JPH0237538A - Disk and production thereof and metallic mold for producing said disk - Google Patents

Abstract

PURPOSE:To prevent sticking of chips and to execute central holding with high accuracy in a short period of time by forming a recess for positioning a central hole simultaneously with a substrate, taking the substrate out of a metallic mold for production and positioning the substrate, then subjecting the substrate to central boring by laser light. CONSTITUTION:A plastic resin in a molten state is packed into a gap 19 via a sprue bush 18 of the metallic mold 10 for production to form the substrate 1a. The information recorded on a master disk 11 is transferred to the substrate 1a and the recess 4a for central positioning is formed by a projection 15. The mold 20 is opened and the molded substrate 1a is taken out when the resin cools. This substrate is then imposed on a jig 21 for central boring. A projection 22 fitting to the recess 4a for central positioning of the substrate 1a is provided to this jig 21 and is positioned by fitting the recess 4a of the substrate 1a and the projection 22. The defect by sticking of the chips is prevented in this way and the central boring is executed with high accuracy in a short period of time.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a disk, a method for manufacturing the same, and a mold for manufacturing the same.

[Conventional technology]

When manufacturing optical discs (hereinafter referred to as "discs") such as video discs, compact discs, and data files, conventionally, the rotation center hole of the plastic substrate (hereinafter referred to as "substrate") constituting the disc is, for example, As described in Japanese Patent Application Laid-open No. 100426/1983, the substrate is formed by molding the substrate using a manufacturing mold and then punching out the center portion of the substrate within the manufacturing mold.

In addition, as other methods, for example, JP-A-58-14
As described in Publication No. 336, a signal for center positioning is provided in advance on the master disc placed in the manufacturing mold, a board is molded by the manufacturing mold, and after being taken out from the manufacturing mold, the board is Read the transferred center positioning signal,
A method of forming a rotation center hole by cutting the central portion of the substrate with a drill based on the signal has also been proposed.

[Problem to be solved by the invention]

Among the conventional techniques mentioned above, the method of forming the rotation center hole by punching the substrate in the manufacturing mold does not take into account the generation of resin chips that are generated during punching, and the chips are removed from the substrate. There has been a problem in that the particles get mixed into the interior or adhere to the surface of the substrate, causing defects and lowering the yield.

That is, when a punch for punching out a substrate slides within a manufacturing mold, resin chips are generated from the cut surface. When the molded substrate is removed from the manufacturing mold, the chips diffuse into the cavity of the manufacturing mold or adhere to the surface of the substrate.

The chips remaining in the cavity will be mixed into the resin filled during the next molding process, and will be scattered inside or on the surface of the substrate. If chips are scattered inside the board like this, when a laser beam, etc. is incident on the board to read the information transferred to the board, the chips will block the optical path of the laser beam, etc. , information was sometimes lost in reading.

Generally, a reflective film such as A2 is deposited on the surface of the substrate where the information is transferred (unevenness) in order to read the information by reflection of the incident laser beam. If chips adhere to the surface of the surface, a reflective film will be deposited on top of the chips.
When the chips came off, the reflective coating in that area also chipped, making it impossible to read the information in that area.

On the other hand, a signal for center positioning is provided in advance on the master disk, and after the board is molded, the center positioning signal transferred to the board is read, and the board is cut with a drill based on that signal, so that the rotation center is In the method of forming holes, consideration is not given to the time required for the working process, resulting in a problem that the working time becomes long and the cost increases.

In other words, there is a process of providing a signal for center positioning on the master disc, a process of applying a protective film to prevent the adhesion of chips generated during cutting with a drill, and a process of searching and reading the signal for center positioning using a microscope. A positioning process and a removal process using a drill are required.

Note that if the step of applying the protective film is omitted, chips will adhere to the surface of the substrate, resulting in information reading errors, as in the case of punching the substrate in the manufacturing mold described above.

The purpose of the present invention is to solve the problems of the prior art described above,
The purpose is to provide a desk with few defects, high yield, and low cost.

Another object of the present invention is to provide a manufacturing method for manufacturing the above-mentioned disk, or a manufacturing mold used for manufacturing the above-mentioned disk.

[Means to solve the problem]

In order to achieve the above object, the present invention is as described below.

1) The rotation center hole of the substrate is not drilled in the manufacturing mold, but after the substrate is taken out from the manufacturing mold.

