CN110497097A - Laser cutting device - Google Patents
Laser cutting device Download PDFInfo
- Publication number
- CN110497097A CN110497097A CN201910726851.7A CN201910726851A CN110497097A CN 110497097 A CN110497097 A CN 110497097A CN 201910726851 A CN201910726851 A CN 201910726851A CN 110497097 A CN110497097 A CN 110497097A
- Authority
- CN
- China
- Prior art keywords
- laser
- blow device
- laser emitter
- workpiece
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Abstract
The application provides a kind of laser cutting device.The laser cutting device includes laser emitter (1) and the first blow device (2), laser emitter (1) is located at the first side of workpiece to be cut (3), first blow device (2) is located at second side of workpiece to be cut (3), first side and second side are opposite, cutting position of the air-out direction of first blow device (2) towards laser emitter (1) on workpiece to be cut (3), and first blow device (2) air-out direction and laser emitter (1) Laser emission direction between in default angle, the default angle is greater than 0 °.According to the laser cutting device of the application, generated burr in laser cutting process can be effectively removed, reduces processing cost, improves processing efficiency.
Description
Technical field
This application involves technical fields of mechanical processing, and in particular to a kind of laser cutting device.
Background technique
Laser be 20th century since after nuclear energy, computer, semiconductor, the another invention of great significance of the mankind is referred to as " most fast
Knife ", " most quasi- ruler ", " most bright light ".Laser application is very extensive, there is laser marking, laser welding, laser cutting, optical fiber
Communication, laser ranging, laser radar, laser weapon, laser disc, laser rectify view, laser beautifying, laser scanning etc..
Laser cutting machine is the one-time process revolution of panel beating, is " processing center " in metal plate and product processing；Swash
Light cutting machine flexibility degree is high, and cutting speed is fast, produces high-efficient, and it is short that product produces the period.
In general, the cutting of the metal materials such as the carbon steel sheet within 12mm, stainless steel plate within 10mm is recommended to use sharp
Light cutting machine.Laser cutting machine is without cutting force, and process without deformation: without tool wear, adaptability for materials is good: either simply still
Complex parts, can be with laser once accurate rapid shaping cutting: its joint-cutting be narrow, and cut quality is good, high degree of automation, behaviour
Vertical simplicity, labor intensity is low, does not pollute: cutting automatic nesting, jacking can be achieved, further improve stock utilization, out
It is low to produce capital, it is good in economic efficiency.
Laser cutting is the high power density laser beam irradiation workpiece using line focus, melts illuminated material rapidly
Change, vaporization, ablation reach burning point, while blowing down melt substance by with the coaxial high-speed flow of light beam, to realize work
Part is cut open.Laser cutting belongs to one of method for hot cutting.
But laser cutting operation process in cutting dorsal edge often there is burr, in any case adjust focal position,
The parameters such as line position, pressure of blowing size, cutting power, cutting speed are introduced, the burr at the cutting back side all cannot be thoroughly eliminated.
Common burr removing method has: manually go deburring, electrochemical deburring, thermal energy deburring, high pressure water deburring,
Ultrasonic wave deburring, laser deburring, freezing shot-peening deburring etc..All it is that process removes flash removed after increasing above, greatly increases
Processing cost and production efficiency is reduced, various damages especially may also result in precision part processing.
Summary of the invention
Therefore, the application technical problems to be solved are to provide a kind of laser cutting device, can effectively remove laser
Generated burr in cutting process reduces processing cost, improves processing efficiency.
To solve the above-mentioned problems, the application provides a kind of laser cutting device, including laser emitter and the first purging
Device, laser emitter are located at the first side of workpiece to be cut, and the first blow device is located at second side of workpiece to be cut, and first
Side and second side are opposite, cutting position of the air-out direction of the first blow device towards laser emitter on workpiece to be cut,
And first blow device air-out direction and laser emitter Laser emission direction between in default angle, the default angle is big
In 0 °.
Preferably, the air outlet of the first blow device is located at the reservation part of workpiece to be cut, and air outlet is towards to be cut
The waste part of workpiece.
Preferably, laser cutting device further includes the second blow device, and laser emitter is arranged in the second blow device
It is ipsilateral, cutting position of the air-out direction of the second blow device towards laser emitter on workpiece to be cut.
