JPS62238091A - Processing head for laser beam machine - Google Patents
Processing head for laser beam machineInfo
- Publication number
- JPS62238091A JPS62238091A JP61079163A JP7916386A JPS62238091A JP S62238091 A JPS62238091 A JP S62238091A JP 61079163 A JP61079163 A JP 61079163A JP 7916386 A JP7916386 A JP 7916386A JP S62238091 A JPS62238091 A JP S62238091A
- Authority
- JP
- Japan
- Prior art keywords
- condenser lens
- holder
- lens holder
- processing head
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012423 maintenance Methods 0.000 abstract description 2
- 239000003566 sealing material Substances 0.000 abstract description 2
- 230000005540 biological transmission Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1494—Maintenance of nozzles
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
し産業上の利用分野〕
本発明は、例えば金属をレーザビームで切断、溶接ある
いは表面処理するレーザ加工装置、特にその加工ヘッド
に関てるものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a laser processing apparatus for cutting, welding, or surface treating metal, for example, with a laser beam, and particularly to a processing head thereof.
第2図は、レーザ加工装置の一例を示す模式図である。 FIG. 2 is a schematic diagram showing an example of a laser processing device.
図において、(1)はレーザ発振器、(2)はレーザ発
振器(11から発振したレーザビーム、(3)はレーザ
ビーム(2)を反射させて直角方向に方向を変えるミラ
ー、(4)はレーザビーム(2)を集光させる集光レン
ズ、(5)ハ集光レンズ(4)の焦点位置に置かれた金
属よりなる被加工材である。In the figure, (1) is a laser oscillator, (2) is a laser beam emitted from a laser oscillator (11), (3) is a mirror that reflects the laser beam (2) and changes its direction at right angles, and (4) is a laser beam. A condensing lens that condenses the beam (2), and (5) a workpiece made of metal placed at the focal point of the condensing lens (4).
第3図は例えば特開昭54−131543号公報に記載
された従来のレーザ加工装置の加工ヘッドを示す断面図
である。(6)及び(7)ハそれぞれ内周体及び外筒体
を構成する加工ノズル、(8)は加工ノズル(6) 、
(7)の高さ調整を行なうためこれらの上部に設けら
れたスペーサ、(9)は集光レンズ、αOは集光レンズ
(9)を取付ける集光レンズホルダーである。FIG. 3 is a sectional view showing a processing head of a conventional laser processing apparatus disclosed in, for example, Japanese Patent Laid-Open No. 131543/1983. (6) and (7) are processing nozzles that constitute the inner circumferential body and the outer cylindrical body, respectively; (8) is the processing nozzle (6);
(7) is a spacer provided above these for height adjustment, (9) is a condenser lens, and αO is a condenser lens holder to which the condenser lens (9) is attached.
α11ハ集光レンズ(9)を集光レンズホルダーαdに
固定するための固定ネジ、CI2警工伝送管、C10は
加工ノズル(6)、 (7)側のセンターガスAと伝送
管(6)側のシールドガスBfJ″−混入しないように
てるため、集光レンズ(9)の周縁上部と集光ホルダー
αOの間に設けられたり一ル材、α4はシールドガスB
が集光レンズホルダーαOと伝送管αりの取付部から外
部へ漏れないようKするため、伝送管(2)と集光レン
ズホルダー(10との間で伝送管(2)側に投げられた
Oリングである。α11C is a fixing screw for fixing the condenser lens (9) to the condenser lens holder αd, CI2 transmission pipe, C10 is the processing nozzle (6), and the center gas A and transmission pipe (6) on the (7) side In order to prevent side shielding gas BfJ'' from being mixed in, a metal material is provided between the upper peripheral edge of the condensing lens (9) and the condensing holder αO, α4 is the shielding gas B
In order to prevent the leakage from the attachment part of the condenser lens holder αO and transmission tube α to the outside, it was thrown to the transmission tube (2) side between the transmission tube (2) and the condenser lens holder (10). It's an O-ring.