2) For drilling the rotation center hole of the substrate, use a high-frequency heat source such as a laser beam to avoid cutting chips.

3) At least one of the center positioning recesses or protrusions used for positioning the center position when drilling the rotation center hole of the substrate has a signal information section and a laser beam incident on the surface of the substrate. Provided in an area other than the entrance part.

[Effect]

The rotation center hole of the board is not drilled in the manufacturing mold.
By doing this after taking the board out of the manufacturing mold, no resin chips will be generated inside the manufacturing mold.Therefore, there will be no information about resin chips getting into the inside of the board or adhering to the surface. read loss is reduced. Furthermore, since the structure of the manufacturing mold can be simplified, the number of man-hours required for manufacturing the mold can be reduced, and the cost of the disk can be reduced.

Further, by using a high frequency heat source such as a laser beam to drill the rotation center hole of the substrate after removal, no chips are generated during processing. Therefore, there is no need for a protective film for preventing adhesion of chips, which is necessary when cutting with a drill or the like.

Therefore, the protective film coating process can be omitted, reducing working time and lowering costs.

In addition, by using a high-frequency heat source such as a laser beam when drilling the rotation center hole, it is possible to freely change the shape of the rotation center hole or place the hole in another position (hole used in another process, for example, positioning It is also possible to add holes etc.

Furthermore, since the recess or protrusion for center positioning is provided at a fixed location on the surface of the substrate, a jig for drilling the rotation center hole having a protrusion or recess that fits into the recess or protrusion can be used. By preparing in advance, the center position of the rotation center hole can be instantly determined. and,
By setting the machining position according to the jig, the rotation center hole can be formed in a short time and with high precision. Therefore,
There is no need to take the trouble of locating the center of each substrate while looking through a microscope, which is required in the past, and the cost of the disk can be reduced.

In addition, in the manufacturing mold, by providing the protrusion or depression for forming the depression or protrusion for center positioning of the board in a location other than the master disk that is replaced by the product, the protrusion or depression can be created only once. Since it is good, its production does not require time and cost.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1(a) is a perspective view showing a disk as an embodiment of the present invention, and FIG. 1(b) is a partially cutaway perspective view of the disk in FIG. 1(a). . Note that in FIG. 1(b), the size is exaggerated for clarity.

As shown in FIG. 1, the configuration of the disk 1 is as follows.

The disk 1 mainly consists of two plastic substrates (hereinafter referred to as substrates) la and lb. On one side of each base [la and lb, signal information consisting of minute irregularities called pits is formed. Part 2a.

2b, and the other side has an entrance part 2a', 2 into which a laser beam for reading information recorded therein is incident.
There is b'. The substrates 1a and 1b are bonded together with the information signal section 2a2b on the inside via reflective films 6a and 6b such as A1, protective films 7a and 7b, and adhesive 8.

Further, 3a and 3b are rotation center holes for rotating the disk 1 when reading information recorded in the signal information sections 2a and 2b in a disk player (not shown). Moreover, 4a and 4b are center positioning recesses for defining the center positions when forming the rotation center holes 3a and 3b. Further, 5a and 5b are the signal information section 2a,
This is a label stepped portion for pasting a label indicating the contents of information recorded on the 2b. Note that this stepped portion 5a
, 5b may be omitted.

Next, the manufacturing procedure of the disc 1 shown in FIG. 1 will be explained.

FIG. 2 is a cross-sectional view showing the main parts of a production mold for injection molding for molding the substrates 1a and lb in FIG.

As shown in FIG. 2, the manufacturing mold 10 includes a master disk 11 on which information is recorded, a movable mirror block 12 that is polished to a mirror surface to which the master disk 11 is attached, and a movable mirror block 12 that fixes the master disk 11 to the movable mirror block 12. a holder 13 for shaping the surfaces of the substrates 1a and 1b, a fixed mirror block 14 polished to a mirror surface for shaping the surfaces of the substrates 1a and 1b, a recess 4a for center positioning of the substrates 1a and 1b,
The label step block 16 has a protrusion 15 for shaping the substrate 4b, an ejector block 17 for taking out the molded substrates 1a and 1b, a sprue bush 18 that serves as a passage for molten resin, and the like.

