JPS6223092Y2 - - Google Patents
Info
- Publication number
- JPS6223092Y2 JPS6223092Y2 JP1980153510U JP15351080U JPS6223092Y2 JP S6223092 Y2 JPS6223092 Y2 JP S6223092Y2 JP 1980153510 U JP1980153510 U JP 1980153510U JP 15351080 U JP15351080 U JP 15351080U JP S6223092 Y2 JPS6223092 Y2 JP S6223092Y2
- Authority
- JP
- Japan
- Prior art keywords
- diode
- tungsten
- case
- silicon
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 12
- 239000004065 semiconductor Substances 0.000 claims description 11
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 10
- 229910052721 tungsten Inorganic materials 0.000 claims description 10
- 239000010937 tungsten Substances 0.000 claims description 10
- 239000008188 pellet Substances 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 7
- 238000005219 brazing Methods 0.000 claims description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- -1 are used Chemical compound 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 208000010543 22q11.2 deletion syndrome Diseases 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980153510U JPS6223092Y2 (US20090163788A1-20090625-C00002.png) | 1980-10-29 | 1980-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980153510U JPS6223092Y2 (US20090163788A1-20090625-C00002.png) | 1980-10-29 | 1980-10-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5775758U JPS5775758U (US20090163788A1-20090625-C00002.png) | 1982-05-11 |
| JPS6223092Y2 true JPS6223092Y2 (US20090163788A1-20090625-C00002.png) | 1987-06-12 |
Family
ID=29512764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980153510U Expired JPS6223092Y2 (US20090163788A1-20090625-C00002.png) | 1980-10-29 | 1980-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6223092Y2 (US20090163788A1-20090625-C00002.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53121460A (en) * | 1977-03-31 | 1978-10-23 | Hitachi Ltd | Electrode lead for semiconductor |
| JPS5438467B2 (US20090163788A1-20090625-C00002.png) * | 1972-07-31 | 1979-11-21 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5438467U (US20090163788A1-20090625-C00002.png) * | 1977-08-22 | 1979-03-13 |
-
1980
- 1980-10-29 JP JP1980153510U patent/JPS6223092Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5438467B2 (US20090163788A1-20090625-C00002.png) * | 1972-07-31 | 1979-11-21 | ||
| JPS53121460A (en) * | 1977-03-31 | 1978-10-23 | Hitachi Ltd | Electrode lead for semiconductor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5775758U (US20090163788A1-20090625-C00002.png) | 1982-05-11 |
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