JPS62230966A - Device for growing crystal - Google Patents
Device for growing crystalInfo
- Publication number
- JPS62230966A JPS62230966A JP7250986A JP7250986A JPS62230966A JP S62230966 A JPS62230966 A JP S62230966A JP 7250986 A JP7250986 A JP 7250986A JP 7250986 A JP7250986 A JP 7250986A JP S62230966 A JPS62230966 A JP S62230966A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- partition plate
- substrate
- crystal growth
- crucible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 45
- 238000005192 partition Methods 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 31
- 238000010884 ion-beam technique Methods 0.000 abstract description 23
- 239000010408 film Substances 0.000 abstract description 18
- 239000002184 metal Substances 0.000 abstract description 18
- 229910052751 metal Inorganic materials 0.000 abstract description 18
- 239000010409 thin film Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 230000001133 acceleration Effects 0.000 abstract description 4
- 238000002347 injection Methods 0.000 abstract 2
- 239000007924 injection Substances 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 description 19
- 238000001704 evaporation Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 4
- 229910052714 tellurium Inorganic materials 0.000 description 4
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、基板上に結晶、特に積層構造、超格子構造を
もつ薄膜を成長させることにより種々の機能素子等を形
成する結晶成長装置、特にその構造が正確に制御された
、複数の結晶よりなる機能素子を得ることのできる結晶
成長装置に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a crystal growth apparatus for forming various functional elements by growing crystals, particularly thin films having a laminated structure or a superlattice structure, on a substrate; In particular, the present invention relates to a crystal growth apparatus capable of obtaining a functional element made of a plurality of crystals whose structure is accurately controlled.
従来より、結晶成長装置は様々のものがあるが、クラス
ターイオンビーム発生手段を設えた装置nを用いて結晶
成長を行うクラスターイオンビーム発生手段は付着力が
大きい、配向性の制御が可能、基板温度が低くなるとい
う利点を有す。Conventionally, there are various types of crystal growth apparatuses, but the cluster ion beam generating means that performs crystal growth using a device equipped with a cluster ion beam generating means has a large adhesion force, can control the orientation, and can It has the advantage of lower temperature.
以下に複数のクラスターイオンビーム発生手段を有する
従来の結晶成長装置について第2図を用いて説明する。A conventional crystal growth apparatus having a plurality of cluster ion beam generating means will be described below with reference to FIG.
第2図の構成要素は、結晶I&長室1、基板2、成長し
た結晶3、クラスターイオンビーム4゜5、クラスター
イオンビームを制御するシャンク−6,7、加速電極8
,9、イオン化用のフィラメント10 、 +1.ルツ
ボ12 、13、クラスターイオンガン14.15であ
る。この装置において加速電極の電位は、基板に対して
+IQKVあるいは−I QKV程度までの任意の電位
差を設定できる。The components shown in Figure 2 are a crystal I & long chamber 1, a substrate 2, a grown crystal 3, a cluster ion beam 4°5, shanks 6 and 7 for controlling the cluster ion beam, and an accelerating electrode 8.
, 9, filament for ionization 10 , +1. Crucibles 12 and 13, and cluster ion guns 14 and 15. In this device, the potential of the accelerating electrode can be set to any potential difference up to about +IQKV or -IQKV with respect to the substrate.
結晶成長は、結晶成長室1内の真空度、基板2の温度、
ルツボ12.13の温度、加速電極8.9のノ、(板に
対する電位、イオン化用フィラメント10゜11による
イオン化率を所定の値に設定して行われる。Crystal growth depends on the degree of vacuum in the crystal growth chamber 1, the temperature of the substrate 2,
This is carried out by setting the temperature of the crucible 12.13, the potential of the accelerating electrode 8.9 (to the plate), and the ionization rate by the ionization filament 10°11 to predetermined values.
こ(7)装置においてルツボ中の物質を基板上に交互に
結晶成長させるには、シャッター6.7を交互に開閉し
てこの周期を変えることにより形成された71し膜の構
成を制御する。In this (7) apparatus, in order to cause the material in the crucible to grow crystals alternately on the substrate, the structure of the formed film 71 is controlled by alternately opening and closing the shutters 6 and 7 and changing this period.