In FIG. 2, the master 11. fixed mirror block 14,
Resin is injected into the gap 19 surrounded by the label step blocks 16 and the like, and the substrates 1a and lb are molded.

The operation of this manufacturing mold 10 during molding will be explained. In addition, in the following description, the case of molding the board|substrate 1a is demonstrated as an example.

First, a transparent plastic resin is heated to a molten state in an injection molding machine (not shown), and the nozzle of the injection molding machine is pressed against the sprue bush 18 to inject it. The injected resin passes through the sprue bush 18 and fills the void 19. As a result, the substrate la is formed. Also, at this time, the information recorded on the master disc 11 is transferred to the substrate 1a, and
The protrusion 15 creates a recess 4a for center positioning.

After the filled molten resin is cooled, the manufacturing mold 10 is opened, the ejector block 17 is advanced, and the molded substrate 1a is ejected.The ejected substrate 1a is taken out by hand or by a robot.

As described above, no resin cutting process is performed in the manufacturing mold 10, so no resin chips are generated.

Next, a method of drilling the rotation center hole 3a in the substrate 1a taken out from the production mold 10 will be explained.

FIG. 3 is a perspective view for explaining the method of drilling the rotation center hole of the substrate in FIG. 1.

As shown in FIG. 3, the substrate 1a taken out from the manufacturing mold 10 has the sprues 20 still attached.

This is placed on a jig 21 for drilling the rotation center hole.

This jig 21 has a recess 4 for center positioning of the substrate 1a.
A protrusion 22 for center positioning that fits with a is provided,
By placing the substrate 1a on this jig 21 so that the recess 4a and the protrusion 22 fit together, the center position of the rotation center hole 3a of the substrate 1a is determined. That is, if there are a plurality of recesses 4a for center positioning, the rotation center hole 3a
The center position of is determined.

Furthermore, if the shape of the cross section of the recess 4a and the protrusion 22 is not circular but triangular or quadrangular, even if there is only one recess 4a and one protrusion 22, four plates 1a can be formed around them.
Since there is no possibility that the jig rotates with respect to the jig 21 and the positioning is not performed, as long as the positional relationship between the position of the recess 4a or protrusion 22 and the center position of the rotation center hole 3a is known in advance, The center position of the rotation center hole 3a is known.

Next, the jig 21 on which the substrate 1a is placed is rotated.

At this time, the rotation center of the jig 21 and the center of the substrate 1a (i.e.,
The center of the rotation center hole 3a) is aligned with the center of the rotation center hole 3a. and,
The laser beam 23 is converged through a converging lens 24, and its converging point 25 is aligned with the position to be processed. At the convergence point 25, the temperature instantaneously becomes high, so that the resin at the position to be processed melts.

Therefore, no chips are generated.

Furthermore, since the substrate 1a is rotated together with the jig 21,
While keeping the position of the convergence point 25 of the laser beam 23 constant,
An accurate circular rotation center hole 3a can be formed. This rotation [in this embodiment, the position of the convergence point 25 of the laser beam 23 is fixed, and the substrate 1a is rotated together with the jig 21,
The rotation center hole 3a is formed, but conversely, the rotation center hole 3a is formed by fixing the substrate 1a together with the jig 21 and moving the position of the convergence point 25 of the laser beam 23 in a circular shape. There is no problem.

Next, an example in which the center positioning recesses 4a and 4b provided in the substrates La and lb are used for purposes other than positioning the center positions of the rotation center holes 3a and 3b will be described.

FIG. 4 is a perspective view showing a first example of use of the center positioning recess provided in the substrate in FIG. 1.

As shown in FIG. 4, when attaching the hub 30b having the center hole 32b to the board 1b, a protrusion 31b that fits into the center positioning recess 4b of the board 1b is attached to the hub 30b in advance.
If you do this, the recess 4a and the protrusion 31b will be
By aligning the hub 30b with the hub 30b and gluing or welding the
can be easily attached to the substrate 1b without causing any misalignment.

FIG. 5 is a plan view showing a second example of use of the center positioning recess provided in the substrate in FIG. 1.

As shown in FIG. 5, information 41a such as the production mold number, cavity number, and number indicating the contents of the signal information section 2a is stamped in the center positioning recess 4a. If you do it like this,
By using this information 41a, two substrates 1a,
The front and back sides of the lb can be bonded together without mistaking it for another board.

