KR100730989B1 - Socket type E/O and O/E converter for optical interconnection between semiconductor chips - Google Patents

Abstract

The present invention relates to an all-opto-optoelectric converter for use in an O-PCB, and more particularly, to an upper socket having a coupling portion electrically connected to a semiconductor element; An all-optical / photoelectric converter module having an all-optical converter for converting an electrical signal and an optical signal, a photoelectric converter for converting an optical signal into an electrical signal, and a driving circuit for driving the all-optical converter and the photoelectric converter; And a lower socket connected to the O-PCB to enable optical signal transmission. A socket type all-opto / photoelectric converter and an all-opto-optoelectric converter module, each of which includes an upper socket, an all-opto-optoelectric converter module, and a lower socket, are sequentially stacked and integrally connected to the driving circuit. The present invention relates to a socket-type all-optical / photoelectric converter further comprising a parallel converter and a parallel-to-serial converter.

Therefore, the socket-type all-opto-optoelectric converter according to the present invention does not increase the manufacturing cost of the device in which the all-opto-optoelectric converter module is embedded, and is economical and facilitates the design and manufacture of the O-PCB. By further including a parallel-to-serial converter, it is possible to solve the synchronization problem that may occur when transmitting parallel data at high speed.

 O-PCB, Optical Waveguide, All-optical / Photoelectric Converter, Socketed

Description

Socket-type all-optical photoelectric converter for optical connection between semiconductor chips {Socket type E / O and O / E converter for optical interconnection between semiconductor chips}

1 is a perspective view of a socket-type all-optical photoelectric converter according to an embodiment of the present invention.

2 is a perspective view of a socket-type all-optical photoelectric converter according to another embodiment of the present invention.

Figure 3 is a perspective view showing a structure in which the socket-type opto-optoelectric converter according to the present invention is mounted to the O-PCB.

Explanation of symbols on the main parts of the drawings

10: semiconductor chip 20: socket type all-optical photoelectric converter

11 upper socket 12 all-optoelectric photoelectric converter module

13 photoelectric conversion unit 14 all-optical conversion unit

15 driving circuit 16 series-parallel converter

16 ': parallel-to-serial converter 17: lower socket

30: O-PCB

The present invention relates to an all-opto-optoelectric converter for use in O-PCB, and more particularly, to enable signal transmission with an O-PCB and an upper socket that can be electrically connected to a semiconductor device that is widely used. The present invention relates to a socket-type photoelectric / photoelectric converter having a lower socket and an all-optical / photoelectric conversion unit capable of converting electrical signals and optical signals.

In recent years, as integrated circuit (IC) technology has been advanced so that their operation speed and integrated scale are improved, high performance of microprocessors and large capacity of memory chips are being realized at a very high speed. As a result, the signal processing capability is improved in the next generation information and communication system composed of large parallel computers or terabit (Tb / s) or higher asynchronous transfer-mode (ATM) switching system that transmits large amounts of information at high speed. In this case, high speed signal transmission and high wiring density are required.

However, the conventional device has a limitation in speeding up the signal and increasing the density of the wiring because information transfer over a relatively short distance such as between the board and the board and / or the chip and the chip is mainly performed on the electrical signal. Due to the delayed signal, the problem is emerging. In addition, high-speed signal transmission and high-density wiring lead to noise generation due to electromagnetic interference (EMI). Therefore, countermeasures need to be taken. When the length of the wiring becomes longer, the transmission line effect influences the performance of the electrical wiring. Thus, the transmission line effect not only attenuates the electrical signal through the skin effect, but also causes multiple reflections of the signal if the wiring is not properly terminated. In addition, in the electrical connection line between boards, the data transmission rate becomes a bottleneck limiting the processing speed of the entire system, so a method for solving the shortcomings of the electrical wiring is required.

Recently, as a means to solve this problem, an optical waveguide, which transmits and receives a signal with light using a polymer and glass fiber, has been inserted into a PCB. It is called an PCB (Optical Printed Circuit Board). This O-PCB is a mixture of electrical signals and optical signals, and high-speed data communication is transmitted as optical signals in the same board. In the device, copper plate circuit patterns can be converted into electrical signals for data storage / signal processing. Refers to a PCB having a cladding inserted therein to prevent scattering of an optical waveguide and an optical signal.

Optical wiring can be applied to various parts such as devices and devices, boards and boards, or between chips and chips, and is particularly suitable for building an optical transmission communication system for transmitting signals at relatively short distances, such as between chips and chips.

In addition to the manufacturing technology of the optical waveguide embedded O-PCB for the optical connection, the development of the optical connection packaging technology is also going on in parallel. Fiber-optic packaging technology can be described as a generic name for a technology that enables the mutual transmission of signals through light between a device and a device, a board and a board, or a chip and a chip, and includes a laser diode array technology of 10 channels or more, Examples of the polymer optical waveguide manufacturing technology, various unit technologies such as silicon optical bench, lens, micro-mirror for the signal connection between the optical transmission and reception device and the optical path.

