JPS62240732A - Lead material for semiconductor equipment - Google Patents
Lead material for semiconductor equipmentInfo
- Publication number
- JPS62240732A JPS62240732A JP8529586A JP8529586A JPS62240732A JP S62240732 A JPS62240732 A JP S62240732A JP 8529586 A JP8529586 A JP 8529586A JP 8529586 A JP8529586 A JP 8529586A JP S62240732 A JPS62240732 A JP S62240732A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- copper
- strength
- lead material
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 13
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 239000010949 copper Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 229910052718 tin Inorganic materials 0.000 claims abstract description 9
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 7
- 229910052742 iron Inorganic materials 0.000 claims abstract description 5
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 5
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 239000011701 zinc Substances 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 abstract description 17
- 229910045601 alloy Inorganic materials 0.000 abstract description 16
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 6
- 239000000654 additive Substances 0.000 abstract description 5
- 230000000996 additive effect Effects 0.000 abstract description 5
- 238000005097 cold rolling Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 229910017985 Cu—Zr Inorganic materials 0.000 abstract 2
- 238000005098 hot rolling Methods 0.000 abstract 2
- 230000006866 deterioration Effects 0.000 abstract 1
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 229910001093 Zr alloy Inorganic materials 0.000 description 8
- XTYUEDCPRIMJNG-UHFFFAOYSA-N copper zirconium Chemical class [Cu].[Zr] XTYUEDCPRIMJNG-UHFFFAOYSA-N 0.000 description 7
- 229910000906 Bronze Inorganic materials 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- 239000010974 bronze Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000010354 integration Effects 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ＩＣなど半導体機器のリード材として好適な
銅合金材に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a copper alloy material suitable as a lead material for semiconductor devices such as ICs.
［従来の技術と問題点］
半導体機器用リード材としては、従来４２合金＜Ｆｅ−
Ｎｒ金合金あるいはリン青銅、錫入り銅ざらには無酸素
銅などが使用されている。[Conventional technology and problems] Conventionally, 42 alloy < Fe-
Nr-gold alloy, phosphor bronze, and oxygen-free copper are used for the tin-containing copper colander.
最近になり、半導体回路がざらに高集積化されるにとも
ない、熱放散性の高い材料への要請ならびに低コスト化
への要請が高まり、銅合金を使用する例が急増しつつあ
る。このようなリード材用銅合金として要求される特性
は、熱放散性が高いことすなわち導電率が高いことのほ
かに、耐熱性と適当な強度を保有していることがのぞま
れる。Recently, as semiconductor circuits have become increasingly highly integrated, the demand for materials with high heat dissipation properties and cost reduction has increased, and the use of copper alloys is rapidly increasing. The properties required of such a copper alloy for lead materials include high heat dissipation, that is, high electrical conductivity, as well as heat resistance and appropriate strength.
しかしながら、銅合金の場合には、導電率と耐熱性ある
いは強度の保持とは、なかなか相客れない関係にあり、
熱放散性（これは導電率と比例するものであるが）を優
先せしめようとすると、耐熱性や強度についてはどうし
ても犠牲にせねばならないという関係にめった。However, in the case of copper alloys, there is a difficult relationship between electrical conductivity and heat resistance or strength retention.
If we tried to prioritize heat dissipation (which is proportional to electrical conductivity), we ended up with a relationship where we had to sacrifice heat resistance and strength.
このような銅合金のうちで、リード材として既知の銅−
ジルコニウム合金は、すぐれた導電率とすぐれた耐熱特
性とを有する銅合金として知られているが、この銅−ジ
ルコニウム合金も、４２合金やリン青銅と比較すると、
強度の点ではるかに劣るものであり、高導電性という点
では十分にすぐれているのではあるが、前記合金の代替
材とするには、その強度の上で問題があった。Among these copper alloys, copper known as a lead material
Zirconium alloy is known as a copper alloy with excellent electrical conductivity and excellent heat resistance properties, but this copper-zirconium alloy also has poor performance compared to 42 alloy and phosphor bronze.
It is far inferior in terms of strength, and although it is sufficiently superior in terms of high conductivity, it has problems in terms of strength when used as a substitute for the above alloy.