Preferably, the second blow device is integrated with laser emitter setting, the air outlet and laser of the second blow device
The emission port of transmitter is overlapped.
Preferably, laser cutting device further includes rack, and laser emitter and the first blow device are movably arranged on machine
On frame, and move synchronously.
Preferably, first level movement mechanism is provided in rack, laser emitter and the first blow device are arranged at
On first level movement mechanism, and moved under the action of first level movement mechanism along first level direction.
Preferably, installing mechanism is provided on first level movement mechanism, installing mechanism is made in first level movement mechanism
It is moved with lower along first level direction, laser emitter and the first blow device are arranged on installing mechanism.
Preferably, installing mechanism is rectangular frame, and rectangular frame is vertically arranged, and the frame on top is arranged in laser emitter
On, the first blow device is arranged on the frame of lower part.
Preferably, vertical motion mechanism is additionally provided on the top frame of rectangular frame, laser emitter can be adjusted up and down
It saves land and is arranged in vertical motion mechanism.
Preferably, laser cutting device further includes position detecting device and controller, and position detecting device is sharp for detecting
The laser cutting position of optical transmitting set, controller adjust the first blow device according to the cutting position that position detecting device detects
Position so that the purge position of the first blow device follows the cutting position of laser emitter.
Laser cutting device provided by the present application, including laser emitter and the first blow device, laser emitter are located at
First side of workpiece to be cut, the first blow device are located at second side of workpiece to be cut, and the first side and second side are opposite, and first
Cutting position of the air-out direction of blow device towards laser emitter on workpiece to be cut, and the outlet air of the first blow device
In default angle between direction and the Laser emission direction of laser emitter, which is greater than 0 °.Laser in the application
Cutting equipment, the first blow device and laser emitter are located at the two sides of workpiece to be cut, and the first blow device
In default angle between air-out direction and the Laser emission direction of laser emitter, can be carried out from lateral to cutting position
Blowing, to be blown away the slag charge being not yet solidified melted is burnt in laser cutting process from workpiece to be cut, due to being lateral
Blowing, therefore can more quickly and efficiently blow away slag charge, it avoids forming burr on workpiece to be cut, can effectively remove
Generated burr in laser cutting process reduces processing cost, improves processing efficiency, improves cut quality.
Detailed description of the invention
Fig. 1 is the purging structure chart of first blow device of the embodiment of the present application；
Fig. 2 is the structural schematic diagram of the laser cutting device of the embodiment of the present application.
Appended drawing reference indicates are as follows:
1, laser emitter；2, the first blow device；3, workpiece to be cut；4, the second blow device；5, rack；6, first
Horicontal motion mechanism；7, installing mechanism；8, vertical motion mechanism.
Specific embodiment
It is carefully studied by applicant, the main reason for existing laser cutting generates burr, is, when laser cutting, material
Rapidly fusing, vaporization, ablation or reach burning point, while by with the light beam coaxially air-flow blowing of vertical high speed purging from top to bottom
Melt substance, realization cut open workpiece.But gas flow purging downwards, will cause part slag be attached to cutting the back side cut
Slot edge forms burr after cooling, this is the main reason for forming burr.The it is proposed of the application is formally in order to solve above-mentioned side
Case.
In conjunction with referring to shown in Fig. 1 to Fig. 2, according to an embodiment of the present application, laser cutting device includes laser emitter (1)
With the first blow device (2), the laser emitter (1) is located at the first side of workpiece to be cut (3), first blow device
(2) it is located at the second side of workpiece to be cut (3), the first side and second side are opposite, the air-out direction of first blow device (2)
Towards cutting position of the laser emitter (1) on workpiece to be cut (3), and the outlet air of first blow device (2)
In default angle between direction and the Laser emission direction of the laser emitter (1), which is greater than 0 °.
Laser cutting device in the application, the first blow device 2 are located at workpiece to be cut with laser emitter 1
3 two sides, and in default angle, energy between the air-out direction of the first blow device 2 and the Laser emission direction of laser emitter 1
It is enough to be blowed from lateral to cutting position, thus will be burnt in laser cutting process the slag charge being not yet solidified that melts to
It is blown away on cutting workpiece 3, due to being laterally to dry, more quickly and efficiently slag charge can be blown away, avoided to be cut
Burr is formed on workpiece 3, generated burr in laser cutting process can be effectively removed, reduces processing cost, improves processing
Efficiency improves cut quality.
