JPS5943084B2 - Manufacturing method of electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing an electronic component such as various types of capacitors in which lead wires are vertically taped in the same direction.

In recent years, there has been a strong demand among electronic device manufacturers to save labor when assembling the large number of electronic components they use onto printed circuit boards.In response, electronic components wrapped in tape are automatically inserted into predetermined positions on printed circuit boards using automatic insertion devices. This method has become widely adopted.

In order to realize this method, the so-called taping of electronic parts, in which electronic parts are packaged with taping and shipped, is a necessary prerequisite. RC-
A standard called 10O8 "Taping Dimensions for Electronic Components" has been established, and standardization is progressing. As a premise for explaining the present invention by giving examples, the state of taped electronic components will be explained using drawings.

That is, FIG. 1 is a plan view, FIG. 2 is a side view, and FIG. 3 is a bottom view. In these figures, 1 is an electronic component main body, 2 is a lead wire, 3 is a mount tape, 4 is an adhesive tape, and 5 is a hole for feeding the tape. As can be seen from these figures, the electronic component is fixed by sandwiching lead wires 2, 2 with a mount tape 3 and an adhesive tape 4. The spacing between adjacent feed holes 5 and the spacing between electronic components are maintained at predetermined dimensions, and the electronic component bodies 1 are aligned to have a constant dimension from the upper end of the backing tape 3. . In order to insert the electronic component taped in the state shown in Fig. 1 into a predetermined position on a printed circuit board using an automatic insertion device, the lead wires 2, 2 are cut at predetermined positions A, A, and then inserted. be. The cutting positions A, A of the lead wires 2, 2 are usually located close to the upper edge of the mount 3, as shown in FIG. By the way, conventionally, the pitch between two lead wires of an electronic component whose lead wires are in the same direction is the distance between the holes of the printed circuit board into which they are inserted (the distance between the holes of the printed circuit board is 2.5
mm, 5mm, 7.5mm, etc.), if the lead wires do not match the pre-manufactured electronic components to the specified lead spacing, then Previously, methods have been used, such as taping with a special taping machine, or taping only lead wires having the required lead spacing in advance, and then connecting electronic component elements to the lead wires.

The former method, ie, a method in which lead wires of a previously manufactured electronic component are deformed so as to have a predetermined lead spacing and then taped, will be explained with reference to FIGS. 4 to 6. FIG. 4 is a plan view of an electronic component before lead wire deformation processing, FIG. 5 is an electronic component with lead wire deformation processing, and FIG. 6 is a plan view of a large number of these electronic components taped together.
The process order is in the order of drawing numbers. In these figures, the reference numerals are the same as those described above. The disadvantages of this method are that the leads must be deformed individually for each electronic component, and that a special taping machine is required to tape the electronic components whose leads have been deformed. Next, the latter method, that is, a method in which only the lead wires having the required lead spacing are taped in advance and then the electronic component element is connected to the lead wires will be explained with reference to the drawings. FIG. 7 is a plan view showing taping of lead wires having the necessary lead spacing, in which the lead wires 2, 2 are connected by a curved portion 6 and have tip portions 7, 7. FIG. 8 shows an electronic component element 8 connected to lead wire tips 7, 7.
FIG. 9 is a plan view showing a state in which the electronic component element 8 is sheathed and completed as the electronic component main body 1, and the curved portion 6 of the lead wire is cut. Although this method is effective as a method for manufacturing ceramic capacitors, it is not applicable to general electronic components. As described above, the present invention improves the conventional method of deforming the lead wires of a pre-manufactured electronic component so as to have a predetermined lead spacing, and then taping the lead wires. This method is characterized by deforming the lead wires so that the lead spacing of the taped electronic component becomes a predetermined dimension.

That is, after taping an unfinished electronic component or a completed electronic component, the lead wire is deformed in the state X while the electronic component is being taped. In summary, in the present invention, the conventional process of completing a single electronic component → lead wire deformation → taping is
By following the steps of taping the unfinished product → completing the main body processing → completing the lead wire deformation process, or taping the finished product → completing the lead wire deformation process, the single product after the lead wire deformation process, which was seen with conventional methods, can be improved. It prevents risks such as inconvenience in handling, reduction in dimensional accuracy, and product contamination, eliminates the need for a taping machine for deformed lead wire products, and allows relatively many parts of the manufacturing process to be taped. The aim is to improve efficiency and significantly reduce costs. Next, embodiments of the present invention will be described with reference to the drawings. First, the case of taping an unfinished product will be explained. FIG. 10 is a plan view showing an unfinished electronic component, for example, an electronic component without exterior packaging, and FIG. 11 is a top view of the same. In these figures, 11 is an electronic component element without exterior packaging, and 12 is
is a bleed line.