［発明の目的］
本発明は、上記のような実情にかんがみてなされたもの
であり、高導電性を保持しつつ、耐熱性ヤ強度の点から
も十分な特性を保有し、高集積化に対応可能な半導体機
器用リード材を提供しようとするものである。[Object of the Invention] The present invention has been made in view of the above-mentioned circumstances, and has been developed to maintain high conductivity, have sufficient characteristics in terms of heat resistance and strength, and be suitable for high integration. The purpose is to provide a lead material for semiconductor devices that can be used.
［発明の概要）
すなわち、本発明の要旨とするところは、所定組成の銅
−ジルコニウム合金をベースとし所定組成範囲の錫、シ
リコン、ニッケル、鉄および亜鉛のうちの１種または２
種以上を添加し、それにより導電性に大きな犠牲を与え
ることなく、必要な耐熱性と強度とを保有せしめ得たも
のである。[Summary of the Invention] That is, the gist of the present invention is to provide a copper-zirconium alloy based on a copper-zirconium alloy having a predetermined composition and one or two of tin, silicon, nickel, iron, and zinc within a predetermined composition range.
By adding more than one species, it is possible to maintain the necessary heat resistance and strength without significantly sacrificing conductivity.
［実施例］ 以下に実施例に基いて説明する。[Example] This will be explained below based on examples.
本発明においてベースとなる銅−ジルコニウム合金は、
ジルコニウムの含有量が０．０１〜０．１５％であるこ
とを基本とする。ジルコニウムが０．０１％以下では耐
熱性を向上させる効果がなく、また０、１５％以上では
この合金で通常行なわれる溶体化処理、時効処理を施し
ても強度はほぼ飽和し、いたずらに鋳造性を害する様に
なるため除外される。そして、錫、シリコン、ニッケル
、鉄、亜鉛はいずれも銅の強度を向上させる元素である
が、これらを単体又は複数の添加元素として銅−ジルコ
ニウム合金へ添加することにより、この合金の導電性を
あまり害さずに強度を向上させ得るという新しい知見を
見出したものである。その組成範囲は０．１％以下では
強度上昇の効果はほとんどなく、また２％以上では、強
度はざらに上昇するものの、銅−ジルコニウム合金特有
の導電性を著しく害する様になるため、前記添加元素の
範囲を１種又は２種以上の合計で０．１〜２％の組成範
囲とするものである。つぎに本発明の具体的実施例を比
較例と共に説明する。The base copper-zirconium alloy in the present invention is
Basically, the content of zirconium is 0.01 to 0.15%. If zirconium is less than 0.01%, there is no effect of improving heat resistance, and if it is more than 0.15%, the strength will be almost saturated even if the solution treatment and aging treatment that are usually performed for this alloy are applied, and the castability will be unnecessarily reduced. It is excluded because it will harm the Tin, silicon, nickel, iron, and zinc are all elements that improve the strength of copper, and by adding them alone or as multiple additive elements to a copper-zirconium alloy, the conductivity of this alloy can be improved. This is a new discovery that shows that strength can be improved without causing much damage. If the composition range is 0.1% or less, there is almost no effect of increasing the strength, and if it is 2% or more, the strength increases slightly, but the electrical conductivity peculiar to the copper-zirconium alloy is significantly impaired. The total composition of one or more elements is 0.1 to 2%. Next, specific examples of the present invention will be described together with comparative examples.