Preferably, the air outlet of first blow device (2) is located at the reservation part of workpiece to be cut (3), air outlet
Towards the waste part of workpiece to be cut (3).Due to the first blow device 2 air outlet towards workpiece 3 to be cut scrap portion
Point, therefore when carrying out the purging of slag charge, thoroughly the slag charge that the ot-yet-hardened melted is burnt by laser can be blowed to far from needs
The position of the workpiece to be cut 3 retained avoids being bonded in slag charge cooling procedure on the cutting workpiece that needs retain and forming hair
Thorn, more efficiently removes the burr on workpiece 3 to be cut.Since slag charge is blowed to separate need by the blowing of the first blow device 2
The position for the workpiece to be cut 3 to be retained, therefore even if the molten slag charge of liquid is dispelled, also can under the action of the wind towards
Direction movement far from the workpiece to be cut 3 for needing to retain is protected to can not be splashed on the workpiece to be cut 3 for needing to retain
The processing efficiency and processing quality of workpiece 3 to be cut are demonstrate,proved.It can be effectively avoided through the above way in the guarantor with cutting workpiece
It stays part to generate burr, therefore eliminates subsequent manufacturing procedure, not only save process, reduce processing cost, Er Qieti
High processing efficiency.Above-mentioned workpiece to be cut 3 is, for example, steel plate.
Preferably, the angle between the blowing direction of the first blow device 2 and the Laser emission direction of laser emitter 1 is big
In or be equal to 60 ° and less than 90 °, it is highly preferred that the Laser emission of the blowing direction of the first blow device 2 and laser emitter 1
Angle between direction is greater than or equal to 60 ° and less than or equal to 85 °, can guarantee that the outlet air of the first blow device 2 is effectively made
With on the slag charge to the cut edge of workpiece 3 to be cut, slag charge is blown off from workpiece 3 to be cut or is blowed to far to be cut
Cut the place for needing to retain part of workpiece 3.
In the present embodiment, the laser cutting device further includes the second blow device (4), second blow device
(4) it is arranged in the ipsilateral of the laser emitter (1), the air-out direction of second blow device (4) is sent out towards the laser
Cutting position of the emitter (1) on workpiece to be cut (3).Second blow device 4 is from the first side of workpiece 3 to be cut to second side
Blowing, the first blow device 2 is from the second side of workpiece 3 to be cut to the first cross air blasting, and the blowing of the second blow device 4 is through too drastic
Optical transmitting set 1 can cross, then phase interaction after the cutting groove on workpiece 3 to be cut with the blowing of the first blow device 3
With, using the second blow device 4 avoid slag charge under the action of the first blow device 3 enter cutting groove in, while utilize first
Blow device 2 avoids slag charge from being dispelled under the action of the second blow device 4, and be splashed to workpiece 3 to be cut needs reserve part
On point, to more efficiently avoid the need for that 2 reserve part of workpiece to be cut separates existing burr, further increase processing quality and
Processing efficiency.
Second blow device (4) can be set with the laser emitter (1) to be integrated, second blow device
(4) air outlet is overlapped with the emission port of the laser emitter (1).The air outlet of the second blow device 4 and laser are sent out at this time
The emission port of emitter 1 is coaxial, the second blow device 4 along the direction perpendicular to workpiece 3 to be cut towards laser emitter 1 to
Cut the cutting position blowing on workpiece 3.
The outlet air air pressure of first blow device 2 and air outlet direction can be according to going flash removed effect to be adjusted, specifically
It can be realized by being arranged the first blow device 2 on oscillating motor, or on other regulating mechanism.Assist gas
It can be air, nitrogen or argon gas etc., can be selected according to product demand.
The laser cutting device further includes rack (5), the laser emitter (1) and first blow device (2)
It is movably arranged on the rack (5), and moves synchronously.In the present embodiment, rack 5 includes multiple columns, multiple columns
The support column of support laser emitter 1 and the first blow device 2 is formed, carries out laser emitter 1 and first so as to facilitate
The setting of blow device 2.Laser emitter 1 and the first blow device 2 can be movably arranged in rack 5, be realized to be cut
The cutting of workpiece 3 can also be fixed in rack 5, realized by the position of movement workpiece 3 to be cut and treated cutting workpiece 3
Cutting.
