JPS62238723A - Manufacture of disk base - Google Patents

Manufacture of disk base

Info

Publication number
JPS62238723A
JPS62238723A JP8292086A JP8292086A JPS62238723A JP S62238723 A JPS62238723 A JP S62238723A JP 8292086 A JP8292086 A JP 8292086A JP 8292086 A JP8292086 A JP 8292086A JP S62238723 A JPS62238723 A JP S62238723A
Authority
JP
Japan
Prior art keywords
core material
mold
cavity
runner
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8292086A
Other languages
Japanese (ja)
Inventor
Toshihiro Kondo
近藤 俊裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP8292086A priority Critical patent/JPS62238723A/en
Publication of JPS62238723A publication Critical patent/JPS62238723A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065Positioning or centering articles in the mould

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

PURPOSE:To cover both surfaces of a core material with uniform thickness resin layer by preventing deformation of the core material, by a method wherein a positioning protrusion of a mold is inserted into a positioning hole of the disklike core material having a resin circulation hole on the central part and molten resin is charged into a cavity by pressing the core material from both the surfaces. CONSTITUTION:A positioning pin 25 of a stationary mold 11 is inserted into a positioning hole 32 of a core material 30. Sprue 17 is filled with molten resin through an injection machine in a mold clamping state, the molten resin arrives at the central part of a cavity 15, abuts against a bushing 18 and ejector pin 19 through a resin circulation hole 31 of the core material 30 and charged toward the fringe of the cavity 15 through a space among the core material 30 and each of mold surfaces 13a, 14a. Therefore, injection pressure is hardly applied to the surface of the core material 30 and a deformation can be prevented. As both surfaces of the core material 30 are pressed by press pins 26, 28, the core material 30 can maintain a state wherein the same runs parallel with both the mold surfaces 13a, 14a and a resin layer 52 covering both the surfaces of the core material can be made into a uniform thickness extending over the whole surface.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明は、磁気ディスク等の基板を製造する方法に関
する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of manufacturing a substrate such as a magnetic disk.

(従来の技術) 一般に磁気ディスクの基板には、アルミが用いられてい
る。しかし、磁気ディスクの記録面は高精度の平滑性が
要求されるため、アルミの基板では研削研摩に上り鏡面
仕上げする工程が必要であり、生産性が悪かった。
(Prior Art) Aluminum is generally used for the substrate of a magnetic disk. However, since the recording surface of a magnetic disk requires highly precise smoothness, aluminum substrates require a process of grinding and polishing to achieve a mirror finish, resulting in poor productivity.

そこで、樹脂により、磁気ディスク基板を射出成形する
技術が開発されている。楯1脂製の磁気ディスク基板は
、鏡面仕上げされた金型の型面が溶融樹脂に転写される
ことによって平滑性を得るため、研削研摩を必要とせず
高い生産性を実現できる。
Therefore, a technique for injection molding magnetic disk substrates using resin has been developed. The magnetic disk substrate made of Tate 1 resin obtains smoothness by transferring the mirror-finished surface of the mold to the molten resin, so high productivity can be achieved without the need for grinding and polishing.

しかし、この樹脂製の磁気ディスク基板て・は熱変形、
吸湿変形か大とい欠点があった。
However, this resin magnetic disk substrate is subject to thermal deformation.
It had a major drawback, probably due to moisture absorption and deformation.

上記の観点から開発されたのが、特開昭60−1133
24号公報に記載されている技術である。
Developed from the above perspective, Japanese Patent Application Laid-Open No. 60-1133
This is a technique described in Publication No. 24.

この技術は、アルミ等の非磁性金属の芯材をIt脂層で
被覆することにより磁気ディスク基板を得るものである
。このディスク基板は、研削研摩を必要としないため生
産性が高く、しかも、芯材により熱変形、吸湿変形を防
止できるものであり、上述したアルミ製、樹脂製の磁気
ディスク基板の両方の長所を備えている。以下、上記公
報に記載されたディスク基板の製造方法を第6図〜第9
図を参照して説明する。
In this technique, a magnetic disk substrate is obtained by coating a core material of a non-magnetic metal such as aluminum with an It resin layer. This disk substrate has high productivity because it does not require grinding and polishing, and the core material prevents thermal deformation and moisture absorption deformation, so it has the advantages of both the aluminum and resin magnetic disk substrates mentioned above. We are prepared. The method for manufacturing the disk substrate described in the above publication will be described below with reference to FIGS. 6 to 9.
This will be explained with reference to the figures.