高周波溶解炉を用い、不活性雰囲気で無酸素銅を溶解し
、第１表に示したような添加元素をそれぞれ有する銅合
金を鋳造した。これらをそれぞれ、８００℃で熱間圧延
を行い、８ｍ厚の板材とし、表面の面削を行い、２ａｍ
厚に冷間圧延し、中間熱処理を行った後ざらに冷間圧延
と熱処理を繰返し、最終加工度５０％の０．２５順厚板
材とした。特性の評価としては、まず熱伝導率と正の相
関を示す導電率、及び機械的強度として引張強さとビッ
カース硬さ、また耐熱性として５００℃で１０分間加熱
後のビッカース硬さを測定した。第１表に比較合金とと
もにこれらの測定結果を示す。これによって明らかなよ
うに本発明合金は、比較合金３のリン青銅とほぼ同等の
強度を有しながら、すぐれた耐熱性と、３倍以上の導電
率を有していることがわかる。また比較合金１では錫が
２％以上となると導電率が急激に低下することを示し、
比較合金２では、銅−ジルコニウム合金に前記所定の第
３元素を添加しなければ所定の強度が得られないことを
端的に示している。この様に本発明合金においては、リ
ン青銅なみの強度を有しながら、高い導電率を保ってお
り、ＩＣなど電子機器の高集積化にともなう高熱放散性
リード材の要求によく応え得るものであるこがわかる。Oxygen-free copper was melted in an inert atmosphere using a high frequency melting furnace, and copper alloys having the respective additive elements shown in Table 1 were cast. Each of these was hot-rolled at 800°C to form a plate with a thickness of 8m, and the surface was milled to form a 2am
After cold rolling to a thick thickness and performing intermediate heat treatment, the cold rolling and heat treatment were repeated to obtain a 0.25 thick plate material with a final workability of 50%. To evaluate the properties, first, we measured electrical conductivity, which shows a positive correlation with thermal conductivity, tensile strength and Vickers hardness as mechanical strength, and Vickers hardness after heating at 500° C. for 10 minutes as heat resistance. Table 1 shows these measurement results along with comparative alloys. As is clear from this, it can be seen that the alloy of the present invention has almost the same strength as the phosphor bronze of Comparative Alloy 3, but also has excellent heat resistance and electrical conductivity that is three times or more higher. In addition, Comparative Alloy 1 shows that the electrical conductivity decreases rapidly when the tin content exceeds 2%.
Comparative Alloy 2 clearly shows that the desired strength cannot be obtained unless the predetermined third element is added to the copper-zirconium alloy. As described above, the alloy of the present invention has a strength comparable to that of phosphor bronze while maintaining high electrical conductivity, and can well meet the demand for high heat dissipation lead materials accompanying the increasing integration of electronic devices such as ICs. I understand Aruko.
［発明の効果］
以上、本発明に係る銅合金によれば、従来ＩＣなど電子
機器のリード材として使用されてきた高価な４２合金、
リン青銅に対する代替材として十分に使用に耐えるもの
であり、本発明に係る合金を採用することにより、製造
コストを低減できる上に、導電率が高く熱放散性にすぐ
れたリード材であることから、近年ますますＩＣなどの
高集積化が進展しつつあるとき、斯業に及ぼす効用はま
ことに大きいのでおる。[Effects of the Invention] As described above, according to the copper alloy according to the present invention, the expensive 42 alloy, which has been conventionally used as a lead material for electronic devices such as ICs,
It is sufficiently usable as a substitute material for phosphor bronze, and by adopting the alloy according to the present invention, manufacturing costs can be reduced, and it is a lead material with high conductivity and excellent heat dissipation. In recent years, as ICs and other devices have become increasingly highly integrated, the benefits to this industry are truly significant.