Laser emitter (1) and first blow device (2) move synchronously, and can guarantee the first blow device 2 always
The cutting position of laser emitter 1 is followed, so that the first blow device 2 can be purged in appropriate position, effectively always
The appearance of burr is avoided, cutting efficiency is improved.
In the present embodiment, it is provided with first level movement mechanism (6) on the rack (5), the laser emitter (1)
It is arranged on the first level movement mechanism (6) with first blow device (2), and in the first level fitness machine
Structure moves under the action of (6) along first level direction.First level movement mechanism 6 is supported on the column of rack 5, first level
It is provided with driving device on movement mechanism 6, laser emitter (1) and first blow device (2) can be driven along first
Horizontal motion.The first level movement mechanism can be telescoping mechanism, or tape handler.
It is provided with installing mechanism (7) on the first level movement mechanism (6), the installing mechanism (7) is described first
It is moved under horicontal motion mechanism (6) effect along first level direction, the laser emitter (1) and first blow device
(2) it is arranged on the installing mechanism (7).
Specifically, the first level movement mechanism can be realized using telescoping cylinder to laser emitter (1) and described the
The telescopic end of telescoping cylinder is arranged in the driving of the horizontal movement of one blow device (2), installing mechanism 7, passes through the flexible of telescopic end
It drives installing mechanism 7 to move along first level direction, and then drives laser emitter (1) and first blow device
(2) it is moved along first level direction.The first level direction is, for example, the length direction of first level movement mechanism.
Above-mentioned first level movement mechanism can also use rack pinion, or in first level movement mechanism
Both ends driving wheel is set, the mode that transmission belt is arranged on driving wheel is driven, and first level movement mechanism can also be adopted
It is driven with linear motor.
Preferably, the installing mechanism (7) is rectangular frame, and the rectangular frame is vertically arranged, the laser emitter
(1) it is arranged on the frame on top, first blow device (2) is arranged on the frame of lower part.Using rectangular frame structure,
The placement space of workpiece 3 to be cut can be formed using the intermediate space of rectangular frame structure, while can be to avoid rectangular frame
It is interfered between workpiece 3 to be cut during the motion, facilitates and realize laser emitter (1) and first blow device
(2) position is adjusted, and improves the functional reliability of installing mechanism 7.
Preferably, laser emitter (1) and first blow device (2) can also be along the second horizontal directions in rectangle
Movably it is arranged on frame, so as to adjust the cutting position of laser emitter (1), so that laser emitter (1) is treated
The cutting operation for cutting workpiece 3 is more flexible and convenient.Second horizontal direction is perpendicular to first level direction, so that first level
Movement mechanism 6 is cooperated with installing mechanism 7, may be implemented to treat cutting for all directions of cutting workpiece 3 in the horizontal direction
It cuts, can be realized more complicated and diversified cutting.
It is additionally provided on the top frame of the rectangular frame vertical motion mechanism (8), the laser emitter (1) is up and down
Can adjustably it be arranged on the vertical motion mechanism (8).The vertical motion mechanism 8 can be fixed at rectangular frame
On, laser emitter (1) is arranged on rectangular frame by vertical motion mechanism 8 at this time, cannot occur relative to rectangular frame 8
The movement of horizontal direction is merely able to that the fortune of vertical direction occurs relative to rectangular frame 8 under the action of vertical motion mechanism 8
It is dynamic.Vertical motion mechanism 8 can also be moved along the frame horizontal of rectangular frame 8, to drive laser emitter 8 along second
Horizontal motion.When vertical motion mechanism 8 along rectangular frame can horizontal displacement when, tooth can be set on rectangular frame
Wheel rack gear either uses linear motor etc., to realize the displacement tune to the horizontal direction of vertical motion mechanism 8
Section.
Vertical motion mechanism 8 can be realized using cylinder, hydraulic cylinder, electric pushrod or linear motor to laser emitter
1 upper and lower position is adjusted.
Laser emitter 1 and the second blow device 4 can share the same shell, be respectively arranged with laser light on the shell
Fibre pipe and gas conduit, wherein gas conduit is connected to gas source, and laser fiber pipe can connect to light source.Wherein gas source and light source
It can be provided, also be can be arranged directly in vertical motion mechanism 8 by outside.