The present invention particularly relates to an all-opto-optoelectric converter converting an optical signal and an electrical signal. O-PCB itself has a main purpose to have an optical waveguide that serves as a passage for enabling the transmission of optical signals, and a device for converting optical signals and electrical signals is also required separately. Since almost all of the devices and chips used generally process / store data as electrical signals, an apparatus for converting and transmitting electrical signals into optical signals and converting the received optical signals into electrical signals is required.

A widely used all-optical converter is a VCSEL (Vertical-Cavity Surface-Emitting Laser), and a photoelectric converter is a PD (Photo Diode). The VCSEL is a device that emits a laser, that is, an optical signal by being modulated at high speed by a driving circuit operating according to an input electrical signal, and the photodiode receives the optical signal and generates an electrical signal corresponding thereto. As a result, the signal converted into the electrical signal is transferred to another device or chip through a separate receiving circuit.

There are many ways to arrange such a VCSEL and photodiode on an O-PCB. First, in designing integrated circuits, VCSELs and photodiodes are integrated into a single chip. Second, only VCSEL and photodiode are manufactured and used together, and this is connected through a separate electric wiring from a chip having an integrated circuit.

In the first method, it is relatively convenient to design the O-PCB wiring because there is no need for a separate external electrical wiring between the integrated circuit and the VCSEL and the photodiode, and the reliability of data transmission between the integrated circuit and the VCSEL and the photodiode is improved. The advantage is very high. However, since this method requires the design and manufacture of a new integrated chip, the manufacturing cost is increased to become an expensive product, which may act as a barrier preventing O-PCB from being widely used, and any part of an integrated circuit or a VCSEL and a photodiode. Even if an error occurs, the entire chip needs to be replaced.

The second method is to develop a device in which only the VCSEL and the photodiode are embedded, so the manufacturing cost is low, so it is possible to produce at low cost, and it is easy to be widely used. It is economical in that only the generated element needs to be replaced. However, in order to connect the VCSEL and photodiode-embedded chip with the integrated circuit, a separate external wiring must be provided on the O-PCB, which makes the manufacturing of the O-PCB complicated and increases the overall size of the O-PCB. Has the problem.

Accordingly, the present invention has been made to solve the above problems, and does not require a separate external electrical wiring without increasing the cost of manufacturing a device in which the VCSEL and the photodiode are embedded, and design and manufacture of the O-PCB. It is to provide a socket type all-opto-optoelectric converter for optical connection between semiconductor devices that can facilitate the.

In order to achieve the above object, the present invention provides a device having a photoelectric / optical converter for converting an electrical signal and an optical signal, the upper socket 11 having a coupling part electrically connected to the semiconductor chip 10. ; An all-optical converter 14 for converting an electric signal into an optical signal, a photoelectric converter 13 for converting an optical signal into an electric signal, and a driving circuit for driving the all-optical converter 14 and the photoelectric converter 13; An all-optical photoelectric converter module 12 having 15); And a lower socket 17 connected to the O-PCB 30 so as to transmit an optical signal. The upper socket 11, the all-optical / photoelectric converter module 12, and the lower socket 17 are formed. Provided is a socket type all-opto-optoelectric converter (20) characterized in that they are stacked in turn to form a single piece.

The all-optical / optoelectric converter module 12 further includes a serial-to-parallel converter 16 and a parallel-to-parallel converter 16 'electrically connected to the driving circuit 15. Provided is a photoelectric converter 20.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings based on such a configuration.

FIG. 1, which shows an embodiment according to the present invention, shows a stacked structure of an upper socket 11, an all-opto-optoelectric converter module 12, and a lower socket 17.

Here, the upper socket 11 includes a coupling part to which the semiconductor chip 10 having an integrated circuit, which is generally widely used, is electrically connected. The overall size or structure of the upper socket 11 and the coupling part is described in the present invention. According to the socket-type all-opto-optoelectric converter 20 can be made in various ways depending on the number of pins or the size of the chip.

In addition, the upper socket 11 is electrically connected to an all-opto-optoelectric converter module 12 disposed thereunder. The specific connection state depends on an integrated circuit internally connected to each of the pins provided in the chip. For example, a pin into which data received by the integrated circuit is input may be stored in the all-optical / photoelectric converter module 12. The pin that is connected to the photoelectric conversion unit 13 provided therein and outputs data transmitted by the integrated circuit is connected to the all-optical conversion unit 14 provided in the all-optical / photoelectric converter module 12.

The all-optical / photoelectric converter module 12 disposed under the upper socket 11 includes an all-optical converter 14 for converting an electrical signal into an optical signal, a photoelectric converter 13 for converting an optical signal into an electrical signal, and the And a driving circuit 15 for driving the all-optical converting portion 14 and the photoelectric converting portion 13.

