JPS62238608A - Printed board packaging coil - Google Patents

Printed board packaging coil

Info

Publication number
JPS62238608A
JPS62238608A JP8153286A JP8153286A JPS62238608A JP S62238608 A JPS62238608 A JP S62238608A JP 8153286 A JP8153286 A JP 8153286A JP 8153286 A JP8153286 A JP 8153286A JP S62238608 A JPS62238608 A JP S62238608A
Authority
JP
Japan
Prior art keywords
coil
circuit board
lead
printed circuit
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8153286A
Other languages
Japanese (ja)
Inventor
Akio Tawada
多和田 章夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP8153286A priority Critical patent/JPS62238608A/en
Publication of JPS62238608A publication Critical patent/JPS62238608A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To enable a coil to be packaged easily to a printed board without deforming or folding lead sections, by providing the lead sections at both ends of a spirally formed coil section, integrally and circumferentially, and soldering a part of the circumferences of the lead sections to the print-circuit board. CONSTITUTION:A spirally formed coil section 1 is provided with lead sections 2 and 2 closely wound 360 deg. or more, at both ends thereof. The coil section 1 and the lead sections 2 are formed integrally and concentrically by winding spirally one line of wire stock. The circumferences of each lead section 2 provides a soldering section, which is soldered to the top face of a printed board 3 with solder 4. Accordingly, a part of the periphery of each lead section 2 is soldered to the printed board 2 while the coil section 1 is mounted on the top face of the printed board 3 with a part of the periphery thereof contacted with the board 3. In this manner, the coil can be packaged to the printed board by means of an automatic packaging apparatus while the productivity of coils also can be improved.

Description

【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) この発明は、電子部品とともにプリント基板に実装され
るプリント基板実装用コイルに関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a printed circuit board mounting coil that is mounted on a printed circuit board together with electronic components.

(従来の技術) 電気製品の小形化、軽量化に伴って電気回路を形成する
プリント基板も小形化され、プリント基板に対する電子
部品の高密度実装化が要望されている。したがって、プ
リント基板に対する電子部品の装着および半田付は作業
も従来の手作業から最近では自動化され、部品ストッカ
から電子部品を取出し、プリント基板の所定位置にその
電子部品を供給して実装することが人手を介することな
く自動的に行なえるようになった。この種の自動機械は
、電子部品をロボットアームに設けたチャックによって
把持し、そのままプリント基板に搬入して所定位置に供
給するのが基本的構成であり、プリント基板の狭いスペ
ースであっても電子部品を確実に供給することができ、
高密度実装化の可能である。
(Prior Art) As electrical products become smaller and lighter, printed circuit boards that form electric circuits are also smaller, and there is a demand for higher density mounting of electronic components on printed boards. Therefore, the work of mounting and soldering electronic components onto a printed circuit board has recently been automated from the traditional manual work, and it is now possible to take out electronic components from a component stocker, supply them to predetermined positions on a printed circuit board, and mount them. This can now be done automatically without any human intervention. The basic structure of this type of automatic machine is that electronic components are gripped by a chuck installed on a robot arm, and then transported directly onto a printed circuit board and supplied to a predetermined position. We can reliably supply parts,
High-density packaging is possible.

ところが、集積回路チップ、抵抗素子などの電子部品の
ように本体部と、その本体部から突出しているリード部
を有する場合には、本体部をチャッキングすることによ
って確実に把持することができるが、第4図乃至第6図
に示すような空芯コイルの場合にはその形状に特異性が
あり、かつ不定形であるためチャックよって把持するこ
とが困難である。すなわち、aはコイル部であり、この
コイル部aの両端にはリード部す、bが同方向に導出し
ている。したがって、コイル部aを把持することができ
たとしてもコイル部aから導出するリード部す、bが容
易に変形してしまい、プリント基板の孔に挿入すること
が困難で、挿入ミスが起きることが多い。
However, when an electronic component such as an integrated circuit chip or a resistor element has a main body and a lead protruding from the main body, it is possible to securely grip the main body by chucking the main body. In the case of air-core coils as shown in FIGS. 4 to 6, their shapes are unique and irregular, making it difficult to grip them with a chuck. That is, a is a coil portion, and lead portions S and B are led out in the same direction at both ends of this coil portion A. Therefore, even if it is possible to grasp the coil part a, the lead parts S and B led out from the coil part A are easily deformed, making it difficult to insert them into the holes of the printed circuit board, and causing insertion errors. There are many.

また、第6図に示す空芯コイルのリード部b、bを第7
図に示すように、プリント基板Cの上面に沿わせて半田
dによって固定する場合もあるが、プリント基板Cにコ
イルの装着するスペースを広く必要とする欠点がある。
In addition, the lead parts b and b of the air-core coil shown in FIG.
As shown in the figure, the coil may be fixed along the top surface of the printed circuit board C with solder d, but this has the disadvantage that a large space is required for mounting the coil on the printed circuit board C.