The rack of workpiece 3 to be cut, first level movement mechanism 6 can also be set on first level movement mechanism 6
It is two, two first level movement mechanisms 6 are parallel to each other, and one end of rack is connected to one of first level fitness machine
On the shell of structure 6, to realize the fixed installation of rack.Rectangular frame is located at the outside of rack, and rectangular frame is interior
Lengths of frame is greater than the length of rack, so that rectangular frame can pass through on the outside of rack during the motion, no
It can interfere.
The laser cutting device further includes position detecting device and controller, and the position detecting device is for detecting institute
State the laser cutting position of laser emitter (1), the cutting position that the controller is detected according to the position detecting device
The position of first blow device (2) is adjusted, so that the purge position of first blow device (2) follows the laser hair
The cutting position of emitter (1).
In the present embodiment, different motion control mechanisms is respectively adopted in laser emitter 1 and the first blow device 2, and
The motion control mechanism of the two is mutually indepedent, and moving synchronously for the two is controlled by controller, utilizes position detecting device
The laser printhead position of real-time tracing laser emitter 1 enables the first blow device 2 is synchronous with laser printhead holding to transport
It is dynamic.
By using the above scheme of the application, have the advantages that
1, work piece cut cross section quality is good, and deburring is thorough；
2, it is increased without rear process processing burr, raising efficiency reduces cost；
3, increase deburring operation after avoiding precision part, overlay coating part etc. from cutting, cause the risk of secondary damage.
Those skilled in the art will readily recognize that above-mentioned each advantageous manner can be free under the premise of not conflicting
Ground combination, superposition.
The above is only the preferred embodiments of the application, not to limit the application, it is all in spirit herein and
Made any modifications, equivalent replacements, and improvements etc., should be included within the scope of protection of this application within principle.Above only
It is the preferred embodiment of the application, it is noted that for those skilled in the art, do not departing from this Shen
Several improvements and modifications please can also be made, these improvements and modifications also should be regarded as the guarantor of the application under the premise of technical principle
Protect range.
Claims (10)
1. a kind of laser cutting device, which is characterized in that including laser emitter (1) and the first blow device (2), the laser
Transmitter (1) is located at the first side of workpiece to be cut (3), and first blow device (2) is located at the second of workpiece to be cut (3)
Side, the first side and second side are opposite, the air-out direction of first blow device (2) towards the laser emitter (1) to
Cut the cutting position on workpiece (3), and the air-out direction of first blow device (2) and the laser emitter (1)
In default angle between Laser emission direction, which is greater than 0 °.
2. laser cutting device according to claim 1, which is characterized in that the air outlet of first blow device (2)
Positioned at the reservation part of workpiece to be cut (3), waste part of the air outlet towards workpiece to be cut (3).
3. laser cutting device according to claim 1, which is characterized in that the laser cutting device further includes second blowing
Sweeping device (4), second blow device (4) are arranged in the ipsilateral of the laser emitter (1), second blow device
(4) cutting position of the air-out direction towards the laser emitter (1) on workpiece to be cut (3).
4. laser cutting device according to claim 3, which is characterized in that second blow device (4) is swashed with described
Optical transmitting set (1) setting is integrated, the air outlet of second blow device (4) and the emission port of the laser emitter (1)
It is overlapped.
5. laser cutting device according to any one of claim 1 to 4, which is characterized in that the laser cutting device
It further include rack (5), the laser emitter (1) and first blow device (2) are movably arranged on the rack (5)
On, and move synchronously.
6. laser cutting device according to claim 5, which is characterized in that be provided with first level on the rack (5)
Movement mechanism (6), the laser emitter (1) and first blow device (2) are arranged at the first level fitness machine
On structure (6), and moved under the action of first level movement mechanism (6) along first level direction.
7. laser cutting device according to claim 6, which is characterized in that set on the first level movement mechanism (6)
It is equipped with installing mechanism (7), the installing mechanism (7) is in the case where the first level movement mechanism (6) acts on along first level direction
Movement, the laser emitter (1) and first blow device (2) are arranged on the installing mechanism (7).
8. laser cutting device according to claim 7, which is characterized in that the installing mechanism (7) is rectangular frame, institute
It states rectangular frame to be vertically arranged, the laser emitter (1) is arranged on the frame on top, and first blow device (2) sets
It sets on the frame of lower part.
