JPS62232090A - Photoelectric conversion assembly - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention is generally applicable to photoelectric transformers @'415. In particular, it relates to the structure of a small, compact and simple assembly. This assembly can be used as a module in a variety of products that connect light sources and light sensing devices to analog or hybrid analog/digital circuits.

(Prior Art) In the field of digital data processing as well as electrical control systems, it is often necessary to detect that some type of information has passed through a specific position on a carrier. for example,
Traditional 80-column car
d) The document reading device 2, which uses information detection from d), uses a photo-optic device to detect the passage of a hole or a contrast mark. Similarly, in process control applications, it is commonly required to detect the passage of product along a conveyor or the passage of the edge of an object between a supply reel and a take-up reel. In many applications, transducing heads are exposed to harsh conditions and require tight packaging to avoid failure due to shock, vibration or contamination.

SUMMARY OF THE INVENTION An object of the present invention is to provide a new packaging structure for a photo-optic transducer head. In this transducer head, an electric circuit is provided on a small circuit card and electrically connected to the circuit card. The electrical circuit is used to generate a beam of radiant energy and/or receive radiant energy and convert the received radiant energy into a signal in the form of electrical pulses. The circuit card is structurally supported within a rectangular frame. The frame is also configured to communicate with a suitable light pipe housed or installed within the block of opaque material. A source of radiant energy (light) and an associated optical sensor are held in proper alignment with a light pipe leading to a window in the working surface of the block to detect changes in the radiant energy at this window. The process is then processed using the electrical circuit on the circuit card. Multiple terminal bins are connected to the circuit card and
It can be handled through an opening formed in the frame. As a result, the terminal pins can be inserted into suitable jackets in the connector of the motherboard.

Accordingly, a primary object of the present invention is to provide a photoelectric conversion head assembly that is VR standard and improved.

Another object of the present invention is to provide a photoelectric conversion head assembly that is ttI pure in structure and that effectively protects delicate components.

Another object of the invention is to provide a photo-optic transducer head in which a radiant energy source and a radiant energy sensing device are fixed to or electrically connected to a hybrid circuit card. The hybrid circuit card includes amplifiers, comparators and other circuit components commonly used in such charging devices. These hybrid circuit cards are protected within a frame. The frame also provides alignment of the radiant energy source and sensing Vt location with the light pipe leading to the converter working surface.

These and other objects and advantages of the invention will become apparent upon consideration of the following detailed description of the preferred embodiments, and in particular the accompanying drawings.

(Example) Refer to the drawings. photo-optic transducer head assembly
It can be seen that the headassembly 82 is made from a block 84 of opaque plastic material, such as a plastic molding compound. The plastic material is molded around the bifurcated light guide. This light guide is itself a fiber optic rod 8
It can be a bundle of 6 or a molded solid plastic material. The solid plastic material is provided with a suitable coating on its surface so that the incident light entering one end face of the pipe is always internally reflected until it reaches the exit end. The base of the optical fiber bundle or light pipe is exposed through a window 88 formed in the center of boss 90;
Projecting outwardly from the base of opaque block 84. Similarly, individual branches of the branched fiber optic pipe bundle are exposed at spaced apart points along the edge surface 96 of block 84. Laterally extending slot 98
is cut into the block of opaque material between branches 92 and 94 of the optical fiber bundle.

According to the configuration of the invention, side edges 100 and 1 of block 84
02 includes a longitudinal recess 104 formed in its side edge to accommodate a protruding leg 106 of a ceramic circuit card frame member 108. Frame means 10
8, four side members 110, 112, which are orthogonal to each other;
It is made of an integrally molded structure having 114 and 116. The side members define a rectangular opening 118 that receives the hybrid ceramic circuit board 120. The illustrated side member includes a plurality of spaced notches 12 formed inwardly from one edge surface of the side member.
2. The spacing between notches 122 is equal to the spacing between terminal bins 124 of ceramic hybrid circuit card 120.

Side member 116, opposite side member 114, includes a pair of spaced apart apertures as shown by 1!11<126 for radiant energy conduction windows. The spacing between these openings or windows is determined by the distance between each branch 9 of the fiber optic pipe.
2 and 94 are equal to the spacing between the windows in the edge 96 of the block 84 that are exposed.