次に動作について説明でる。レーザ発振器(1)で発生
したレーザビーム(2)t2ミラー(3)で反射され、
集光レンズ(4)で被加工材(5)上に集光されて被加
工材(5)を溶融する。このとぎ被加工材(5)(又は
加工ヘッド)を動かてことにより、被加工材(5)を所
定の形状に加工することができる。しかしながら加工の
際、溶融した被加工材(5)の蒸気やスパッタが加工ノ
ズル(6) 、 (7)より内部に入り込み、集光レン
ズ(9)に付着でる場合がある。このためレーザビーム
(2)が集光レンズ(9)で吸収されてしまい、集光レ
ンズ(9)を交換することが必要になる。しかしながら
集光レンズ(9)の交換には、まずスペーサ(8)より
も下部の加工ノズル(6)・(7)をはずし、次に固定
ネジ(tnをはずした後に集光レンズ(9)を新しい集
光レンズと交換して再組立を行なわなければならなかっ
た。Next, I will explain the operation. The laser beam (2) generated by the laser oscillator (1) is reflected by the t2 mirror (3),
The light is focused onto the workpiece (5) by the condenser lens (4) and melts the workpiece (5). By moving this sharpened workpiece (5) (or processing head), the workpiece (5) can be processed into a predetermined shape. However, during processing, steam or spatter from the molten workpiece (5) may enter the interior through the processing nozzles (6), (7) and adhere to the condenser lens (9). For this reason, the laser beam (2) is absorbed by the condensing lens (9), making it necessary to replace the condensing lens (9). However, to replace the condenser lens (9), first remove the processing nozzles (6) and (7) below the spacer (8), then remove the fixing screws (tn), and then replace the condenser lens (9). I had to replace it with a new condensing lens and reassemble it.
、 上記のように構成した従来のレーザ加工装置の加工
ヘッドによれば、レンズ交換時にノズル等のレンズ以外
の部品を取りヲ工ずさねばならず、操作に非常な手間が
かかるという問題があった。According to the processing head of the conventional laser processing device configured as described above, there is a problem in that when replacing the lens, parts other than the lens, such as the nozzle, have to be removed, and the operation is very time-consuming. Ta.
本発明は、上記のような問題点を解決するためになされ
たもので、集光レンズを容易に交換できるレーザ加工装
置の加工ヘッドを得ることを目的とする。The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to obtain a processing head for a laser processing device whose condensing lens can be easily replaced.
本発明は上記の目的を達成でるためになされたもので、
集光レンズホルダを差込み式として容易に交換できるよ
うにしたレーザ加工装置の加工ヘッドを提供するもので
ある。The present invention has been made to achieve the above objects,
The present invention provides a processing head for a laser processing device in which a condensing lens holder is of an insertable type and can be easily replaced.
本発明におけるレーザ加工装置の加工ヘッドは、集光レ
ンズホルダーを予備品と差替えて集光レンズを交換てる
。In the processing head of the laser processing apparatus according to the present invention, the condenser lens is replaced by replacing the condenser lens holder with a spare part.
第1図は本発明の実施例を示す断面図である。 FIG. 1 is a sectional view showing an embodiment of the present invention.
なお、第6図と同じ機能の部分には同じ記号を付し説明
を省略する。翰ハ加工ヘッドの加工ノズル、ezl)h
tササイドカスノズル及びワイヤ供給用ノズルを持つノ
ズルホルダーである。また(イ)、四&工それぞれ止め
ねじ及び袋ナツト、(財)は止めねじ@を緩め、袋ナラ
)Hを回転させることにより加工ノズル翰の上下動を可
能とてるサイドガス用ノズル(2)の上部に設けられた
スライダーである。(イ)は図中右方向に取出し自在で
、内部においてシール材(至)により集光レンズ(至)
を固定した差込み式の集光レンズ(2)を固定した差込
み式の集光レンズホルダーである。(イ)は集光レンズ
ホルダー(2)を嵌合して固定する凹部を有でるホルダ
ー枠、@は集光レンズホルダー−の図中右側に取付けら
れ集光レンズホルダー(イ)を■方向に引き出てための
取手である。Note that parts having the same functions as those in FIG. 6 are given the same symbols, and explanations thereof will be omitted. Processing nozzle of Kanha processing head, ezl)h
This is a nozzle holder that has a t-suricide nozzle and a wire supply nozzle. In addition, (A) is a side gas nozzle (2) that enables the vertical movement of the processing nozzle by loosening the setscrew and cap nut for 4 and 4, and rotating the cap nut (H). ) is a slider provided at the top of the page. (A) can be taken out to the right in the figure, and the condenser lens (to) can be removed by sealing material (to) inside.
This is a plug-in type condensing lens holder to which a plug-in type condensing lens (2) is fixed. (A) is a holder frame with a recess into which the condenser lens holder (2) is fitted and fixed; @ is attached to the right side of the condenser lens holder in the figure; It is a handle for pulling out.
翰及び凶ハホルダー枠翰に嵌込まれ、センターガスAや
伝送管(2)のシールドガスBが外部へ漏れないように
するための0リングである。なお(至)・01)・(2
)はそれぞれ溶接部が酸化されないようにするため、セ
ンターガスAがノズルホルダー(4)等の取付部から外
部へ漏れないようにした0リングである。This is an O-ring that is fitted into the frame of the holder and the holder frame to prevent the center gas A and the shield gas B of the transmission pipe (2) from leaking to the outside. Furthermore (to)・01)・(2
) is an O-ring that prevents the center gas A from leaking to the outside from the attachment part of the nozzle holder (4), etc., in order to prevent the welding part from being oxidized.