Here, the information stamped on the manufacturing mold itself, such as the manufacturing mold number and cavity number, is preliminarily stamped on the protrusion of the manufacturing mold 10 shown in FIG. This can be easily realized by stamping the information on the section 15.

Furthermore, since the information indicating the contents of the signal information sections 2a and 2b is not always constant, the information is not stamped inside the manufacturing mold 10, but after the substrates 1a and 1b are taken out from the manufacturing mold 10, they are rotated. This is done when forming the center holes 3a and 3b. That is, when forming the rotation center holes 3a and 3b, as shown in FIG.
4b is designed to fit with the protrusion 22 of the jig 21 for drilling the rotation center hole, so the protrusion 22 of this jig 21
By pre-engraving information indicating the contents of the signal information portions 2a, 2b on the substrate and heating the protrusions 22, the information can be easily imprinted.

In this way, the substrates La and lb on which the rotation center holes 3a and 3b have been formed and the information has been engraved are sent to a bonding process. At that time, the engraved information is read to confirm that the boards to be bonded are correct. This makes it possible to prevent bonding defects from occurring.

FIG. 6 is a perspective view showing a third usage example of the center positioning recess provided in the substrate in FIG. 1.

As shown in FIG. 6, the depth of the center positioning recess 4a is varied depending on the position where it is formed. By doing so, the unbalance (unbalanced weight) of the substrate 1a can be reduced.

That is, the depth of the recess 4a of the substrate 1a and its formation position are determined from the measurement results of the imbalance of the substrate 1a,
The recess in the direction in which the unbalance occurs, for example 4a, is made deeper according to the amount of unbalance, or the recess in the direction of 180 degrees (that is, facing the direction) relative to the direction in which the unbalance occurs, for example 43z, is made shallower. This reduces the amount of imbalance.

By using this substrate with reduced unbalance, it is possible to prevent malfunctions due to uneven rotation and vibrations caused by unbalance when reading information with a disc player (not shown).

Next, the manufacturing mold 10 for molding the substrate 1a shown in FIG. 6 will be explained using FIG. 7.

FIG. 7 is a sectional view showing the main parts of the manufacturing mold for molding the substrate in FIG. 6.

The manufacturing mold 10 shown in FIG. 7 has a structure in which a pin 42 is used instead of the protrusion 15 of the label step block 16 that shapes the recess for center positioning in the manufacturing mold 10 shown in FIG. 2. It has become.

The pin 42 is connected to a pin protrusion block 43, and by sliding the bottle protrusion block 43 from the outside of the manufacturing mold 10 (sliding left and right in the figure), the pin 42 is slid (
(In the figure, it can be slid up and down). Therefore, the amount of protrusion of the pin 42 can be adjusted while the manufacturing mold 10 is attached to an injection molding machine (not shown). In this way, by adjusting the amount of protrusion of the pin 42, the depth of the recess 4a of the substrate 1a can be adjusted.

The above is an example in which the center positioning recesses 4a, 4b are used for purposes other than positioning the center positions of the rotation center holes 3a, 3b.

Next, other embodiments of the present invention will be described.

FIGS. 8(a) to 8(C) are sectional views each showing a cross section of a disk as another embodiment of the present invention.

In the embodiment shown in FIG. 1, the recesses 4a and 4b for center positioning are located at the label step portions 5a and 5a of the substrates 1a and lb, respectively.
5b, on the surfaces of the substrates 1a and Ib, the signal information sections 2a and 2b and the entrance sections 2a' and 2b' into which the laser light for reading out the information recorded therein is incident.
It can be located anywhere as long as it is in any other area. That is, the recesses 4a and 4b do not need to be visible from the surface of the disk l, as shown in FIG. 8(a'), on the bonding surface of the substrates 1a and lb.

Moreover, as a substitute for the recesses 4a and 4b for center positioning,
As shown in FIG. 8(b), protrusions 4a'4b' may be provided.

On this birch, a projection 4a' for center positioning, 4. Even when the protrusions 4a' and 4b' are provided, as in the case of the recesses 4a and 4b, as shown in FIGS. You may also use it for other purposes.

For example, when used in the same manner as the usage example shown in FIG. 6, the projections 4a'' and 4b for center positioning.