シカシこの方法ではシャッターの開閉により各イオンが
ンからのイオンビームの流れの乱れが大きく積層膜の界
面が明確にならなかったり、さらにイオンガン同士の距
離が比較的近い場合にはシャッターを閉じた場合このシ
ャッターにはねかえった蒸発物質により他のイオンガン
が汚れてしまうという問題があった。In this method, when the shutter is opened and closed, the flow of the ion beam from each ion gun is greatly disturbed, and the interface of the laminated film is not clear, and furthermore, when the distance between the ion guns is relatively close, when the shutter is closed, There was a problem in that other ion guns were contaminated by the evaporated substances that bounced off the shutter.
本発明は上記問題点に鑑み成されたものであり、その目
的は、複数のイオンビームの流れをイオンビームの流れ
を乱すことなく制御することができ、優れた機能素子が
得られ、イオンガンの汚れもおこらない結晶成長装置を
提供することにある。The present invention has been made in view of the above-mentioned problems, and its purpose is to be able to control the flow of a plurality of ion beams without disturbing the flow of the ion beams, to obtain an excellent functional element, and to improve the performance of an ion gun. An object of the present invention is to provide a crystal growth apparatus that does not cause dirt.
本発明の上記目的は、結晶成長室中に複数の蒸発物質噴
出手段と該蒸発物質が付着する基板のホルダーとを有す
る結晶成長装置であって、該蒸発物質噴出手段の隣接す
る2つの間を通るしきり板が設けられた結晶成長装置に
よて達成される。The above-mentioned object of the present invention is to provide a crystal growth apparatus having a plurality of evaporated material ejecting means in a crystal growth chamber and a holder for a substrate to which the evaporated material is attached, the apparatus comprising: This is achieved by a crystal growth apparatus that is provided with a partition plate that passes through it.
本発明の概略を、複数のクラスターイオンビーム発生手
段を有する装置を用いての金属の積層膜作成を例にとり
第1図を用いて説明する。The outline of the present invention will be explained with reference to FIG. 1, taking as an example the production of a metal laminated film using an apparatus having a plurality of cluster ion beam generating means.
第1図の構成要素は、結晶成長室18、円板状の自転式
基板ホルダー(ホルダー) 17、基板ホルダーの半円
部に取りつけた基板上に成長した金属薄1漠18.基板
回転により半回転した時の薄膜18′、蒸着させる金属
Aを入れたツツポ25、金属Bを入れたツツポ26、そ
れぞれ金属AおよびBのクラスターイオンビーム19
、20、加速電極21.22、イオン化用フィラメント
23.24.2つのクラスターイオンガンの間の仕切板
29である。この仕切板29は、2つのクラスターイオ
ンガンの間から基板直前にまでのびている。The components shown in FIG. 1 are a crystal growth chamber 18, a disk-shaped rotating substrate holder 17, and a metal thin film grown on a substrate attached to the semicircular portion of the substrate holder 18. Thin film 18' after half a rotation due to substrate rotation, a spot 25 containing metal A to be evaporated, a spot 26 containing metal B, and cluster ion beams 19 of metals A and B, respectively.
, 20, acceleration electrodes 21, 22, ionization filaments 23, 24, and a partition plate 29 between the two cluster ion guns. This partition plate 29 extends from between the two cluster ion guns to just in front of the substrate.
この装置を用いて、例えば2種類の金属A、Bの交互植
層膜は例えば次記のようにして作製される。Using this apparatus, for example, an alternating layered film of two types of metals A and B is produced, for example, in the following manner.