上記のように構成した本発明の詳細な説明すれば次の通
りである。集光レンズホルダー(ハ)を取り変えるには
、まず取手−,を■方向に引張り、集光レンズホルダー
翰を加工ヘッドから取外す。次に新しい集光レンズの取
付けられた集光レンズホルダーな@方向に挿入する。こ
のようにして集光レンズホルダーを差替えることにより
、蒸気やスパッタ等により汚れた集光レンズを新しい集
光レンズと交換することができる。A detailed explanation of the present invention configured as above is as follows. To replace the condensing lens holder (c), first pull the handle -, in the direction ■ to remove the condensing lens holder from the processing head. Next, insert the new condenser lens into the condenser lens holder in the @ direction. By replacing the condensing lens holder in this way, a condensing lens contaminated by steam, spatter, etc. can be replaced with a new condensing lens.
なお、上記の実施例でハ集光レンズホルダー(ハ)をホ
ルダー枠翰と嵌合により固定する場合を示したが、本発
明はこれに限定するものではなく、例・えばホルダー枠
翰にレール又はカイトを設けることにより、集光レンズ
ホルダーを固定してもよい。In the above embodiment, a case was shown in which the condenser lens holder (C) was fixed by fitting with the holder frame, but the present invention is not limited to this, and for example, a rail may be attached to the holder frame. Alternatively, the condensing lens holder may be fixed by providing a kite.
以上の説明から明らかなように、本発明によれば、集光
レンズホルダーを差込み式としたので、集光レンズ交換
に要するメンテナンスを容易かつ短時間に行なうことの
出来る顕著な効果がある。As is clear from the above description, according to the present invention, since the condenser lens holder is of an insert type, there is a remarkable effect that maintenance required for exchanging the condenser lens can be performed easily and in a short time.
$1図は本発明の実施例を示す断面図、第2図は従来の
レーザ加工装置の一例を示す模式図、第3図は従来のレ
ーザ加工装置の加工ヘッドの一例を示す断面図である。
(9)・・・集光レンズ、翰・・・集光レンズホルダー
。
なお各図中、同一符号は同一または相当部分を示てもの
とでる。
代理人 弁理士 佐 藤 正 年
第1図Figure 1 is a cross-sectional view showing an embodiment of the present invention, Figure 2 is a schematic diagram showing an example of a conventional laser processing device, and Figure 3 is a cross-sectional view showing an example of a processing head of a conventional laser processing device. . (9)...Condensing lens, wire...Condensing lens holder. In each figure, the same reference numerals indicate the same or equivalent parts. Agent Patent Attorney Tadashi Sato Figure 1
Claims (1)
で被加工材上に集光するレーザ加工装置の加工ヘッドに
おいて、前記集光レンズの集光レンズホルダを差込み式
としたことを特徴とするレーザ加工装置の加工ヘッド。A processing head of a laser processing device that focuses a processing laser beam generated by a laser oscillator onto a workpiece using a condensing lens, characterized in that the condensing lens holder of the condensing lens is of an insertable type. Processing head of processing equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61079163A JPS62238091A (en) | 1986-04-08 | 1986-04-08 | Processing head for laser beam machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61079163A JPS62238091A (en) | 1986-04-08 | 1986-04-08 | Processing head for laser beam machine |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62238091A true JPS62238091A (en) | 1987-10-19 |
JPH0450104B2 JPH0450104B2 (en) | 1992-08-13 |
Family
ID=13682287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61079163A Granted JPS62238091A (en) | 1986-04-08 | 1986-04-08 | Processing head for laser beam machine |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62238091A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020188620A1 (en) * | 2019-03-15 | 2020-09-24 | ヤマザキマザック株式会社 | Laser processing device, and method for attaching and detaching cartridge of laser processing device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60231586A (en) * | 1984-03-26 | 1985-11-18 | ベ−イ−ア−エス・ホルシユンクス− ウント・エントビツクルンクスラボア・フユア・アンゲバンテ・シユトラ−ルテヒニツク・ゲ−エムベ−ハ− | Processing equipment using high output density energy beam such as co2 laser beam |
-
1986
- 1986-04-08 JP JP61079163A patent/JPS62238091A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60231586A (en) * | 1984-03-26 | 1985-11-18 | ベ−イ−ア−エス・ホルシユンクス− ウント・エントビツクルンクスラボア・フユア・アンゲバンテ・シユトラ−ルテヒニツク・ゲ−エムベ−ハ− | Processing equipment using high output density energy beam such as co2 laser beam |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020188620A1 (en) * | 2019-03-15 | 2020-09-24 | ヤマザキマザック株式会社 | Laser processing device, and method for attaching and detaching cartridge of laser processing device |
Also Published As
Publication number | Publication date |
---|---|
JPH0450104B2 (en) | 1992-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |