JPS62230046A - Image sensor - Google Patents
Image sensorInfo
- Publication number
- JPS62230046A JPS62230046A JP61073260A JP7326086A JPS62230046A JP S62230046 A JPS62230046 A JP S62230046A JP 61073260 A JP61073260 A JP 61073260A JP 7326086 A JP7326086 A JP 7326086A JP S62230046 A JPS62230046 A JP S62230046A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- sensor
- substrate
- chip
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000000853 adhesive Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims abstract description 4
- 230000003287 optical effect Effects 0.000 abstract description 3
- 239000010453 quartz Substances 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 238000010276 construction Methods 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はイメージセンサの構造に関するＯ〔従来の技術
〕
従来、第２図に示したように、光センサ１を有するセン
サチップ２を、光透過性基板３に接続しさらにボンディ
ングワイヤ４で”電気的に接続した鯵、モールド剤７で
センサチップをおおい、前記光透過性基板とセンサ駆動
回路１０を７レキシプルフネクタ１３で電気的に接続し
、スペーサ１２で固定したイメージセンサが知られてい
た。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to the structure of an image sensor. [Prior Art] Conventionally, as shown in FIG. The sensor chip is connected to the transparent substrate 3 and further electrically connected with the bonding wire 4, the sensor chip is covered with a molding agent 7, and the light transparent substrate and the sensor drive circuit 10 are electrically connected with the lexical connector 13. However, an image sensor fixed with a spacer 12 was known.
しかし、前述の従来技術では、フレキシブルコネクタと
光透過性基板またはセンサ駆動回路との接続位置精度が
要求され、作業に熟練が必要であった。また、センサチ
ップをおおうモールド高さを、スペーサの高さより低く
する必要があり、そのためにモールド厚さの測定が必要
であるという問題点を有する◎
そこで本発明は、このような問題点を解決する。However, the above-mentioned conventional technology requires precision in the connection position between the flexible connector and the light-transmitting substrate or the sensor drive circuit, and requires skill. In addition, the height of the mold covering the sensor chip must be lower than the height of the spacer, which requires measurement of the mold thickness.The present invention solves this problem. do.
もので、その目的とするところは、センサチップを固定
した光透過性基板と、センサ駆動回路を、できるだけコ
ンバク）Ｋ、しかも電気−な接続を容易に行なえる構造
を提供することにある０〔問題点を解決するための手段
〕
本発明のイメージセンサは・光センサを有するセンサチ
ップを光透過性接着剤によって光透過性基板に接着し、
前記光透過性基板側から光線を入射する構造のイメージ
センサにおいて、センサチップの周囲に枠を設けたこと
を特徴とする。The purpose of this is to provide a structure in which the light-transmissive substrate on which the sensor chip is fixed and the sensor drive circuit can be connected as closely as possible, and in addition, electrical connections can be easily made. Means for Solving the Problems] The image sensor of the present invention includes: A sensor chip having a light sensor is bonded to a light-transparent substrate with a light-transparent adhesive;
The image sensor has a structure in which light is incident from the light-transmissive substrate side, and is characterized in that a frame is provided around the sensor chip.