膜構成はA→B −A −B−−−−→Aの順序で蒸着
し、ツツポ25には金属A、ルツボ26には金[Bが入
っているとする。基板ホルダーは、パルスモータ−で回
転するが1つのパルスで半回転し、このパルスは水晶振
動子等の膜厚モニターからのシグナルをマイクロコンピ
ュータ−で受け、この、マイクロコンピュータ−が指示
する。まずマイクロコンピュータ−に各種の膜厚を入力
する1次に結晶成長室内を減圧させ、その真空度、基板
温度を設定しルツボ25.26からのクラスターイオン
ビームの強度を水晶振動子等の膜厚モニターで希望の1
曲になるように21!I堕する。クラスターイオンガン
の加速電極を金iA、Hに合わせて独立に設定しイオン
化フィラメントにより金iA、Bのクラスターをイオン
化する。マイクロコンピュータ−により基板シャッター
32を開き、まず金属Aの薄膜を作製する。最初に設定
した膜厚になるとマイクロコンピュータ−の指示により
基板ホルダー17を半回転させ基板の18が18’の位
置になるように移動させる。これを繰り返すことにより
A−B−A→B−−−−→Aの積層膜が得られる。It is assumed that the film structure is deposited in the order of A→B -A -B----→A, and the pot 25 contains metal A, and the crucible 26 contains gold [B]. The substrate holder is rotated by a pulse motor and rotates half a rotation with one pulse, and this pulse is received by a microcomputer that receives a signal from a film thickness monitor such as a crystal oscillator, and this microcomputer gives instructions. First, enter various film thicknesses into the microcomputer. First, reduce the pressure inside the crystal growth chamber, set the vacuum level and substrate temperature, and adjust the intensity of the cluster ion beam from the crucible 25 and 26 to determine the film thickness of the crystal oscillator, etc. desired one on the monitor
21 to become a song! I fall. The accelerating electrodes of the cluster ion gun are set independently for gold iA and H, and the clusters of gold iA and B are ionized by the ionization filament. The substrate shutter 32 is opened by a microcomputer, and a thin film of metal A is first produced. When the initially set film thickness is reached, the substrate holder 17 is rotated half a turn according to instructions from the microcomputer so that the substrate 18 is at the position 18'. By repeating this process, a laminated film of A-B-A→B----→A is obtained.
上記のような方法で結晶成長を行うと仕切板29のため
に2つのイオンビームの混ざりあいがなくなり、金属A
とBの積層界面が明確になる。また、金属A、Hの蒸着
条件、得に加速電極に印加する電位差が異なる場合には
仕切板がないと互いの電場所が相互作用して均一な加速
条件が得られないが、仕切板を備えることにより、独立
で均一な加速条件が得られるという大きな利点もある。When crystal growth is performed using the method described above, there is no mixing of the two ion beams due to the partition plate 29, and the metal A
The laminated interface between and B becomes clear. In addition, if the vapor deposition conditions of metals A and H, especially the potential difference applied to the accelerating electrodes, are different, if there is no partition plate, the electric places will interact with each other and uniform acceleration conditions will not be obtained. This also has the great advantage of providing independent and uniform acceleration conditions.
上記態様例では本発明の結晶成長装置を用いて金属の積
層膜を得る例を示したが、本発明はこれに限るものでは
なく金属以外の材料についても有効である0例えば通常
のクラスターイオンビーム蒸着法では蒸着物質は十の電
荷をもつイオンとして基板に到達するが正と負の’r[
r荷をもつ、もつ物質を交互あるいは同時じ蒸着する場
合にも仕切板が各イオンガンに対する加速電圧の安定化
や放電防止に有効である。(同時に蒸着する場合には仕
切板の高さを基板の大きさに合わせて低くする)さらに
クラスターイオン基若と電子ビーム加熱蒸着を並用する
場合には電子銃からの電子が直接クラスターイオンガン
に流れて放電あるいはクラスターイオン作製条件の不安
定化という問題が生ずるが、これは仕切板の設置により
防止できる。Although the above embodiment shows an example of obtaining a metal laminated film using the crystal growth apparatus of the present invention, the present invention is not limited to this and is also effective for materials other than metals. In the vapor deposition method, the vapor-deposited substance reaches the substrate as ions with a charge of 10, but there are positive and negative 'r[
The partition plate is also effective in stabilizing the accelerating voltage for each ion gun and preventing discharge when evaporating substances with r-loads alternately or simultaneously. (If vapor deposition is performed at the same time, reduce the height of the partition plate to match the size of the substrate.) Furthermore, if cluster ion base and electron beam heating vapor deposition are used together, the electrons from the electron gun will flow directly to the cluster ion gun. However, this problem can be prevented by installing a partition plate.