ディスク基板の製造に用いられる金型10′は、一対の
円形の金型半体11’、12’ を有している。これら
金型半体1F、12′の互いに対向する面には円形の凹
部13’、14’が形yFi、されている。一方の金型
半体11′には中央から偏った位置に湯道17′が形成
されている。主だ池方の金型半体12′の凹部14′の
中央には、円形をなす凸部100が形成されており、そ
の周囲には4つの固定ピン28′が設けられており、こ
れら固定ビン28′の頂面には位置決めピン25’が設
けられている。
A mold 10' used for manufacturing a disk substrate has a pair of circular mold halves 11' and 12'. Circular recesses 13' and 14' of the shape yFi are formed on mutually opposing surfaces of these mold halves 1F and 12'. A runner 17' is formed in one half of the mold 11' at a position offset from the center. A circular convex part 100 is formed in the center of the concave part 14' of the mold half 12' on the main side, and four fixing pins 28' are provided around the convex part 100. A positioning pin 25' is provided on the top surface of the bottle 28'.

芯材30’は、中央1こ上記凸部100より径が大きい
樹脂流通用の孔31′を有しており、この孔3ビの周囲
に位置決め用の孔32′を有している。
The core material 30' has a resin flow hole 31' having a diameter larger than the first convex portion 100 in the center, and has a positioning hole 32' around this hole 3B.

そして、上記金型半体12′を水平に置いた状態で、芯
材30′の位置決め用の孔32′に位置決めピン25′
を挿入させてこの芯材30′を固定ピン28′の上に載
せる。
Then, with the mold half 12' placed horizontally, the positioning pin 25' is inserted into the positioning hole 32' of the core material 30'.
is inserted and this core material 30' is placed on the fixing pin 28'.

次に、金型半体11′を金型半体12′の上に載せる。Next, the mold half 11' is placed on the mold half 12'.

この状態では金型半体11′の凸部100は金型半体1
2′に当たっている。芯材30’は固定ピン28′と位
置決めビン25′に接しているが、凹部13’ 、14
’により形成されたキャビティの内面から離れている。
In this state, the convex portion 100 of the mold half 11' is
It hits 2'. The core member 30' is in contact with the fixing pin 28' and the positioning pin 25', but the recesses 13', 14
' away from the inner surface of the cavity formed by.

次に、湯道17′からキャビティに溶融樹脂を充填する
。この結果、第7図に示す成形品40′が得られる。こ
の成形品40′は、中央に規格径の孔51′を有した円
盤形状をなし、湯道17′に対応する湯道部42′を有
している。そして、この湯道部42′を切り取って、第
8図に示すディスク基板50′を得る。このディスク基
板50′は、第9図に示すように芯材30’ とこの芯
材30′を被覆する(11脂層52′を有している。
Next, the cavity is filled with molten resin from the runner 17'. As a result, a molded article 40' shown in FIG. 7 is obtained. This molded product 40' has a disk shape with a hole 51' having a standard diameter in the center, and has a runner portion 42' corresponding to the runner 17'. Then, this runner section 42' is cut out to obtain a disk substrate 50' shown in FIG. 8. As shown in FIG. 9, this disk substrate 50' has a core material 30' and a resin layer 52' covering the core material 30'.

(発明が解決しようとする問題点) 上記の技術では、次の欠点がある。すなわち、一方の金
型半体12′の中央に、ディスク基板50′の規格径の
孔51′を得るための凸部100を形成し、二の凸部1
00を池の金型半体11′に当てる構成を採用している
ため、湯道17′をキャビティの中央から偏った位置に
形成せざるを得す、このため、湯道から充填される溶融
樹脂の圧力が芯材30’の面に直接付与され、芯材30
′が変形するおそれがあった。また、上記溶融樹脂が湯
道17′から流入して芯材30’の一面に当たってここ
で広がj)、芯材30′の他面で合流するため、樹脂層
52′の記録領域にウェルドラインが形成される欠点も
あった。
(Problems to be Solved by the Invention) The above technology has the following drawbacks. That is, a protrusion 100 for obtaining a hole 51' having the standard diameter of the disk substrate 50' is formed in the center of one mold half 12', and a protrusion 100 is formed in the center of one mold half 12'.
00 is applied to the mold half body 11' of the pond, the runner 17' must be formed at a position offset from the center of the cavity. The pressure of the resin is applied directly to the surface of the core material 30', and the core material 30
′ could be deformed. In addition, the molten resin flows from the runner 17', hits one surface of the core material 30', spreads here j), and merges on the other surface of the core material 30', so that a weld line is formed in the recording area of the resin layer 52'. It also had the disadvantage that it formed.