第１図は、本発明の実施例である＠第１図において、セ
ンサチップ２は石英基板上に光センサ１を形成したもの
であり、光透過性接着剤５によってガラスなどの光透過
性基板６に固定されている◇また、前記センサチップと
光透過性基板はボンディングワイヤ４で電気的に接続さ
れている。光透過性基板には枠６が接着されており、こ
の枠は、センサチップ部分と光透過性基板の￥ｔＬ極部
分がくり抜か、れている。このうち、センサチップ部分
には、センサチップを保護するモールド剤７を、前記枠
よりも盛り上がらないように充填する。−刀先透過性基
板の１１Ｌ極部８には、可撓性の導電性コネクタ９を置
き、この状態で枠の上にセンサ駆動回路１０を重ねて固
定する。このとき、センサ駆動回路が前記導電性コネク
タと接触する部分には光透過性基板の電極と同様の電！
１１か設けられ、導電性コネクタを介して光透過性基板
とセンサ駆動回路は電気的に接続される。FIG. 1 shows an embodiment of the present invention @ In FIG. 1, the sensor chip 2 has an optical sensor 1 formed on a quartz substrate. The sensor chip and the light-transmitting substrate are electrically connected to each other by bonding wires 4. A frame 6 is adhered to the light-transmitting substrate, and the sensor chip portion and the \tL pole portion of the light-transmitting substrate are hollowed out in this frame. Of these, the sensor chip portion is filled with a molding agent 7 for protecting the sensor chip so as not to rise above the frame. - A flexible conductive connector 9 is placed on the 11L pole portion 8 of the transparent tip substrate, and in this state, the sensor drive circuit 10 is stacked and fixed on the frame. At this time, the part where the sensor drive circuit comes into contact with the conductive connector has an electric current similar to the electrode of the light-transmissive substrate.
11 are provided, and the light-transmissive substrate and the sensor drive circuit are electrically connected via the conductive connector.
第３図は・本発明の実施例を各部品に分解して示したも
のである。枠６に突起６αを設け、これに対応する穴１
０ａをセンサ駆動回路１ｏに開ければ、枠とセンサ駆動
回路の位置が簡単にしがも正確に決まる。枠と光透過性
基板３の位置は面を合わせて接着するために、正確に決
定され、したがって光透過性基板とセンサ駆動回路の電
極部分は正確に位曾決めされ、導電性コネクタ９を、枠
をくり抜いた部分に置くだけで、電気的な接続を行なう
ことができる。FIG. 3 shows an embodiment of the present invention broken down into individual parts. A protrusion 6α is provided on the frame 6, and a hole 1 corresponding to the protrusion 6α is provided on the frame 6.
By opening 0a into the sensor drive circuit 1o, the positions of the frame and the sensor drive circuit can be easily and accurately determined. The positions of the frame and the light-transmitting substrate 3 are precisely determined in order to bond them face-to-face, and therefore the light-transmitting substrate and the electrode portion of the sensor driving circuit are precisely positioned, and the conductive connector 9 is Electrical connections can be made simply by placing the frame in the hollowed out area.
以上述べたように、本発明によれば光透過性基板に接着
したセンサチップの周囲に枠を設けたという構造を持つ
ので、枠にセンサ駆動回路を直接固定でき、従来のスペ
ーサを用いたものと比較して、よりコンパクトな構成が
可能である。また・電極部分をくり抜いて、導電性コネ
クタを置くことで、センサチップとセンサ駆動回路の電
気的接続が容易に行なえる。さらに、センサチップを保
躾するモールド剤のはみ出しを防止することができる。As described above, since the present invention has a structure in which a frame is provided around the sensor chip bonded to a light-transmissive substrate, the sensor drive circuit can be directly fixed to the frame, which eliminates the need for conventional spacers. A more compact configuration is possible compared to Additionally, by hollowing out the electrode portion and placing a conductive connector, electrical connection between the sensor chip and the sensor drive circuit can be easily established. Furthermore, it is possible to prevent the molding agent for maintaining the sensor chip from spilling out.
第１図は、本発明のイメージセンサの断面図、第２図は
、従来のイメージセンサの断面図、第５図は、本発明の
実施例を分解して示した斜視図である０
１・・・・・・光センサ ２・・・・・・センサチ
ップ３・・・・・・光透過性基板 ４・・・・・・ボン
ディングワイヤ
５・・・・・・光透過性接着剤 ６・・・・・・枠７・
・・・・・モールド剤
８・・・・−・光透過性基板電極部
９・・・・・・導電性コネクタ
１０・・・・・・センサ駆動回路
１１・・・・・・センサ駆動回路電極部１２・・・・・
・スペーサ
１５・・・・・・７レキシプルコネクタ以 上
２ｆ７Ｊ
碧１ｍFIG. 1 is a sectional view of an image sensor of the present invention, FIG. 2 is a sectional view of a conventional image sensor, and FIG. 5 is an exploded perspective view of an embodiment of the present invention. ... Optical sensor 2 ... Sensor chip 3 ... Light-transmissive substrate 4 ... Bonding wire 5 ... Light-transparent adhesive 6. ...Frame 7.