For example, a light emitting diode (LE
D) There is a radiant energy source and a phototransistor of a radiant energy sensing device. These two devices are placed on the thin edge surface of the ceramic card 120, abutting the side 116 of the frame 106, and are spaced apart from each other by a distance corresponding to the center-to-center spacing of the window 126. Alternatively, the light emitting diode and phototransistor (not shown) can be mounted on separate substrates and connected to the circuitry of the ceramic card 120 by suitable wiring techniques known in the art. . In either case, the ceramic card 120 is inserted into the central opening of the frame member 108, with the terminal pins 124 protruding from the notches 122 formed in the frame, and the LED and phototransistor (none of which are shown) corresponds to the aperture or window 126.

The blocking member 84 is then secured to the frame 108 by fitting the protruding legs 108 into the longitudinal ti 104 so that the LED and phototransistor also match the branches 92 and 94 of the fiber optic rod bundle or optical bi 186. do. It will also be apparent to those skilled in the art that frame 108 and block member 84 can be integrally formed during a molding operation and need not be separable as shown in the figures.

Ceramic circuit card 120 has a large number of active (aCtiV) and passive (aCtiV) along the conductors.
) circuit components (including integrated circuit chips). The conductors communicate with each other to form an electrical circuit that causes the LED to emit invisible radiant energy, such as light or infrared radiation, and the phototransistor to convert the received radiant energy into a usable output signal. It can be moved like this.

Side 811 of the frame member 116 to prevent "interference" or shorting of radiant energy from LEDs placed adjacent to each other on the thin side edges of the board 120 or on separate substrates to the phototransistor. Laterally extending webs 128 and 130 are integrally formed in the block 84 with opposing lateral slots 98 in the block 84 and a light emitting device and light sensing bag formed in the edge of the ceramic card. 1 (reference number M is not indicated) formed on the edge of the ceramic card 120.

In use, the photo-optic transducer head of the present invention is plugged into a suitable electrical connector on the motherboard so that the terminal pin 124 communicates with external circuitry such as a power source or utilization equipment! iQ is placed. In this way, through the pin 124 and the printed wiring of the ceramic card 120, the card 120
The necessary bias potentials are applied to appropriate active and passive components located at the . A control potential can also be applied to another terminal bin 124 to selectively activate a radiant energy source (LED) and to set the limits of an integrated circuit comparator associated with the phototransistor sensing element.

The working surface of block 84, which is provided with a window 88, is physically positioned to "observe" the transition passing through this surface. For example, when the transducer head of the present invention is used in a card reader, the window 88 are arranged along the track such that contrast marks printed on the card or holes drilled through the card cause a change in the intensity of light striking the phototransistor sensing element.

Reflection sensing technology is used when marks are printed on cards that have recorded data. On the other hand, when data is being recorded on a recording member by means of holes, conductive type photo-optic sensing techniques can be used.

Consider first the case in which the transducer head shown in the drawings is used in reflection sensing mode. Appropriate potential is terminal bin 1
24 and a branch 92 or 94 of the fiber optic pipe 86 that emits light or infrared light through the rake aperture 126 and aligns the LED element (not shown) with the aperture.
can be applied to the surface of Radiant energy is transmitted through the bundle of fiber optic rods and impinges on the recording medium through window 88. When a contrast mark printed on the media passes through the window 88, the amount of light reflected from the recording media changes. As a result, the light passing through the fiber optic rod of branch 92 or 94 leading to a photoresistor (not shown) also changes. This change is amplified and processed to cause a 2'a shift in the output from the integrated circuit comparator contained in the hybrid circuit card.

In the transfer mode, two nearly identical circuits (of the type shown in the figures) are used. These circuits are located on either side of the path of travel of the recording medium to be read, and the windows 88 of one such transducing head are generally aligned with the windows 88 of the other transducing head. The external circuitry is configured such that only the LED arrangement of one transducer head is activated to generate light, while the other transducer head acts as a motion sensing element.

Therefore, when a recording medium passes between two aligned transducer heads with apertures at predetermined intervals, light emitted from the window 88 of one transducer head will pass through the card if the apertures are provided and It enters the window 88 of the light receiving head. The light entering the light receiving head passes through the optical fiber pipe to the aperture 12.
6 to cause a sufficient change in the impedance of the semiconductor element.

Conversely, if the light emitted from the window 88 of one transducer head is blocked by the card material between that transducer head and the sensing transducer head, the light sensing device remains in a high resistance state and the other In accordance with the patent system, which is characterized by two-pronged power, and which provides those skilled in the art with the information necessary to use the novel principles of the invention,
The invention has also been described in considerable detail in order to construct and use such special elements as are required. However, it is understood that the invention may be carried out using other specialized equipment and equipment, and that various changes may be made to the equipment configuration and operating procedures without departing from the scope of the invention. There is a need.