また、芯材30’は、位置決め用の孔32′を位置決め
ビン25′に挿入し、固定ピン28′の上に載せるだけ
で支持するため、支持が不安定であり、上記樹脂充填の
際に芯材30’が傾いてしまい、均一厚さの樹脂層52
′を形成できないこともあった。
In addition, since the core material 30' is supported by simply inserting the positioning hole 32' into the positioning pin 25' and placing it on the fixing pin 28', the support is unstable, and when filling with the resin, The core material 30' is tilted and the resin layer 52 has a uniform thickness.
′ could not be formed in some cases.

さらに、成形時に固定ピン28′が芯材30′に当たる
ために、第7図に示す成形品40’の下面(湯道部42
′とは反対側の面)には、樹脂層52′が形成されず芯
材30’が露出している部分があり、記録面の領域を狭
める欠点があった。また、湯道部42′を切り取った後
を高精度に平坦にすることが困難であり、この部位も記
録面とすることができなかった。また、これら痕跡によ
り外観が悪かった。
Furthermore, since the fixing pin 28' comes into contact with the core material 30' during molding, the lower surface of the molded product 40' shown in FIG.
There is a portion of the core material 30' where the resin layer 52' is not formed and the core material 30' is exposed, which has the disadvantage of narrowing the area of the recording surface. Furthermore, it was difficult to flatten the area after cutting out the runner 42' with high precision, and this area could not be used as a recording surface either. In addition, these marks caused a poor appearance.

(問題点を解決するための手段) この発明は上記問題点を解消するためになされたちので
、その要旨は、一対の金型半体のnl:偏平な円形のキ
ャビティを形成し、一方の金型半体には、上記キャビテ
ィの中央部に連通する湯道を形成し、この湯道の近傍に
おいて、両方の金型半体には押さえ用凸部を互いに対向
して設けるとともに少なくとも一方の金型半体には位置
決め用凸部を設けてなる金型を用意し、また、中央部に
樹脂流通用の孔を有するとともにこの樹脂流通用の孔の
近傍に位置決め用の孔を有する円盤形状の芯材を用意し
、この芯材の位置決め用の孔に上記位置決め用凸部を挿
入するとともに、芯材を両面から上記押さえ用凸部で押
さえるようにして金型を閉じ、上記湯道からキャビティ
へ溶融樹脂を充填することにより成形を行ない、この後
、湯道により形IF1.された湯道部と位置決め用凸部
および押さえ用凸部の痕跡とを含む成形品の中央部を切
断して除去するに上り、中央に規格径の孔を有するディ
スク基板を得ることを特徴とするディスク基板の製造方
法にある。
(Means for Solving the Problems) This invention has been made to solve the above problems, and its gist is to form a flat circular cavity in a pair of mold halves, and to form a flat circular cavity in one mold half. A runner is formed in each mold half that communicates with the central part of the cavity, and in the vicinity of the runner, both mold halves are provided with pressing convex portions facing each other, and at least one metal A mold is prepared in which a positioning convex portion is provided on the mold half, and a disc-shaped mold having a resin flow hole in the center and a positioning hole near the resin flow hole is prepared. Prepare a core material, insert the positioning convex part into the positioning hole of the core material, close the mold by pressing the core material from both sides with the pressing convex part, and insert the mold from the runner into the cavity. Forming is performed by filling the molten resin into the molten resin, and then a runner forms the shape IF1. The central part of the molded product including the molded runner part and the traces of the positioning convex part and the holding convex part is cut and removed to obtain a disk substrate having a hole of a standard diameter in the center. A method of manufacturing a disk substrate is provided.