...Molding agent 8 ... - Light transparent substrate electrode part 9 ... Conductive connector 10 ... Sensor drive circuit 11 ... Sensor drive circuit Electrode part 12...
・Spacer 15...7 Lexi pull connector or more 2f7J Ao 1m
Claims (1)
によって光透過性基板に接着し、前記光透過性基板側か
ら光線を入射する構造のイメージセンサにおいて、セン
サチップの周囲に枠を設けたことを特徴とするイメージ
センサ。(1) In an image sensor having a structure in which a sensor chip having a light sensor is adhered to a light-transmitting substrate using a light-transmitting adhesive and light is incident from the light-transmitting substrate side, a frame is provided around the sensor chip. An image sensor characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61073260A JPS62230046A (en) | 1986-03-31 | 1986-03-31 | Image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61073260A JPS62230046A (en) | 1986-03-31 | 1986-03-31 | Image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62230046A true JPS62230046A (en) | 1987-10-08 |
Family
ID=13513026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61073260A Pending JPS62230046A (en) | 1986-03-31 | 1986-03-31 | Image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62230046A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226080A (en) * | 1988-07-14 | 1990-01-29 | Olympus Optical Co Ltd | Semiconductor device |
| WO2003021300A2 (en) * | 2001-09-05 | 2003-03-13 | Corona Optical Systems, Inc. | Optical attenuating underchip encapsulant |
-
1986
- 1986-03-31 JP JP61073260A patent/JPS62230046A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226080A (en) * | 1988-07-14 | 1990-01-29 | Olympus Optical Co Ltd | Semiconductor device |
| WO2003021300A2 (en) * | 2001-09-05 | 2003-03-13 | Corona Optical Systems, Inc. | Optical attenuating underchip encapsulant |
| WO2003021300A3 (en) * | 2001-09-05 | 2003-12-11 | Corona Optical Systems Inc | Optical attenuating underchip encapsulant |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3644927B2 (en) | Surface emitting device | |
| JP2009296454A (en) | Camera module and mobile terminal | |
| JPH10216083A (en) | Imaging device for endoscope | |
| JPS62230046A (en) | Image sensor | |
| JP2004200631A (en) | Optical sensor package structure | |
| JPH09178549A (en) | Infrared detector | |
| JP3193780B2 (en) | Manufacturing method of reflection type optical coupling device | |
| JP3166216B2 (en) | Solid-state imaging device with on-chip lens and method of manufacturing the same | |
| JPH11351863A (en) | Tilt sensor and its manufacture | |
| US7149023B2 (en) | Optical scanner capable of flip-chip hermetic packaging | |
| JPS63127556A (en) | Manufacture of semiconductor device | |
| JPH0653459A (en) | Solid state image sensing element package | |
| JPS61281559A (en) | Photodetector | |
| JPH0627969Y2 (en) | Photo coupler | |
| JPH10223788A (en) | Optoelectronic device and manufacture thereof | |
| JPS61159751A (en) | Manufacture of optical signal apparatus | |
| JPH0230181A (en) | Semiconductor device | |
| JP2003142669A (en) | Small-sized solid-state image sensing device and its manufacturing method | |
| JPH0645636A (en) | Photodetection and light-emitting element and photodetection and light-emitting device utilizing it | |
| JPH09102681A (en) | Frame ground connecting construction | |
| JPS587651Y2 (en) | Optical semiconductor device with touch electrode | |
| JPH0525878U (en) | Solid-state imaging device | |
| JPH0713038A (en) | Optical package | |
| JPH0593058U (en) | Light emitting diode with built-in driver | |
| JPS63155126A (en) | Input and output display device |