したがって、コイルの場合には自動実装を採用せずに、
後工程で作業者の手作業によってコイルのリード部をプ
リント基板の孔に挿入しているのが実情である。このた
め、工程数が増えるとともに、特にプリント基板に対し
て多数のコイルを実装する必要がある場合には多くの工
数を要している。また、コイルを手作業によってプリン
ト基板に実装するにしてもコイルから導出するリード部
が変形したり、折曲していた場合には矯正しながら挿入
する必要があり、面倒な作業となっている。
Therefore, in the case of coils, without adopting automatic mounting,
In reality, the coil leads are manually inserted into the holes in the printed circuit board in a later process. For this reason, the number of steps increases, and especially when it is necessary to mount a large number of coils on a printed circuit board, a large number of man-hours are required. Furthermore, even if the coil is mounted on a printed circuit board manually, if the lead part leading out from the coil is deformed or bent, it is necessary to correct it while inserting it, which is a troublesome process. .

(発明が解決しようとする問題点) この発明は、前記事情に着目してなされたもので、その
目的とするところは、リード部の変形や折曲の心配がな
く、プリント基板に対する実装が容易に行なえるととも
に、製造性および取扱いの容易なプリント基板実装用コ
イルを提供することにある。
(Problems to be Solved by the Invention) This invention has been made with attention to the above-mentioned circumstances, and its purpose is to facilitate mounting on a printed circuit board without worrying about deformation or bending of the lead portion. It is an object of the present invention to provide a printed circuit board mounting coil that can be easily manufactured and handled.

〔発明の構成〕[Structure of the invention]

(問題点を解決するための手段及び作用)この発明は、
コイル状に成形されたコイル部の両端部に、このコイル
部と一体に円周方向に亘ってリード部を設け、このリー
ド部の円周方向の一部をプリント基板に対する半田付は
部とし、プリント基板の孔にリード部を挿入する作業を
不要にしたことにある。
(Means and effects for solving the problem) This invention has the following features:
A lead part is provided at both ends of a coil part formed into a coil shape and extends in the circumferential direction integrally with the coil part, and a part of the lead part in the circumferential direction is used as a part for soldering to a printed circuit board, This eliminates the need to insert the lead part into the hole in the printed circuit board.

(実施例) 以下、この発明の各実施例を図面に基づいて説明する。(Example) Hereinafter, each embodiment of the present invention will be described based on the drawings.

第1図は第1の実施例を示すもので、1はコイル状に成
形したコイル部である。このコイル部1の両端部には3
60′″以上密に巻回したリード部2.2が設けられて
いる。このコイル部1とリード部2.2とは1本の素線
を螺旋状に巻回することによって一体で同一径に形成さ
れている。そして、このリード部2.2の円周部が半田
付は部として形成され、第2図に示すようにプリント基
板3の上面に半田4によって半田付けされる。したがっ
て、リード部2.2の外周一部がプリント基板3に半田
付けされ、従来のようにプリント基板の孔にリード部を
挿入することなく、コイル部1はその外周面の一部がプ
リント基板3の上面に接触状態に装着される。
FIG. 1 shows a first embodiment, in which numeral 1 denotes a coil portion formed into a coil shape. There are 3
A lead part 2.2 is provided which is tightly wound with a diameter of 60'' or more.The coil part 1 and the lead part 2.2 are integrally formed by winding one strand of wire in a spiral shape and have the same diameter. The circumferential part of this lead part 2.2 is formed as a soldering part, and is soldered to the upper surface of the printed circuit board 3 with solder 4 as shown in FIG. A part of the outer periphery of the lead part 2.2 is soldered to the printed circuit board 3, and a part of the outer periphery of the coil part 1 is soldered to the printed circuit board 3 without inserting the lead part into a hole in the printed circuit board as in the conventional case. It is mounted in contact with the top surface.

第3図は第2の実施例を示すもので、コイル部1の両端
部に、そのコイル部1より大径のリード部2.2を一体
に設けたものである。プリント基板3に対する装着方法
は第1の実施例と同一であるが、コイル部1よりリード
部2.2が大径に形成されているために、リード部2.
2をプリント基板3に対して半田4によって固定した場
合、コイル部1はプリント基板3の上面と離間して取付
けられる。
FIG. 3 shows a second embodiment, in which lead portions 2.2 having a larger diameter than the coil portion 1 are integrally provided at both ends of the coil portion 1. The mounting method on the printed circuit board 3 is the same as in the first embodiment, but since the lead portion 2.2 is formed to have a larger diameter than the coil portion 1, the lead portion 2.
2 is fixed to the printed circuit board 3 with solder 4, the coil portion 1 is mounted apart from the top surface of the printed circuit board 3.

前述のように構成されたコイルは、プリント基板3に対
して自動実装する場合には、自動実装機によってコイル
部1をチャキングすることができ、しかもリード部2.
2に方向性が無いためにチャキングおよびプリント基板
3に対する供給が容易である。
When the coil configured as described above is automatically mounted on the printed circuit board 3, the coil portion 1 can be chucked by an automatic mounting machine, and the lead portion 2.
Since 2 has no directionality, chucking and supplying to the printed circuit board 3 are easy.