[Brief explanation of drawings]

The drawing is a perspective view of a photoelectric conversion head assembly of a preferred embodiment. 82...Photo-optic conversion head 84...
Block 86...Optical fiber rod 88...
・Window 90...Boss 92.94...Branch portion of optical fiber bundle 96...Edge surface 98
...Slot 100.102...Side edge 104...
- Recess 106... Leg (frame) 108... Frame means 110, 112, 114, 116... Side member 118
...Opening 120...Hybrid ceramic circuit board 122.
...Notch 124...Terminal bin 126...
Opening or window 128.130...ware

Claims (14)

[Claims] (1) In a photovoltaic conversion assembly for sensing changes in radiant energy at a work surface, (a) a card means having active and passive electrical configuration requirements is provided on a common side edge of the card means; (b) four mutually orthogonal side walls defining a central opening; (c) said printed circuit card means is supported within a central aperture of said frame member; said radiant energy supply means and radiant energy responsive means on said common side edge of said card means are in discrete alignment with said spaced apart radiant energy transfer windows; (d) further secured to said frame member; a bifurcated radiant energy transfer guide means with a branch of the bifurcated guide means aligned with the spaced apart radiant energy transfer window, the guide means being in contact with the working surface of the conversion assembly; A photoelectric conversion assembly having a connected base. (2) the printed circuit card means: (a) has a ceramic substrate with patterned conductors on one or more surfaces; and (b) the active electrical component is coupled to the patterned conductors. 2. A photovoltaic conversion assembly as claimed in claim 1, comprising at least one integrated circuit chip member. (3) said printed circuit card means: (a) attached to said printed circuit card means and projecting outwardly from a side edge of said card means;
A photovoltaic device according to claim 1, further comprising a plurality of terminal pins passing through passageways formed in one of the side walls of the frame member when supporting printed circuit card means within the central opening. conversion assembly. 4. The photoelectric conversion assembly of claim 1, wherein said radiant energy transmission guide means comprises: (a) a branched bundle of optical fiber rods embedded in an opaque block. 5. The photoelectric conversion assembly of claim 1, wherein said radiant energy transmission guide means comprises: (a) a molded branched light pipe embedded in an opaque block. (6) The photoelectric conversion assembly according to claim 4, wherein the opaque block is attached to a frame member. (7) Further, (a) the frame member includes shielding means to prevent radiant energy from being transmitted from the source means to the response means without passing through the conductor means. The photoelectric conversion assembly according to item 1. (8) The two side walls of said rectangular frame member are each provided with an extension projecting orthogonally to said one side wall and capable of accommodating guide means between said side walls. The photoelectric conversion assembly according to item 1. (9) The opaque block is separable from the frame member.
The photoelectric conversion assembly described in . (10) In a photoelectric conversion head assembly, (a) a circuit provided on a ceramic substrate, the circuit comprising a light emitting diode and a photoconverter disposed close to a side edge of the substrate at a spaced apart position; (b) a hybrid electrical circuit comprising active and passive components, including transistors, the circuit being interconnected by patterned printed conductors on said substrate; (b) one end connected to said substrate; a plurality of spaced apart terminal pins connected to the patterned printed conductor above and projecting from another side edge of the substrate; (c) forming a central opening for receiving the ceramic substrate therein; a generally rectangular frame member having four side edges, the frame member receiving the plurality of terminal pins along one side edge when the ceramic substrate is fitted to the frame member; a plurality of regularly spaced notches capable of forming a photovoltaic conversion head, and the other side wall of the frame member has a transmission path for light passing through the frame member aligned with the spaced position. Three-dimensional. (11) further comprising a light transmitting light pipe having a common base and two branched arms, wherein the arms are individually connected to spaced apart light transmitting paths on the other side of the side wall; A photoelectric conversion head assembly according to claim 10. (12) The photoelectric conversion head assembly according to claim 11, wherein the light pipe is embedded in a block of opaque material. (13) The photoelectric conversion head assembly according to claim 12, wherein the block of opaque material is integrally formed on the other side wall of the frame member. 14. The photovoltaic head assembly of claim 12, wherein the block of opaque material is separable from the frame member.