Claims (1)
シリコン、ニッケル、鉄および亜鉛のうち１種または２
種以上の合計で０．１〜２．０％含み、残部が本質的に
銅よりなる半導体機器用リード材。(1) Zirconium 0.01-0.15%, plus tin,
One or two of silicon, nickel, iron and zinc
A lead material for semiconductor devices containing a total of 0.1 to 2.0% of copper, with the remainder essentially consisting of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8529586A JPS62240732A (en) | 1986-04-14 | 1986-04-14 | Lead material for semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8529586A JPS62240732A (en) | 1986-04-14 | 1986-04-14 | Lead material for semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62240732A true JPS62240732A (en) | 1987-10-21 |
Family
ID=13854589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8529586A Pending JPS62240732A (en) | 1986-04-14 | 1986-04-14 | Lead material for semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62240732A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5879476A (en) * | 1995-10-12 | 1999-03-09 | Hitachi Cable, Ltd. | Copper alloy having improved corrosion resistance, commutator and motor using the same |
| EP1582602A2 (en) * | 2004-03-29 | 2005-10-05 | Ngk Insulators, Ltd. | Copper alloy and copper alloy manufacturing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5236731A (en) * | 1975-09-17 | 1977-03-22 | Japan Storage Battery Co Ltd | Battery |
| JPS54104597A (en) * | 1978-02-03 | 1979-08-16 | Nippon Mining Co | Copper alloy for lead frame |
| JPS5521530A (en) * | 1978-08-01 | 1980-02-15 | Onahama Smelt & Refining Co Ltd | High tensile copper alloy with superior heat resistance and conductivity |
| JPS5531173A (en) * | 1978-08-28 | 1980-03-05 | Nippon Steel Corp | Ni-saving type nonmagnetic stainless steel for rivet and screw |
| JPS57108235A (en) * | 1980-12-24 | 1982-07-06 | Sumitomo Electric Ind Ltd | Copper alloy for lead frame |
-
1986
- 1986-04-14 JP JP8529586A patent/JPS62240732A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5236731A (en) * | 1975-09-17 | 1977-03-22 | Japan Storage Battery Co Ltd | Battery |
| JPS54104597A (en) * | 1978-02-03 | 1979-08-16 | Nippon Mining Co | Copper alloy for lead frame |
| JPS5521530A (en) * | 1978-08-01 | 1980-02-15 | Onahama Smelt & Refining Co Ltd | High tensile copper alloy with superior heat resistance and conductivity |
| JPS5531173A (en) * | 1978-08-28 | 1980-03-05 | Nippon Steel Corp | Ni-saving type nonmagnetic stainless steel for rivet and screw |
| JPS57108235A (en) * | 1980-12-24 | 1982-07-06 | Sumitomo Electric Ind Ltd | Copper alloy for lead frame |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5879476A (en) * | 1995-10-12 | 1999-03-09 | Hitachi Cable, Ltd. | Copper alloy having improved corrosion resistance, commutator and motor using the same |
| EP1582602A2 (en) * | 2004-03-29 | 2005-10-05 | Ngk Insulators, Ltd. | Copper alloy and copper alloy manufacturing method |
| EP1582602A3 (en) * | 2004-03-29 | 2009-01-21 | Ngk Insulators, Ltd. | Copper alloy and copper alloy manufacturing method |
| US9777348B2 (en) | 2004-03-29 | 2017-10-03 | Akihisa Inoue | Copper alloy and copper alloy manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5834536B2 (en) | Copper alloy for lead material of semiconductor equipment | |
| JP3797882B2 (en) | Copper alloy sheet with excellent bending workability | |
| JPS5834537B2 (en) | High-strength conductive copper alloy with good heat resistance | |
| JPS6160846A (en) | Lead material of copper alloy for semiconductor device | |
| JPS59170231A (en) | High tension conductive copper alloy | |
| JPS6256937B2 (en) | ||
| JPS62240732A (en) | Lead material for semiconductor equipment | |
| JPS594493B2 (en) | Copper alloy for lead material of semiconductor equipment | |
| JP3379380B2 (en) | High strength and high conductivity copper alloy | |
| JPH0356294B2 (en) | ||
| JPS59153853A (en) | Matrial for lead frame | |
| JPS61266540A (en) | Copper alloy | |
| JPS5939492B2 (en) | High strength copper alloy for conductive use with softening resistance | |
| JPS602638A (en) | Softening resistant copper alloy having high conductivity | |
| JPS63192835A (en) | Lead material for ceramic package | |
| JPS58147140A (en) | Lead wire of semiconductor device | |
| JPS60218442A (en) | Copper alloy for lead frame | |
| JPH0219432A (en) | High-strength and high-conductivity copper alloy for semiconductor equipment lead material or conductive spring material | |
| JPS63161135A (en) | Copper alloy for electrical parts | |
| JPS6213823B2 (en) | ||
| JPS5818981B2 (en) | Copper alloy for lead material of semiconductor equipment | |
| JPS6157379B2 (en) | ||
| JPH0218375B2 (en) | ||
| JPS60145343A (en) | Copper alloy for material of lead of semiconductor apparatus | |
| JPH03285035A (en) | High strength copper alloy excellent in migration resistance |