JPS62238616A - Packaging of electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for packaging electronic components such as multilayer film capacitors used in electronic and electrical equipment.

Conventional technology In recent years, efforts have been made to make electronic and electrical equipment multi-functional and miniaturized, and molding technology with good dimensional and shape accuracy is also being used in encapsulation technology for electronic components to realize miniaturization of equipment and rationalization of production. has begun to be adopted. In conventional molding of film capacitors, the film capacitor is first sealed by sandwiching the electrode extension part to which the capacitor is bonded into a mold that has been processed into the shape of the product. Then, resin was injected into the sealed space around the film capacitor, hardened in a mold, and then molded.

Conventional molding as described above will be explained below with reference to the drawings.

FIG. 3 is a front view showing a closed state of conventional molding. In FIG. 3, 1 is a film capacitor body. Reference numeral 2 denotes an electrode extraction part for drawing out the electrodes of the film capacitor body 1 to the outside. Reference numerals 03.4 denote an upper mold and a lower mold for sealing the film capacitor body 1 with a predetermined space 6 provided therein. Reference numeral 6 denotes an ejector pin for extruding the molded film capacitor body 1 from the lower mold 4. Reference numeral 6 denotes a space in which the film capacitor main body 1 rotates, which is sealed by the upper and lower molds 3 and 4.

FIG. 4 is a side view of FIG. 3.

In the above structure, first, the film capacitor main body 1 is joined to the electrode extension part 2, and the electrode extension part 2 is positioned on the lower mold 4 and inserted between the upper mold 3, and the film capacitor main body 1 is sealed.

Resin is injected under pressure into the space 6 around the sealed film capacitor body 1, and is hardened and molded in a mold.

The formed film capacitor body 1 is pushed out from the lower die 4 by a needle pin 5.

Problems to be Solved by the Invention When molding a multilayer film capacitor with the above configuration, the resin pressure (80 kg/flIIP)
The mold temperature (175°C) has an adverse effect on the internal capacitor elements. - In molds with several surface lengths, differences in mold temperature and resin injection pressure occur depending on the position of the molding cavity, resulting in superior differences in product insulation resistance. However, in the state of a completed product, it is difficult to know in which molding cavity the product was molded and to pursue quality.

SUMMARY OF THE INVENTION In view of the above-mentioned drawbacks, the present invention aims to provide a packaging method for electronic components that allows for improved product quality after molding.

Means for Solving the Problems In order to solve the above problems, the packaging method of the present invention involves stamping characters, marks, etc. on the tip end surface of the ejector pin.

Function: With this configuration, a film capacitor is molded using a mold with characters, marks, etc. engraved on the end surface of the ejector pin, resulting in a finished product. It becomes possible to determine in which molding cavity of the molding die the finished product is a molded exterior laminated film capacitor.

EXAMPLE An example of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view showing the state of a molded exterior laminated film capacitor in an embodiment of the present invention during molding.

This is the capacitor body of a 111tl product N film capacitor. Reference numeral 12 denotes an electrode extension portion for extending the electrodes of the capacitor body 11 to the outside. Reference numerals 13 and 14 designate an upper mold and a lower mold for sealing the capacitor body 11 with a predetermined space provided around it. 16 is an ejector pin with letters and marks engraved at a depth of 0.06 mm on the tip surface, and the tip surface is 0.06 - o from the bottom of the lower mold 14.
, is set so that it protrudes 1mm. Reference numeral 16 denotes a space around the capacitor body 11 that is sealed by the upper and lower molds 13 and 14.

FIG. 2 is a side view of FIG. 1.

In the configuration of the embodiment described above, first, the capacitor main body 11 is joined to the electrode extension part 12, and the electrode extension part 12 is positioned in the lower mold 14, and then inserted between the upper mold 13 and the capacitor main body 11 is completely sealed. The resin is fully pressurized and injected into the space 16 around the sealed capacitor body 11.
We manufacture molded exterior laminated film capacitors that are hardened in a mold and engraved with characters and marks.

Effects of the Invention As described above, the present invention provides an electronic component with a mold exterior in which characters, marks, etc. are engraved, by molding a component body using a molding die in which characters, marks, etc. are engraved on the tip end surface of an ejector pin. can be manufactured, and the effect is similar to that of a dog.

[Brief explanation of drawings]

Fig. 1 is a front view showing a sealed state during molding of a molded exterior laminated film capacitor according to an embodiment of the present invention, Fig. 2 is a side view of Fig. 1, and Fig. 3 is a conventional sealing state during molding. FIG. 4 is a front view showing the state, and FIG. 4 is a side view of FIG. 3. 11... Capacitor body, 13... Upper mold, 14... Lower mold, 15... Ejector pin, 16... Space 〇Name of agent Patent attorney Toshio Nakao and 1 other person! 4
--- K# Figure 2 Figure 3

Claims (1)

[Claims] The mold that seals the component body with a predetermined space around it is provided with an ejector pin for extruding the packaged component body from the mold, and the end surface of the ejector pin is engraved with letters, marks, etc. 1. A method for packaging an electronic component, the method comprising: molding and packaging the component body by injecting a resin into the space formed by the mold.