なお、前記実施例においては、空芯コイルについて説明
したが、コイル部に芯を有したコイルであっても適用で
きる。
In the above embodiments, an air-core coil was described, but the present invention can also be applied to a coil having a core in the coil portion.

(発明の効果) 以上説明したように、この発明によれば、コイル部の両
端部に円周方向にリード部を設けたから、プリント基板
に対してコイルを実装する場合においてもコイルに方向
性がなく、リード部をプリント基板の孔に挿入する面倒
な作業も不要となり、取扱いも容易である。したがって
、自動実装機によるプリント基板への実装が可能となる
とともに、コイルの製造性も向上するという効果がある
(Effects of the Invention) As explained above, according to the present invention, since the lead portions are provided in the circumferential direction at both ends of the coil portion, the directionality of the coil is maintained even when the coil is mounted on a printed circuit board. Therefore, there is no need for the troublesome work of inserting the lead part into the hole of the printed circuit board, and the handling is easy. Therefore, it is possible to mount the coil on a printed circuit board using an automatic mounting machine, and the coil manufacturability is also improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図および第2図はこの発明の第1の実施例を示すも
ので、第1図はコイルの正面図および側面図、第2図は
コイルのプリント基板に対する実装状態を示す側面図、
第3図はこの発明の第2の実施例を示すコイルの正面図
および側面図、第4図乃至第6図は従来のコイルを示す
正面図および側面図、第7図は第6図に示すコイルをプ
リント基板に実装した状態の側面図である。 1・・・コイル部、2・・・リード部、3・・・プリン
ト基板。 出願人代理人 弁理士 鈴江武彦 第1図 第2WJ 第3図
1 and 2 show a first embodiment of the present invention, in which FIG. 1 is a front view and a side view of the coil, and FIG. 2 is a side view showing how the coil is mounted on a printed circuit board.
3 is a front view and a side view of a coil showing a second embodiment of the present invention, FIGS. 4 to 6 are a front view and a side view of a conventional coil, and FIG. 7 is shown in FIG. 6. FIG. 3 is a side view of the coil mounted on the printed circuit board. 1... Coil part, 2... Lead part, 3... Printed circuit board. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 2 WJ Figure 3

Claims (2)

【特許請求の範囲】[Claims] (1)コイル状に成形されたコイル部の両端部に、この
コイル部と一体に円周方向に亘ってリード部を設け、こ
のリード部の円周方向の−部をプリント基板に対する半
田付け部としたことを特徴とするプリント基板実装用コ
イル。
(1) A lead part is provided at both ends of the coil part molded into a coil shape, extending in the circumferential direction integrally with the coil part, and the negative part of the lead part in the circumferential direction is soldered to the printed circuit board. A coil for printed circuit board mounting characterized by the following.
(2)リード部は、コイル部より大径であることを特徴
とする特許請求の範囲第1項記載のプリント基板実装用
コイル。
(2) The printed circuit board mounting coil according to claim 1, wherein the lead portion has a larger diameter than the coil portion.
JP8153286A 1986-04-09 1986-04-09 Printed board packaging coil Pending JPS62238608A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8153286A JPS62238608A (en) 1986-04-09 1986-04-09 Printed board packaging coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8153286A JPS62238608A (en) 1986-04-09 1986-04-09 Printed board packaging coil

Publications (1)

Publication Number Publication Date
JPS62238608A true JPS62238608A (en) 1987-10-19

Family

ID=13748922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8153286A Pending JPS62238608A (en) 1986-04-09 1986-04-09 Printed board packaging coil

Country Status (1)

Country Link
JP (1) JPS62238608A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231518A (en) * 2008-03-23 2009-10-08 Ogawa Electric Inc Wire-wound inductor and mounting method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009231518A (en) * 2008-03-23 2009-10-08 Ogawa Electric Inc Wire-wound inductor and mounting method therefor

Similar Documents

Publication Publication Date Title
JPH058914U (en) Coil parts
JPS625618A (en) Chip inductor
JP2007273757A (en) Method of manufacturing coil component
JP2006013054A (en) Method for manufacturing smd coil package
JPS62238608A (en) Printed board packaging coil
JP2776898B2 (en) Manufacturing method of molded electronic parts
JPH0411984Y2 (en)
JP2782799B2 (en) Taping material for electronic components
JPH0287609A (en) Mounting of toroidal-type coil body
JPH03289105A (en) Choke coil with terminal mount and manufacture thereof
JP2952049B2 (en) Method and apparatus for assembling printed circuit board
JP2787592B2 (en) Bead inductor and manufacturing method thereof
JPH0748439B2 (en) Inductor manufacturing method
JPH0441843B2 (en)
JPH0627929Y2 (en) Inductance element
JPS5940738Y2 (en) coil
JPH098434A (en) Electronic circuit unit and its manufacture
JPH0720708U (en) Mounting structure for antenna coil device
JPH085533Y2 (en) Balun coil
JPS6336696Y2 (en)
JPH0745999A (en) Positioning method and device
JPS61214404A (en) High frequency coil
JPH02244700A (en) Mounting of electronic component
JPS5943084B2 (en) Manufacturing method of electronic components
JPS6315668A (en) Electronic circuit device