FIG. 12 is a plan view showing taping of the unfinished (unpackaged) electronic component shown in FIG. 10, and FIG. 13 is a top view of the same. The reference numerals are the same as in the previous drawings. Next, the electronic component element 11 which has not been packaged can be subjected to coating or other processing while remaining in the taped state. Appropriate packaging materials and packaging methods can be freely selected from among many known techniques. Since it is in a taped state, it is suitable for carrying out the packaging process continuously or intermittently, which is much more efficient than applying packaging to individual electronic components. FIG. 14 is a plan view of the electronic component after completion of the packaging process, and FIG. 15 is a top view of the same.
Figure 16 shows the lead wire 12 of the electronic component shown in Figure 14.
, 12 are modified so that the lead spacing is set to a predetermined dimension. The element 11 shown in FIG. 14 to which the outer device 3 is applied is again referred to as an electronic component body 14 in FIG. Codes other than 14 are as described above.

For example, the deformation process shown in FIG.
This can be done by inserting a suitable jig into the inside and outside of parts 2 and 12 and applying pressure. In this case, it should be noted that due to the mechanism of the automatic insertion device used when inserting electronic components into a printed circuit board, when the electronic component is taped, the top end of the backing tape 3 is
The distance to the bottom of 4 (indicated by L in Figure 16) is:
It needs to be within a certain size range. As can be seen from FIG. 16, by deforming the lead wire, the above distance changes and becomes shorter. Therefore, the above-mentioned distance before lead wire deformation must be set in consideration of the reduction caused by the deformation. Also, when inserting taped electronic components into a printed circuit board using an automatic insertion device,
As described above, since the lead wires 12, 12 are cut at points A, A near the upper end of the mount 3, the lower part of the deformed portion of the lead wires 12, 12 is preferably lower than A, A. It is necessary to process the portion placed on the mount 3.

This is because the lead wires 12, 12 cut at A and A need to be parallel to each other at a set interval. Fig. 16 shows the case where the lead wire spacing is smaller than before processing, but in some cases, the lead wire spacing may be made larger than before processing as shown in Fig. 17. It's easy.

Figure 17 shows the lead wire 12 of the electronic component shown in Figure 14.
, 12 is modified so that the lead spacing is set to a predetermined dimension. Of course, the shape of the lead wire deformation is not limited to that shown in FIGS. 16 and 17, and many other shapes can be adopted. Next, as an example of the present invention, a case where a finished product is taped will be described.

FIG. 18 is a plan view of the completed electronic component (however, the lead wire spacing is not set to a predetermined dimension). In the figure, 12 is a lead wire, and 14 is an electronic component body. FIG. 19 is a plan view of the electronic component shown in FIG. 18 taped. The one taped like this is the 14th
Since it is similar in appearance to the one shown in the figure, the 16th
The lead wire 12 is deformed in the same manner as described in the figure or FIG. 17. As described in the above embodiments, according to the method of the present invention, in the manufacturing process of electronic components in which lead wires are vertically taped in the same direction, unfinished electronic components or finished electronic components are taped and In this case, after the main body of the electronic component is processed, the main body of the electronic component is deformed so that the distance between the lead wires becomes a predetermined dimension in the taped state of X.

As a result, compared to conventional methods, relatively many parts of the manufacturing process can be processed while taped.
This has the effect of improving manufacturing efficiency and reducing manufacturing costs.

[Brief explanation of drawings]

Figure 1 is a plan view of the taped electronic component, Figure 2 is a side view, Figure 3 is a bottom view, Figure 4 is a plan view of the electronic component, and Figure 5 is an electronic component with lead wires processed and modified. A plan view of the parts, Fig. 6 is a plan view of the taped electronic component, Fig. 7 is a plan view of only the lead wires taped, and Fig. 8 is a plan view of the taped electronic component.
The figure is a plan view showing a state in which electronic component elements are connected, FIG. 9 shows a state in which the element is packaged and the curved part of the lead wire is cut, FIGS. 10 to 19. Embodiment of the present invention, FIG. is a plan view showing an unfinished electronic component, FIG. 11 is a top view,
Fig. 12 is a plan view of the unfinished electronic component taped, Fig. 13 is a top view, Fig. 14 is a plan view of the electronic component after the packaging process is completed, Fig. 15 is a top view, and Fig. 16 is a lead. FIG. 17 is a plan view of an electronic component obtained by deforming the lead wire, FIG. 18 is a plan view of the electronic component, and FIG. 19 is a plan view of the taped electronic component. In these figures, 1... Electronic component body, 2... Lead wire, 3... Backing tape, 4... Adhesive tape, 5... ...hole for tape feeding, 6... lead wire curved part,
7...Lead wire tip, 8...Electronic component element, 11...Element without exterior coating, 1
2...Lead wire, 13...Exterior, 14
...Electronic parts body.

Claims (1)

[Claims] 1. In the manufacturing process of an electronic component in which the lead wires are vertically taped in the same direction, the lead wires are deformed so that the lead wire spacing of the electronic component becomes a predetermined dimension while the tape remains in place. Method of manufacturing electronic components.