9. laser cutting device according to claim 8, which is characterized in that also set on the top frame of the rectangular frame
It is equipped with vertical motion mechanism (8), the vertical motion mechanism (8) can be adjustably arranged in the laser emitter (1) up and down
On.
10. laser cutting device according to claim 5, which is characterized in that the laser cutting device further includes position
Detection device and controller, the position detecting device is used to detect the laser cutting position of the laser emitter (1), described
Controller adjusts the position of first blow device (2) according to the cutting position that the position detecting device detects, so that
The purge position of first blow device (2) follows the cutting position of the laser emitter (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910726851.7A CN110497097A (en) | 2019-08-07 | 2019-08-07 | Laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910726851.7A CN110497097A (en) | 2019-08-07 | 2019-08-07 | Laser cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110497097A true CN110497097A (en) | 2019-11-26 |
Family
ID=68587114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910726851.7A Pending CN110497097A (en) | 2019-08-07 | 2019-08-07 | Laser cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110497097A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59104289A (en) * | 1982-12-04 | 1984-06-16 | Nippon Steel Corp | Method and device for cutting steel plate by laser beam |
| JPS5933079B2 (en) * | 1977-09-07 | 1984-08-13 | 株式会社東芝 | Laser cutting method and device |
| JPH08141764A (en) * | 1994-11-16 | 1996-06-04 | Hitachi Ltd | Laser beam cutting method |
| CN104043904A (en) * | 2014-06-09 | 2014-09-17 | 江苏大学 | Back side-blown gas-assisted laser cutting method and device |
| CN105436705A (en) * | 2015-11-28 | 2016-03-30 | 江苏德佳机电科技有限公司 | Auxiliary residue removing device for laser cutting machining |
-
2019
- 2019-08-07 CN CN201910726851.7A patent/CN110497097A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5933079B2 (en) * | 1977-09-07 | 1984-08-13 | 株式会社東芝 | Laser cutting method and device |
| JPS59104289A (en) * | 1982-12-04 | 1984-06-16 | Nippon Steel Corp | Method and device for cutting steel plate by laser beam |
| JPH08141764A (en) * | 1994-11-16 | 1996-06-04 | Hitachi Ltd | Laser beam cutting method |
| CN104043904A (en) * | 2014-06-09 | 2014-09-17 | 江苏大学 | Back side-blown gas-assisted laser cutting method and device |
| CN105436705A (en) * | 2015-11-28 | 2016-03-30 | 江苏德佳机电科技有限公司 | Auxiliary residue removing device for laser cutting machining |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204035796U (en) | Tubing automatic charging laser cutting machine | |
| US9956648B2 (en) | Piercing metal workpieces by a laser beam | |
| KR880002407B1 (en) | Laser processing system | |
| JP2013086180A (en) | Welding laser device | |
| CN203418238U (en) | Integrated pipe sheet laser cutting machine | |
| CN113084365B (en) | Laser cutting device and method for profiled bar | |
| CN201455556U (en) | Laser cutting device for amorphous state alloy belt material | |
| CN113695766B (en) | Laser cutting head with variable light spot track shape and cutting process thereof | |
| CN104043904A (en) | Back side-blown gas-assisted laser cutting method and device | |
| CN103212834B (en) | SMT template laser wet cutting and detection method | |
| CN104384728A (en) | Process and fixture for laser machining of sapphire panel | |
| CN206764153U (en) | A kind of pole piece laser truncation mechanism | |
| CN105828965A (en) | Side trimming device of steel plate and method therefor | |
| CN110497097A (en) | Laser cutting device | |
| CN103212841B (en) | SMT template laser wet cutting and detection process equipment | |
| CN210524183U (en) | Carbon dioxide laser cutting machine | |
| CN210231935U (en) | Laser cutting hub equipment | |
| CN206405620U (en) | A kind of laser cutting system suitable for integrated mill | |
| CN103212835B (en) | SMT template laser wet cutting and detection method | |
| CN103212837B (en) | The process equipment of the wet cutting of SMT template laser | |
| CN202506955U (en) | Jig device with manual cutting head movement and laser micro-machining equipment using same | |
| CN208556356U (en) | A kind of guide tracked laser cutting machine | |
| CN104907710A (en) | Method and device for cutting casting blank through laser | |
| CN103212836B (en) | SMT template laser wets cutting process method | |
| CN208322448U (en) | Carbon dioxide non-metallic laser cutting machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191126 |