(作用) 芯材をキャビティ内にセットした状態で金型を閉じ、一
方の金型半体に形成された湯道から、溶融樹脂をキャビ
ティへ充填する。この際、溶融樹脂はキャビティの中央
部から芯材の面に沿って進むので、芯材の面には樹脂の
圧力が殆ど加わらず、芯材の変形を防止できる。また、
溶融樹脂はキャビティの周縁近傍で合流することになる
ので、樹脂層の記録領域にウェルドラインが発生するの
を防止することができる。さらに、両金型半体から突出
する押さえ用凸部で、芯材の両面を押さえるので、樹脂
充填時に芯材が傾くのを防止でき、両金型半体の型面と
平行な状態を維持できるため、芯材の両面を均一厚さの
樹脂層で被覆することができる。
(Operation) The mold is closed with the core material set in the cavity, and molten resin is filled into the cavity from the runner formed in one half of the mold. At this time, since the molten resin advances from the center of the cavity along the surface of the core material, almost no pressure of the resin is applied to the surface of the core material, and deformation of the core material can be prevented. Also,
Since the molten resin joins near the periphery of the cavity, it is possible to prevent weld lines from forming in the recording area of the resin layer. Furthermore, since the holding convex parts protruding from both mold halves hold down both sides of the core material, it is possible to prevent the core material from tilting during resin filling, and maintain a state parallel to the mold surfaces of both mold halves. Therefore, both sides of the core material can be coated with a resin layer of uniform thickness.

上記成形後、成形品の中央部を切断して除去することに
より、湯道により形成された湯道部や位置決め用凸部や
押さえ用凸部の痕跡等が全゛くないディスク基板を得る
ことができる。
After the above molding, the central part of the molded product is cut and removed to obtain a disk substrate completely free of traces of the runners, positioning convexities, and pressing convexities formed by the runners. I can do it.

(実施例) 以下、この発明方法を、第1図〜第5図を参照して説明
する。
(Example) Hereinafter, the method of this invention will be explained with reference to FIGS. 1 to 5.

第1図、第2図中10は、本発明を実行するだめの射出
成形金型であり、この金型10は固定型11(金型半体
)と移動型12(金型半体)を有している。金型10は
いわゆる横型であり、固定型11に対して移動型12が
水平移動して、金型1の開閉を行なうようになっており
、パーティング面11a、12aが垂直をなしている。
Reference numeral 10 in FIGS. 1 and 2 is an injection mold for carrying out the present invention, and this mold 10 has a fixed mold 11 (mold half) and a movable mold 12 (mold half). have. The mold 10 is of a so-called horizontal type, and a movable mold 12 moves horizontally with respect to a fixed mold 11 to open and close the mold 1, and parting surfaces 11a and 12a are vertical.

固定型11と移動型12には、それぞれ円形の浅い凹部
13,14が形?1.されており、この凹部13.14
は、高精度に鏡面仕上げされた型面13a、14aを有
している。型締め時において、これら凹部13,14に
より偏平な円形のキャビティ15が形成される。
The fixed mold 11 and the movable mold 12 have shallow circular recesses 13 and 14, respectively. 1. This recess 13.14
has mold surfaces 13a and 14a that are mirror-finished with high precision. When the mold is clamped, a flat circular cavity 15 is formed by these recesses 13 and 14.

固定型11は、その中央部においてスプルーブツシュ1
6を有しており、このスプルーブツシュ16にはスプル
ー17(湯道)が形J&されている。又ブルー17はキ
ャビティ15の中央部に連なる。
The fixed mold 11 has a sprue bush 1 in its center.
6, and this sprue bush 16 has a sprue 17 (runner) shaped like J&. Moreover, the blue 17 continues to the center of the cavity 15.

:iた、移動型12は、その中央部において突き出し用
ブツシュ18を有しており、このブツシュ18には突き
出しビン19が貫通しているにれらブツシュ16.18
は上記型面13a、14aから後退しているため、キャ
ビティ15の中央部は周辺部に比べて幅広となっており
、その境部に段20.21がそれぞれ形成されている。
In addition, the movable mold 12 has an ejecting bush 18 in its center, and an ejecting pin 19 passes through this bushing 18.
are set back from the mold surfaces 13a, 14a, so that the central part of the cavity 15 is wider than the peripheral part, and steps 20 and 21 are formed at the boundaries thereof.