本発明の結晶成長装置はクラスターイオンビーム蒸着法
だけでなくイオン化蒸着をはじめとして複数の蒸若源を
用いる真空蒸着にはすべて応用可能であり真空蒸着しな
がらイオン注入するような場合にも有効である。The crystal growth apparatus of the present invention is applicable not only to cluster ion beam evaporation, but also to vacuum evaporation using multiple evaporation sources, including ionization evaporation, and is also effective when ions are implanted during vacuum evaporation. be.
以上説明したように本発明の装置は仕切板を有している
ため、複数の蒸発物質を交互、あるいは同時に基板上に
蒸着する場合に各々の蒸着条件を独立に保ち相互の影響
をなくするという効果がある。このことにより積層膜の
界面の明確化、膜厚のモニター精度の向上、蒸着条件の
安定化等が可能になり、より多様な積層膜、より複雑な
組成の薄膜を再現性よく形成することが可能になった。As explained above, since the apparatus of the present invention has a partition plate, when a plurality of evaporation substances are deposited on a substrate alternately or simultaneously, each evaporation condition is maintained independently and mutual influence is eliminated. effective. This makes it possible to clarify the interface of laminated films, improve the accuracy of monitoring film thickness, and stabilize deposition conditions, making it possible to form more diverse laminated films and thin films with more complex compositions with good reproducibility. It's now possible.
本発明の装置において仕切板は、イオンビームの流れが
乱れて隣りのイオンガンに付着しないようにする目的に
おいては、隣接するイオンガンの中間部分近辺だけを仕
切るような大きさでよいが、基板上に成長する結晶の界
面を明確にする目的においては、イオンガンの間から基
板の面の直前まだのびる大きさであることか必要である
。また本発明は、イオンビームの流れを調整するために
仕切板と、従来より使用されているシャッターの両方を
同時に使用することを防げるものではない。In the apparatus of the present invention, the partition plate may have a size that partitions only the intermediate portions of adjacent ion guns in order to prevent the flow of the ion beam from being disturbed and adhering to adjacent ion guns. For the purpose of clarifying the interface of the growing crystal, it is necessary to have a size that extends from between the ion guns to just before the surface of the substrate. Further, the present invention does not prevent simultaneous use of both a partition plate and a conventionally used shutter in order to adjust the flow of the ion beam.
以下に、本発明の具体的実施例を挙げる。 Specific examples of the present invention are listed below.
第1図に示すような装置を用いて鉛とテルルの結晶より
成る結晶積層板を作成した0本実施例の場合、基板とし
ては石英ガラスを用い、ルツボ27内には鉛を入れ、ル
ツボ28にはテルルを入れた。In this embodiment, a crystal laminate made of lead and tellurium crystals was produced using the apparatus shown in FIG. I added tellurium to it.
まず結晶成長室内を2X 1O−6Tart以下に減圧
し、基板を50℃に加熱保持し、ルツボ27は530℃
に加熱し、ルツボ28は650’C!に加熱しクラスタ
ーイオンビームを発生させ、基板上に結晶を成長させた
。クラスターイオンビームを発生させながら基板ホルダ
ー(ホルダー)を120秒毎に反回転させ、鉛の結晶と
テルルの結晶が交互に基板上の半分に1200八−厚に
積層されるようにした。First, the pressure inside the crystal growth chamber is reduced to 2X 1O-6Tart or less, the substrate is heated and maintained at 50°C, and the crucible 27 is heated to 530°C.
Crucible 28 is heated to 650'C! The substrate was heated to generate a cluster ion beam and crystals were grown on the substrate. While generating a cluster ion beam, the substrate holder was counter-rotated every 120 seconds so that lead crystals and tellurium crystals were alternately stacked on half of the substrate to a thickness of 1200 cm.
