) 1986-04-11 1986-04-11 Package for ic

Publications (1)

Publication Number Publication Date
JPS62241352A true JPS62241352A (en) 1987-10-22

Family

ID=13838515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61084720A Pending JPS62241352A (en) 1986-04-11 1986-04-11 Package for ic

Country Status (1)

Country Link
JP (1) JPS62241352A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646050U (en) * 1987-06-30 1989-01-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS646050U (en) * 1987-06-30 1989-01-13

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