上記固定型11のスプルーブツシュ1Gの面には、又ブ
ルー17の周囲において、等間隔で計3本の位置決めピ
ン25(位置決め用凸部)が埋め込み固定されており、
これら位置決めピン2Sは移動型12方向へ水平に突出
している。また、これら位置決めピン25の間には計3
本の押さえビン26(押さえ用凸部)が埋め込み固定さ
れており、移動型12方向へ突出している。池方、移動
型12の突外出し用ブツシュ1Bの面には、固定型11
の位置決めビン25に対向した位置に逃げ穴27が形成
され、固定型11の押さえピン26に対向した位置に3
本の押さえビン28(押さえ用凸部)が埋め込み固定さ
れて固定型11方向へ水平に突出している。
In the surface of the sprue bush 1G of the fixed mold 11, a total of three positioning pins 25 (positioning protrusions) are embedded and fixed at equal intervals around the blue 17,
These positioning pins 2S project horizontally in the direction of the movable mold 12. Moreover, there are a total of 3 pins between these positioning pins 25.
A book holding bottle 26 (holding convex portion) is embedded and fixed, and protrudes in the direction of the movable mold 12. Ikegata, the fixed mold 11 is attached to the surface of the protruding bush 1B of the movable mold 12.
An escape hole 27 is formed at a position facing the positioning pin 25 of the fixed mold 11, and a hole 3 is formed at a position facing the holding pin 26 of the fixed mold 11.
A book holding bottle 28 (holding convex portion) is embedded and fixed and projects horizontally in the direction of the fixed mold 11.

第1図、第2図中30は本発明方法に用いられる芯材で
あり、この芯材30は、金属アルミ、セラミックス、F
RP等の非磁性材料がらなり、薄い円盤形状をなしてい
る。芯材30の中央部には、樹脂流通用の大きい孔31
が形成されており、この孔31の近傍には、等間隔で3
箇所に小さい位置決め用の孔32が形成されている。
1 and 2 is a core material used in the method of the present invention, and this core material 30 is made of metal aluminum, ceramics, F
It is made of non-magnetic material such as RP and has a thin disk shape. A large hole 31 for resin flow is provided in the center of the core material 30.
are formed in the vicinity of this hole 31, three holes are formed at equal intervals.
Small positioning holes 32 are formed at certain locations.

上述の金型10と芯材3θを用いて磁気ディスク基板を
製造する。まず、芯材30の位置決め用の孔32に、固
定型11の位置決めピン25を挿入する。これにより、
芯材30は固定型11に正確にセットされる。次に、移
動型12を固定型11方向へ移動させて金型10i、:
閉じる。これにより芯材30の中央の孔31の近傍部両
面が固定型11および移動型12の各押さえピン26.
28により押さえられる。この結果、芯材30は垂直を
なしてキャビティ15内に配置され、両型面13a、1
4aから等しい距離だけ離れている。なお、位置決めピ
ン25は、逃げ穴27に入り込む。
A magnetic disk substrate is manufactured using the above-described mold 10 and core material 3θ. First, the positioning pin 25 of the fixed mold 11 is inserted into the positioning hole 32 of the core material 30. This results in
The core material 30 is accurately set in the fixed mold 11. Next, the movable mold 12 is moved in the direction of the fixed mold 11, and the mold 10i:
close. As a result, both sides of the vicinity of the central hole 31 of the core material 30 are attached to the holding pins 26 of the fixed mold 11 and the movable mold 12.
28. As a result, the core material 30 is vertically arranged in the cavity 15, and both mold surfaces 13a, 1
It is an equal distance away from 4a. Note that the positioning pin 25 enters into the escape hole 27.

上記型締め状態で、射出機から又ブルー17へ熱可塑性
または熱硬化性の溶融樹脂を充填する。
In the mold clamped state, the blue 17 is again filled with thermoplastic or thermosetting molten resin from the injection machine.

この溶融樹脂はキャビティ15の中央部に至り芯材30
の樹脂流通用の孔31を通って移動型12のブツシュ1
8および突外出しピン19に当たり、このキャビティ1
5の中央部から芯材30と各型面13a、14aとの間
を通ってキャビティ15の周縁に向かって充填される。
This molten resin reaches the center of the cavity 15 and reaches the core material 30.
The bush 1 of the movable mold 12 passes through the hole 31 for resin flow.
8 and protruding pin 19, this cavity 1
5 is filled toward the periphery of the cavity 15 through between the core material 30 and each mold surface 13a, 14a.

このように溶融樹脂がえヤビティ15の中央から芯材3
0の面に沿って進むので・、芯材30の面には射出圧力
が殆ど加わらず、芯材30の変形を防止できる。
In this way, melt the resin from the center of the cavity 15 to the core material 3.
Since the injection proceeds along the plane 0, almost no injection pressure is applied to the plane of the core material 30, and deformation of the core material 30 can be prevented.

