JPS6223479U - - Google Patents

Info

Publication number
JPS6223479U
JPS6223479U JP11463185U JP11463185U JPS6223479U JP S6223479 U JPS6223479 U JP S6223479U JP 11463185 U JP11463185 U JP 11463185U JP 11463185 U JP11463185 U JP 11463185U JP S6223479 U JPS6223479 U JP S6223479U
Authority
JP
Japan
Prior art keywords
adhesive
wiring board
printed wiring
chip
shows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11463185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11463185U priority Critical patent/JPS6223479U/ja
Publication of JPS6223479U publication Critical patent/JPS6223479U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案によるチツプ部品の概念図を示
す。図で、1……チツプ部品、2……接着剤。 第2図は本考案を実施した部品を用いた場合の
部品装着工程図である。図で、1……本考案を実
施したチツプ部品、2……プリント配線板、3…
…部品搭載後、接着剤を硬化させたプリント配線
板、4……半田槽。 第3図は従来の部品装着工程図である。図で、
Aはメツシユスクリーンによる接着剤塗布、Bは
デイスペンサーによる接着剤塗布の場合を示す。
図で、1……メツシユスクリーン、2……プリン
ト配線板、3……接着剤、4……デイスペンサー
ノズル、5……チツプ部品を搭載したプリント配
線板、6……部品搭載後、接着剤を硬化させたプ
リント配線板、7……半田槽。
FIG. 1 shows a conceptual diagram of a chip component according to the present invention. In the figure, 1...chip parts, 2...adhesive. FIG. 2 is a diagram of a component mounting process when using components according to the present invention. In the figure, 1...chip parts implementing the present invention, 2...printed wiring board, 3...
...Printed wiring board with adhesive cured after mounting components, 4...Solder bath. FIG. 3 is a diagram of a conventional component mounting process. In the figure,
A shows the case where the adhesive is applied by a mesh screen, and B shows the case where the adhesive is applied by a dispenser.
In the figure, 1...mesh screen, 2...printed wiring board, 3...adhesive, 4...dispenser nozzle, 5...printed wiring board with chip parts mounted, 6...adhesion after mounting the parts. Printed wiring board with hardened agent, 7...Solder tank.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品の一部に脱落防止用接着剤を塗布したこと
を特徴とするチツプ部品。
A chip part characterized by having adhesive applied to a part of the part to prevent it from falling off.
JP11463185U 1985-07-25 1985-07-25 Pending JPS6223479U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11463185U JPS6223479U (en) 1985-07-25 1985-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11463185U JPS6223479U (en) 1985-07-25 1985-07-25

Publications (1)

Publication Number Publication Date
JPS6223479U true JPS6223479U (en) 1987-02-13

Family

ID=30997547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11463185U Pending JPS6223479U (en) 1985-07-25 1985-07-25

Country Status (1)

Country Link
JP (1) JPS6223479U (en)

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