Among them, either reduce the protrusion amount of the protrusion in the direction in which the imbalance occurs, or
The amount of unbalance is reduced by increasing the amount of protrusion in the 0 degree direction.

Furthermore, as shown in FIG. 8(C), the recesses 4a, 4
b and protrusions 4a' and 4b' may be used in combination, and in this case, it can also be used for positioning during bonding. In addition, for the sake of clarity in Figure 8 (C),
The figure shows the state before the substrates 1a and lb are bonded together.

FIG. 9 is a partially cutaway perspective view of the main part of a disk as another embodiment of the present invention.

In this embodiment, as shown in FIG. 9, for positioning the center position when forming the rotation center hole 3a of the substrate 1a,
A protruding portion 44a is provided on the label step portion 5a. This center positioning protrusion 44a is located at the label stepped portion 5a.
It is formed by protruding the inner surface of the substrate 1a toward the center of the substrate 1a, and functions similarly to the recess 4a and protrusion 4a' described above.

When forming this birch-like center positioning protrusion 44a, it is necessary to provide a mold for shaping it in the label step block 16 of the manufacturing mold 10 shown in FIG.

Further, when forming the rotation center hole 3a of the substrate 1a, it is necessary to use a jig 21 having a step that fits into the protrusion 44a.

Above, as an embodiment of the present invention, a disk made of two substrates bonded together and with information recorded on both sides has been described in detail. There is no problem even if the disc is

Furthermore, in the above embodiments, the case where injection molding was used as the method for molding the substrate was described, but other molding methods such as compression molding may be used.

Furthermore, the present invention is applicable not only to read-only optical discs (so-called optical video discs, compact discs, etc.) as described in the above embodiments, but also to optical discs on which additional recording is possible.
Needless to say, the present invention can also be applied to optical discs for use in digital data files, and the scope of application of the present invention is not affected by the format of the disc in any way.

In the above embodiment, the case where the disk (substrate) is circular is explained, but if the disk (substrate) has a circular shape, the position closest to the center of gravity of the disk on the main surface of the disk (substrate) can be rotated. This is defined as the position of the center hole.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to realize a disk with few defects, high yield, and low cost.

That is, in the present invention, the drilling of the rotation center hole of the substrate is performed by
Since this is not done inside the manufacturing mold, there is no chance of chips being scattered inside the board, and after the board is removed from the manufacturing mold, the rotation center hole is drilled using a high-frequency heat source such as a laser beam. Therefore, no chips are generated, so no chips are attached to the surface of the substrate. Therefore, there is no possibility that information will be lost or become unreadable.

In addition, when molding the substrate, a recess or protrusion for center positioning is simultaneously formed, and the center position of the rotation center hole can be easily positioned using the recess or protrusion, so drilling of the rotation center hole can be done in a short time. This can be done with high precision.

Furthermore, by recording predetermined information in the center positioning recess or protrusion, it is possible to prevent bonding defects of the substrates, and the depth of the recess or the amount of protrusion can be changed depending on the position where it is formed. , it is possible to reduce the unbalance of the substrate, and it is possible to prevent reading operation failures.

[Brief explanation of the drawing]

FIG. 1(a) is a perspective view showing a disk as an embodiment of the present invention, FIG. 1(b) is a partially cutaway perspective view of the disk in FIG. 1(a), and FIG. is a cross-sectional view showing the main parts of the manufacturing mold for molding the substrate in FIG. 1, FIG. 3 is an explanatory view for explaining the method of drilling the rotation center hole of the substrate in FIG. FIG. 5 is a perspective view showing a first usage example of the center positioning recess provided on the board in FIG. 1, and FIG. 5 is a perspective view showing a second usage example of the center positioning recess provided on the board in FIG. 6 is a perspective view showing a third usage example of the center positioning recess provided in the substrate in FIG. 1, and FIG. 7 is a manufacturing mold for molding the substrate in FIG. 6. 8(a) to (C) are sectional views showing the cross section of a disk as another embodiment of the present invention, and FIG. 9 is a sectional view showing the main part of the disc as another embodiment of the present invention. FIG. 2 is a partially cutaway perspective view of the main part of the disk. Explanation of symbols 1...Disk, 1a, 1b-...Substrate, 2a, 2b
...Signal information section, 2a', 2b'...Incidence section,
3a. 3b...rotation center hole, 4a, 4b...dent, 4a4
b'...Protrusion, 5a, 5b...Label step, 1
0... Manufacturing mold, 23... Laser light, 30b...
Hub, 41a... engraved information, 44a... protrusion. Agent Patent Attorney Akio Namiki 11fl Fig. 3α 6th cause 4b. 4b' (C) Tomi 7 Figure 1!9 Upper part of the treasure