また、押さえピン26.28で芯材30の両面を押さえ
るので、樹脂充填時に芯材30が傾くのを防止でき、両
型面13a、14aと平行な状態を維持できる。このた
め、後述のように芯材30の両面を被覆する樹脂N52
を全面にわたって均一厚さにすることができる。
In addition, since both sides of the core material 30 are held down by the holding pins 26 and 28, it is possible to prevent the core material 30 from tilting during resin filling, and to maintain a state parallel to both mold surfaces 13a and 14a. For this reason, the resin N52 covering both sides of the core material 30 is used as described below.
can be made to have a uniform thickness over the entire surface.

さらに、芯材30の位置決め用の孔32に位置決めピン
25を挿入させることにより、芯材30は型面13a、
14aと平行な方向の移動を禁じられているので、その
外周縁とキャビティ15の局面との間を一定に維持でき
、後述するように芯材30の外周縁を被覆する樹脂層5
2を、全周にわたって均一厚さにすることができる。
Furthermore, by inserting the positioning pin 25 into the positioning hole 32 of the core material 30, the core material 30 can be moved to the mold surface 13a,
Since movement in the direction parallel to the core material 14a is prohibited, the distance between the outer circumferential edge and the surface of the cavity 15 can be maintained constant, and as will be described later, the resin layer 5 covering the outer circumferential edge of the core material 30
2 can be made to have a uniform thickness over the entire circumference.

溶融樹脂はキャビティ15の中央部から芯材30の両面
1こ浩って進み、キャビティISの周縁近傍で合流する
ため、樹脂層52の記録領域にウェルドラインが発生す
るのを防止することがで外る。
Since the molten resin travels from the center of the cavity 15 to both sides of the core material 30 and joins near the periphery of the cavity IS, it is possible to prevent weld lines from forming in the recording area of the resin layer 52. Comes off.

なお、上記溶融樹脂は位置決めピン25および押さえピ
ン26.23を通過する過程で、これらピン25,26
.28に上り一旦分1!され再び合流するため、ウェル
ドラインが形成される可能性があるが、この実施例では
、キャビティ15の中央部が幅広であり、この中央部か
ら周縁へと進む過程で段20.21を通り、この時溶融
樹脂にせん断発熱が生じるため、上記ピン25.26.
281こ起因するウェルドラインの発生をも防止するこ
とができる。
In addition, the molten resin passes through the positioning pin 25 and the holding pin 26.
.. Once I reached 28, I reached 1 minute! However, in this embodiment, the center of the cavity 15 is wide, and as it progresses from the center to the periphery, it passes through steps 20 and 21. At this time, shear heat generation occurs in the molten resin, so the pins 25, 26.
It is also possible to prevent the occurrence of weld lines caused by 281.

上記溶融樹脂が金型10内で固化主たは硬化した後、移
動型12を移動して型開とを行ない、突外出しピン19
を突出させて第3図に示す成形品40を取り出す。この
成形品40は、円盤形状をなし、その中央部に形成され
た厚内部41と、この厚内部41の中央に形成されたス
プル一部42(湯道部)と、厚内部41においてスプル
一部42の周囲の6箇所に形成された孔43とを有して
いる。厚内部41はキャビティ15の幅広の中央部によ
って形成され、スプル一部42はスプルー17に上って
形成され、孔43は位置決めピン25および押さえピン
26.28によって形成されるものである。
After the molten resin has solidified or hardened within the mold 10, the movable mold 12 is moved to open the mold, and the protruding ejecting pin 19
The molded product 40 shown in FIG. 3 is taken out by protruding. This molded product 40 has a disk shape, and includes a thick interior 41 formed in the center thereof, a sprue portion 42 (runner section) formed in the center of the thick interior 41, and a sprue joint in the thick interior 41. It has holes 43 formed at six locations around the portion 42. The thick interior 41 is formed by the wide central part of the cavity 15, the sprue portion 42 is formed up the sprue 17, and the hole 43 is that formed by the locating pin 25 and the hold-down pin 26,28.

そして、上記成形品40の厚内部41の周囲を円形にレ
ーザー光で切断(切断内の径は厚内部41より若干大き
い)することにより、この厚内部41を成形品40から
除去し、第4図に示すような中央に規格径の孔51を有
する磁気ディスク基板50を得る。
Then, by cutting the periphery of the thick inside 41 of the molded product 40 into a circular shape using a laser beam (the diameter of the cut inside is slightly larger than the thick inside 41), this thick inside 41 is removed from the molded product 40, and the fourth A magnetic disk substrate 50 having a hole 51 with a standard diameter in the center as shown in the figure is obtained.

