JPS6223068Y2 - - Google Patents
Info
- Publication number
- JPS6223068Y2 JPS6223068Y2 JP17263679U JP17263679U JPS6223068Y2 JP S6223068 Y2 JPS6223068 Y2 JP S6223068Y2 JP 17263679 U JP17263679 U JP 17263679U JP 17263679 U JP17263679 U JP 17263679U JP S6223068 Y2 JPS6223068 Y2 JP S6223068Y2
- Authority
- JP
- Japan
- Prior art keywords
- outer casing
- lead terminal
- lead
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 210000003739 neck Anatomy 0.000 claims description 10
- 238000004804 winding Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000011800 void material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000000034 method Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Details Of Television Scanning (AREA)
- Coils Or Transformers For Communication (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Rectifiers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17263679U JPS6223068Y2 (fr) | 1979-12-13 | 1979-12-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17263679U JPS6223068Y2 (fr) | 1979-12-13 | 1979-12-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5689223U JPS5689223U (fr) | 1981-07-16 |
| JPS6223068Y2 true JPS6223068Y2 (fr) | 1987-06-12 |
Family
ID=29683440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17263679U Expired JPS6223068Y2 (fr) | 1979-12-13 | 1979-12-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6223068Y2 (fr) |
-
1979
- 1979-12-13 JP JP17263679U patent/JPS6223068Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5689223U (fr) | 1981-07-16 |
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