得られた基板上の結晶積層板の鉛の結晶とテルルの結晶
の界面はきれいな直線を成していた。またイオンガンに
隣りのイオンガンから発生したビームの結晶が付着する
こともなかった。The interface between the lead crystal and tellurium crystal in the crystal laminate on the resulting substrate formed a clean straight line. Furthermore, crystals from the beam generated from the adjacent ion gun did not adhere to the ion gun.
以上に説明したように、本発明の結晶成長装置を使用す
ると、
イオンビームの流れ調整による乱れが小さく、また他の
イオンビームの電荷の影響をうけることがないので、膜
厚が高度に制御できる。As explained above, when the crystal growth apparatus of the present invention is used, the film thickness can be highly controlled because the disturbance caused by adjusting the flow of the ion beam is small and it is not affected by the charge of other ion beams. .
仕切板の物理的遮蔽により結晶の積層界面を、任、化の
形状に明確につけることができる、基板のホルダーが自
由に動くので、積層の位置、結晶する材料の組み合わせ
を自由にかえられ、より多様な積層膜が得られる、
等の効果がある。By physically shielding the partition plate, the laminated interface of the crystals can be clearly set in any desired shape.As the substrate holder moves freely, the position of the laminated layers and the combination of materials to be crystallized can be freely changed. There are effects such as the ability to obtain more diverse laminated films.
第1図は本発明の実施例を示す概略図であり、第2図は
従来の結晶成長装置の一例を示す概略図である。
■、1f3−−−−−−−−−−−−−一結晶成長室2
.17−−−−−−−−−−−−−−基板および基板ホ
ルダー3.1B−−−−−−−−−−−−−一成長した
結晶4、5 、19.20−−−−−一クラスターイオ
ンビームe、7 、30.31.32−シャッター8.
8.21.22−−−−−一加速電極10、11.23
.24−−−−−−イオン化用フィラメント12.13
.25.26−−−−−−ルツボ14.15.27.2
8−−−−−−クラスターイオンガン特許出願人
キャノン株式会社
代 理 人 若 林 忠第
1図
第2図FIG. 1 is a schematic diagram showing an embodiment of the present invention, and FIG. 2 is a schematic diagram showing an example of a conventional crystal growth apparatus. ■, 1f3---------------------- Single crystal growth chamber 2
.. 17------------ Substrate and substrate holder 3.1B--------Grown crystals 4, 5, 19.20---- - One cluster ion beam e, 7, 30.31.32 - Shutter 8.
8.21.22-----One accelerating electrode 10, 11.23
.. 24------Ionization filament 12.13
.. 25.26-----Crucible 14.15.27.2
8---Cluster ion gun patent applicant
Canon Co., Ltd. Agent Tadashi Wakabayashi Figure 1 Figure 2
Claims (2)
発物質が付着する基板のホルダーとを有する結晶成長装
置であって、該蒸発物質噴出手段の隣接する2つの間を
通るしきり板が設けられたことを特徴とする結晶成長装
置。(1) A crystal growth apparatus having a plurality of evaporative substance ejecting means in a crystal growth chamber and a holder for a substrate to which the evaporative substance is attached, wherein a partition plate passes between two adjacent evaporative substance ejecting means. A crystal growth apparatus characterized by being provided with.
特許請求の範囲第1項記載の結晶成長装置。(2) The crystal growth apparatus according to claim 1, further comprising a mechanism for moving the substrate holder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7250986A JPS62230966A (en) | 1986-04-01 | 1986-04-01 | Device for growing crystal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7250986A JPS62230966A (en) | 1986-04-01 | 1986-04-01 | Device for growing crystal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62230966A true JPS62230966A (en) | 1987-10-09 |
Family
ID=13491381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7250986A Pending JPS62230966A (en) | 1986-04-01 | 1986-04-01 | Device for growing crystal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62230966A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100104751A1 (en) * | 2007-02-01 | 2010-04-29 | Tokyo Electron Limited | Evaporating apparatus, evaporating method and manufacturing method of evaporating apparatus |
-
1986
- 1986-04-01 JP JP7250986A patent/JPS62230966A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100104751A1 (en) * | 2007-02-01 | 2010-04-29 | Tokyo Electron Limited | Evaporating apparatus, evaporating method and manufacturing method of evaporating apparatus |
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