得られた磁気ディスク基板50は@5図に示すように、
芯材30の両面および外周縁を樹脂層52で被覆されて
いる。ディスク基板5()には、スプル一部42や位置
決めピン25、押さえピン26.28の痕跡等が全くな
い。
The obtained magnetic disk substrate 50 is as shown in Figure @5.
Both surfaces and the outer peripheral edge of the core material 30 are coated with a resin layer 52. There are no traces of the sprue portion 42, positioning pins 25, holding pins 26, 28, etc. on the disk substrate 5().

この発明方法は上記実施例に制約されず種々の態様が可
能であり、例えば光ディスクの基板にも適用することが
できる。
The method of the present invention is not limited to the above-mentioned embodiments and can be modified in various ways, and can be applied to, for example, the substrate of an optical disc.

主た、射出成形の代わりにトランス77成形等の成形手
段を採用することらでトる。
This is achieved mainly by using a molding method such as transformer 77 molding instead of injection molding.

位置決め用凸部および押さえ用凸部は各金型半体に一体
に形成してもよい。
The positioning convex portion and the holding convex portion may be integrally formed on each mold half.

位置決め用凸部は押さえ用凸部の頂面に形成してもよい
。この場合、位置決め用凸部の高さは、芯材の厚さと等
しいかこれより低くする。
The positioning projection may be formed on the top surface of the holding projection. In this case, the height of the positioning projection is equal to or lower than the thickness of the core material.

金型は上下に分離された金型半体により構成し、いわゆ
る縦型としても五い。
The mold consists of two mold halves separated into upper and lower halves, and is also a so-called vertical mold.

金型は複数のキャビティを有するものであってもよい。The mold may have multiple cavities.

この場合、湯道が途中で分岐してそれぞれキャビティの
中央部に連通されるように構成する。
In this case, the runners are configured to branch in the middle and communicate with the center of the cavity.

(発明の効果) 以上説明したように、この発明方法では、キャビティの
中央から樹脂が充填されるため、芯材の変形を防止でき
、樹脂層の記録領域にウェルドラインが発生するのを防
止できる。主た、芯材を押さえ用凸部で両側から押さえ
るので、芯材の傾きを防止して均一厚さの樹脂層で被覆
することができる。主た、湯道、押さえ用凸部、位置決
め用凸部の痕跡を含む成形品の中央部を切断して除去す
ることにより、規格径の孔を有するディスク基板を得る
ので、このディスク基板は記録面の領域が広く外観も良
好である。
(Effects of the Invention) As explained above, in the method of this invention, since the resin is filled from the center of the cavity, deformation of the core material can be prevented, and weld lines can be prevented from occurring in the recording area of the resin layer. . Mainly, since the core material is pressed from both sides by the pressing convex portions, it is possible to prevent the core material from tilting and to cover it with a resin layer of uniform thickness. By cutting and removing the central part of the molded product, including the traces of the runners, holding projections, and positioning projections, a disk substrate with a hole of a standard diameter is obtained. The surface area is wide and the appearance is good.