The all-optical converting unit 14 converts an electric signal into an optical signal, and for example, a VCSEL (Vertical-Cavity Surface-Emitting Laser) or a surface light emitting diode (LED) may be used. Reference numeral 13 denotes a part for converting an optical signal into an electrical signal, and for example, a photo diode may be used. At least one of the all-optical converting unit 14 and the photoelectric converting unit 13 may be provided, and this depends on how many input pins and output pins the chip has.

The driving circuit 15 controls the optical signal to be output by driving the all-optical converter 14 in response to the electrical signal received from the semiconductor chip 10 connected to the upper socket 11. The converter 13 transmits the electric signal converted from the optical signal to the chip connected to the upper socket 11.

The lower socket 17 supports the stacked upper socket 11 and the all-opto-optoelectric converter module 12 and is attached and fixed to the O-PCB 30 so as to be detachable. It provides a window for signal transmission. In addition to the optical waveguide, the O-PCB 30 to which the lower socket 17 is attached and fixed includes a ground line and a power line on the substrate, and the ground line and the power line are connected to the lower socket 17 to connect the upper socket. It serves to supply power to each of the elements arranged in the semiconductor chip 10 and the all-opto-optoelectric converter module 12 connected to (11).

The upper socket 11, the all-opto-optoelectric converter module 12, and the lower socket 17 are sequentially stacked and made into a single device through a process such as fusion and the like.

Figure 2 shows another embodiment according to the present invention.

In another embodiment of the present invention, the socket-type opto-optoelectric converter 20 includes a serializer (Deserializer; Des) 16 and a parallel-to-serial converter (Serializer) in the all-opto-optoelectric converter module 12. It is characterized in that it further comprises (Ser) 16 '.

The serial-to-parallel converter 16 refers to a device for converting a serial code into a parallel code, and the parallel-to-parallel converter 16 'refers to a device to convert a parallel code to a serial code. This is to solve the problem that it is difficult to achieve accurate synchronization of multiple parallel data transmitted at the same time when transmitting data in terabit (Tb / s) parallel code. The serial-to-parallel converter 16 and the parallel-to-parallel converter 16 ′ are disposed between circuits for electrically connecting the semiconductor chip 10 connected to the upper socket 11 and the all-opto-photoelectric converter module 12. The parallel data transmitted from the semiconductor chip 10 is converted into serial data by the parallel-to-serial converter 16 'and transferred to the all-optical converter 14 included in the all-optical / photoelectric converter module 12. The serial data received from the photoelectric converter 13 included in the all-optical / photoelectric converter module 12 is converted into parallel data by the serial / parallel converter 16 and transferred to the semiconductor chip 10.

3 shows that the socketed opto-optoelectric converter 20 is mounted to the O-PCB 30. As shown in FIG. 3, a generally used semiconductor chip 10 is electrically connected to the upper socket 11 of the socket type photoelectric / photoelectric converter 20 according to the present invention, and the socket type photoelectric / photoelectric converter 20 is mounted to a predetermined portion of the O-PCB 30. At this time, the window formed in the lower socket 17 of the socket-type electro-opto-optoelectric converter 20 is aligned and mounted to match the hole formed through the hole formed to be connected to the end of the optical waveguide embedded in the O-PCB 30. As a result, the O-PCB 30 only needs to form an optical waveguide without forming an external electric wiring except for a ground line and a power line for supplying power to the socket-type photoelectric / photoelectric converter 20. It is possible to easily configure the optical connection circuit.

According to the socket-type all-optoelectric photoelectric converter according to the present invention, it is possible to use the O-PCB that is economical and does not require a separate external electric wiring, because it does not increase the manufacturing cost of the device in which the VCSEL and the photodiode are embedded. It becomes easy to design and manufacture O-PCB.

In addition, the socket-type all-optical photoelectric converter according to the present invention further comprises a serial-to-parallel converter and a parallel-to-parallel converter to solve the synchronization problem that may occur when transmitting parallel data at high speed.

Claims (2)

In the device having a photoelectric / all-optical converter for converting an electrical signal and an optical signal, An upper socket 11 having a coupling portion electrically connected to the semiconductor chip 10; An all-optical converter 14 for converting an electric signal into an optical signal, a photoelectric converter 13 for converting an optical signal into an electric signal, and a driving circuit for driving the all-optical converter 14 and the photoelectric converter 13; An all-optical photoelectric converter module 12 having 15); And A lower socket 17 connected to the O-PCB 30 so as to transmit an optical signal; And an upper socket (11) and an all-opto-optoelectric converter module (12) and a lower socket (17) are sequentially stacked and integrally formed. The method of claim 1, The all-opto-optoelectric converter module 12 further includes a serial-to-parallel converter 16 and a parallel-to-parallel converter 16 'electrically connected to the driving circuit 15. .

Images