Claims (1)

[Claims] 1. It has a rotation center hole in its center, and has a signal information section in which information is recorded in pits on one side, and the signal information section on the other side. In a disk comprising a substrate having an incident part into which a laser beam is incident for reading out information recorded on the substrate, the center position of the rotation center hole is located in an area of the surface of the substrate other than the signal information part and the incident part. A disc characterized by having at least one of a recess or a protrusion that defines a disc. 2. The disk according to claim 1, wherein the depth or the amount of protrusion of the recess or protrusion defining the center position of the rotation center hole differs depending on the position where the recess or protrusion is formed. 3. The position where the recess or protrusion defining the center position of the rotation center hole is formed, and its depth or protrusion amount are:
2. The disk according to claim 1, wherein the position, depth, or protrusion amount is such that the unbalance of the substrate is corrected. 4. The disk according to any one of claims 1 to 3, wherein certain information is recorded on a recess or protrusion that defines the center position of the rotation center hole. 5. It has a rotation center hole in its center, and has a signal information section in which information is recorded in pits on one side, and the information recorded in the signal information section on the other side. In a disk comprising a substrate having an entrance portion into which a laser beam for reading is incident, the substrate is molded by a manufacturing mold, and the rotation center hole of the substrate is formed when the substrate is taken out from the manufacturing mold. 1. A disk characterized in that the disk is formed by cutting out the center portion of the substrate using a high frequency heat source such as a laser beam. 6. It has a rotation center hole in its center, and has a signal information section in which information is recorded in pits on one side, and the information recorded in the signal information section on the other side. In a disk comprising a substrate having an entrance part into which a laser beam for reading is incident, a step part is provided in an area other than the signal information part and the entrance part on the surface of the substrate, and the step part is recessed from the surrounding area. A disc characterized in that it has a protrusion on an inner surface of the portion that protrudes toward the center of the stepped portion and defines the center position of the rotation center hole. 7. An entrance part that has a signal information section in which information is recorded in pits on one side, and that a laser beam for reading out the information recorded in the signal information section is incident on the other side. At the same time, in the manufacturing mold, a center position of a rotation center hole is defined in a region of the surface of the substrate other than the signal information part and the incidence part. a first step of forming at least one of a recess or a protrusion; and a step of placing the substrate taken out from the manufacturing mold into a jig having at least one of the protrusion or the recess, and defining the center position of the rotation center hole of the substrate; a second step of placing the substrate so that the recess or protrusion of the jig fits into the protrusion or recess of the jig, and cutting out the center portion of the substrate placed on the jig using a high-frequency heat source such as a laser beam; 6. The method of manufacturing a disk according to claim 1, further comprising a third step of forming the rotation center hole in the substrate. 8. When cutting out the central portion of the substrate using the high frequency heat source such as the laser beam, the substrate is cut while relatively moving the high frequency heat source such as the laser beam and the substrate. Disc manufacturing method. 9. It has a rotation center hole in its center, and has a signal information section in which information is recorded in pits on one side, and the information recorded in the signal information section on the other side. A recess or protrusion that has an entrance part into which a laser beam for reading is incident, defines the center position of the rotational center hole in an area other than the signal information part and the entrance part on its surface, and has predetermined information recorded thereon. A first step of reading out the information recorded on at least one of the recesses or protrusions from a substrate having at least one of the above, and sorting and sorting two substrates to be bonded together based on the read information. 5. The method of manufacturing a disk according to claim 4, further comprising a second step of bonding the substrates together. 10. A manufacturing mold used for injection molding or compression molding the substrate of the disk according to any one of claims 1 to 5, comprising: a part other than the signal information section and the incidence section of the substrate; A manufacturing mold having at least one of a protrusion and a recess for forming at least one of a recess and a protrusion defining the center position of the rotation center hole on the surface of the substrate in a portion shaping the region. 11. The manufacturing mold according to claim 10, further comprising adjusting means for adjusting the amount of protrusion or the depth of the recess of the protrusion.