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第5図はこの発明の一実施例を示し、第1図は
金型および芯材の分解斜視図、第2図は型締め時の金型
および芯材の断面図、第3図は射出成形によって得られ
た成形品の斜視図、第4図は最終製品としてのディスク
基板の斜視図、第5図は同断面図である。また、第6図
〜第9図は従来例を示すもので、第6図は金型および芯
材の分解斜視図、第7図は射出成形によって得らhた成
形品の斜視図、第8図は最終製品としてのディスク基板
の斜視図、第9図は同断面図である。 10・・・金型、11・・・固定型(金型半体)、12
・・・移動型(金型半体)、15・・・キャビティ、1
7・・・スプルー(湯道)、25・・・位置決めピン(
位置決め用凸部)、26,2f3・・・押さえピン(押
さえ用凸部)、30・・・芯材、31・・・樹脂流通用
の孔、32・・・位置決め用の孔、40・・・成形品、
41・・・成形品の厚内部(中央部)、42・・・スプ
ル一部(湯道により形成される湯道部)、43・・・孔
(位置決め用凸部および押さえ用凸部の痕跡)、50・
・・ディスク基板、51・・・規格径の孔
1 to 5 show one embodiment of the present invention, FIG. 1 is an exploded perspective view of the mold and core material, FIG. 2 is a sectional view of the mold and core material during mold clamping, and FIG. The figure is a perspective view of a molded product obtained by injection molding, FIG. 4 is a perspective view of a disk substrate as a final product, and FIG. 5 is a sectional view of the same. 6 to 9 show conventional examples. FIG. 6 is an exploded perspective view of a mold and core material, FIG. 7 is a perspective view of a molded product obtained by injection molding, and FIG. 8 is a perspective view of a molded product obtained by injection molding. The figure is a perspective view of a disk substrate as a final product, and FIG. 9 is a sectional view thereof. 10... Mold, 11... Fixed mold (mold half), 12
...Movable mold (mold half), 15...Cavity, 1
7... Sprue (runner), 25... Positioning pin (
positioning protrusion), 26, 2f3... holding pin (holding protrusion), 30... core material, 31... hole for resin flow, 32... hole for positioning, 40... ·Molding,
41... Thick interior (center part) of molded product, 42... Part of sprue (runner formed by runner), 43... Hole (trace of positioning convex part and holding convex part) ), 50・
... Disk board, 51 ... Hole with standard diameter

Claims (1)

【特許請求の範囲】[Claims] (1)一対の金型半体の間に偏平な円形のキャビティを
形成し、一方の金型半体には、上記キャビティの中央部
に連通する湯道を形成し、この湯道の近傍において、両
方の金型半体には押さえ用凸部を互いに対向して設ける
とともに少なくとも一方の金型半体には位置決め用凸部
を設けてなる金型を用意し、また、中央部に樹脂流通用
の孔を有するとともにこの樹脂流通用の孔の近傍に位置
決め用の孔を有する円盤形状の芯材を用意し、この芯材
の位置決め用の孔に上記位置決め用凸部を挿入するとと
もに、芯材を両面から上記押さえ用凸部で押さえるよう
にして金型を閉じ、上記湯道からキャビティへ溶融樹脂
を充填することにより成形を行ない、この後、湯道によ
り形成された湯道部と位置決め用凸部および押さえ用凸
部の痕跡とを含む成形品の中央部を切断して除去するに
より、中央に規格径の孔を有するディスク基板を得るこ
とを特徴とするディスク基板の製造方法。
(1) A flat circular cavity is formed between a pair of mold halves, a runner is formed in one mold half that communicates with the center of the cavity, and a runner is formed in the vicinity of this runner. A mold is prepared in which both mold halves are provided with holding convex parts facing each other, and at least one of the mold halves is provided with a positioning convex part, and the central part is provided with a resin distribution part. Prepare a disk-shaped core material that has a hole for resin flow and a positioning hole near the hole for resin flow, insert the positioning convex part into the positioning hole of this core material, and The mold is closed by pressing the material with the pressing convex parts from both sides, and the molding is performed by filling the cavity with molten resin from the runner. After this, the runner is positioned with the runner formed by the runner. 1. A method for manufacturing a disk substrate, comprising: obtaining a disk substrate having a hole of a standard diameter in the center by cutting and removing the central portion of a molded product including traces of a presser convex portion and a presser convex portion.
JP8292086A 1986-04-10 1986-04-10 Manufacture of disk base Pending JPS62238723A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8292086A JPS62238723A (en) 1986-04-10 1986-04-10 Manufacture of disk base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8292086A JPS62238723A (en) 1986-04-10 1986-04-10 Manufacture of disk base

Publications (1)

Publication Number Publication Date
JPS62238723A true JPS62238723A (en) 1987-10-19

Family

ID=13787680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8292086A Pending JPS62238723A (en) 1986-04-10 1986-04-10 Manufacture of disk base

Country Status (1)

Country Link
JP (1) JPS62238723A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011161702A (en) * 2010-02-08 2011-08-25 Nakanishi Metal Works Co Ltd Injection molding mold for resin product with core metal inserted into annular portion, method of manufacturing the resin product, and resin retainer with core metal inserted into annular portion

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011161702A (en) * 2010-02-08 2011-08-25 Nakanishi Metal Works Co Ltd Injection molding mold for resin product with core metal inserted into annular portion, method of manufacturing the resin product, and resin retainer with core metal inserted into annular portion

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