JPH01276759A - Image sensor - Google Patents
Image sensorInfo
- Publication number
- JPH01276759A JPH01276759A JP63105901A JP10590188A JPH01276759A JP H01276759 A JPH01276759 A JP H01276759A JP 63105901 A JP63105901 A JP 63105901A JP 10590188 A JP10590188 A JP 10590188A JP H01276759 A JPH01276759 A JP H01276759A
- Authority
- JP
- Japan
- Prior art keywords
- ccd element
- image sensor
- circuit wiring
- glass plate
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 abstract description 3
- 229920005989 resin Polymers 0.000 abstract description 3
- 238000001914 filtration Methods 0.000 abstract 2
- 239000010931 gold Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明はＣＣＤ （チャージカップリングデバイス）素
子を主要部として成るイメージセンサの改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an improvement of an image sensor having a CCD (charge coupling device) element as a main part.
（従来の技術）
撮像装置の小形、軽量化などの点からＣＣＤ素子を主要
部として成るイメージセンサが注目されている。ところ
でこの種のイメージセンサは一般に、第２図に断面的に
示すように、所要の回路配線１を形成してなる例えばセ
ラミック回路基板２上の所定位置に、ＣＣＤ素子３を銀
ペーストなどによって固定し、回路基板２上の回路配線
１とを金やアルミニウムなどから成るワイヤ４で電気的
に接続するとともにＣＣＤ素子３の受光面にフィルタ機
能を有するガラス５、例えば赤外線吸収性の厚さ０．５
１のガラス板を配設した構成を採っている。(Prior Art) Image sensors that have a CCD element as a main part are attracting attention from the viewpoint of making imaging devices smaller and lighter. Incidentally, as shown in cross section in FIG. 2, this type of image sensor generally has a CCD element 3 fixed at a predetermined position on, for example, a ceramic circuit board 2 on which the required circuit wiring 1 is formed, using silver paste or the like. The circuit wiring 1 on the circuit board 2 is electrically connected to the wire 4 made of gold, aluminum, etc., and the light-receiving surface of the CCD element 3 is covered with glass 5 having a filter function, for example, an infrared absorbing glass 5 having a thickness of 0.5 mm. 5
It has a configuration in which one glass plate is arranged.
（発明が解決しようとする課８）
しかし上記構成のイメージセンサにおいては次のような
問題がある。(Problem 8 to be Solved by the Invention) However, the image sensor having the above configuration has the following problems.
すなわち上記イメージセンサの構成ではＣＣＤ素子３の
リード端子と回路配線１とのワイヤボンディングやＣＣ
Ｄ素子３受光
機能を有するガラス板５の配設などの工程を要し、組立
て、構成が複雑であるばかりでなくワイヤ４のボンディ
ングによる電気的接続の信頼性など実用上不都合な問題
がある。That is, in the configuration of the image sensor described above, wire bonding between the lead terminal of the CCD element 3 and the circuit wiring 1 and the CC
It requires steps such as arranging the glass plate 5 having the light receiving function of the D element 3, which not only complicates the assembly and configuration but also poses practical problems such as the reliability of the electrical connection by bonding the wires 4.
［発明の構成］
（課題を解決するための手段）
本発明は上記実用上の問題に対応してなされたもので、
フィルタ機能を有するガラス板を回路基板と兼用すると
ともに前記回路基板面上にＣＣＤ素子をその受光面を対
向させて固定したことを特徴とする。[Structure of the Invention] (Means for Solving the Problems) The present invention has been made in response to the above practical problems.
The present invention is characterized in that a glass plate having a filter function is also used as a circuit board, and a CCD element is fixed on the surface of the circuit board with its light-receiving surfaces facing each other.
（作 用）
本発明によれば、回路基板をなすガラス板がＣＣＤ素子
の受光面に対し、フィルタとして機能するとともに前記
ＣＣＤ素子の入出力端子は予め対応して配設されている
前記回路基板上の回路配線に直接対接し、電気的な接続
がなされる。つまり構成の簡略化と小形化、さらに信頼
性の向上が同時に達成される。(Function) According to the present invention, the glass plate forming the circuit board functions as a filter for the light-receiving surface of the CCD element, and the input/output terminals of the CCD element are arranged in advance in correspondence with the circuit board. It is in direct contact with the upper circuit wiring and an electrical connection is made. In other words, the structure can be simplified and downsized, and reliability can be improved at the same time.
（実施例） 以下第１図を参照して本発明の詳細な説明する。(Example) The present invention will be described in detail below with reference to FIG.
第１図は本発明のイメージセンサの構成例を断面的に示
したもので、符号６はフィルタ機能を有するガラス、例
えば赤外線を吸収する機能を有する厚さ０．５１のガラ
ス板で、その表面には所定の回路配線１が一体的に形設
されている。しかしてこの回路配線１は例えば厚さ０．
５ｕｍ程度に、ガラス板６面上に被着形成したＡｕ膜に
ついて選択エツチングを行なうことにより形設されたも
のであり、この回路配線１はガラス板６、つまりガラス
基板上に搭載、実装されるＣＣＤ素子３の入出力端子３
ａにそれぞれ対応している。また前記イメージセンサの
本体を成すＣＣＤ素子３はその受光面を前記ガラス板６
に対向させ且つその受光面側に形設しである入出力端子
３ａとしてのＡｕバンブと、前記回路配置ｊｌｌとの電
気的に接続されている。さらに７は前記ガラス板６上に
搭載、実装されたＣＣＤ索子３の周縁部に被着され前記
ＣＣＤ素子３とガラス基板６とを一体的に固定保持する
固定用樹脂層であり、例えば紫外線硬化型樹脂にて形成
されている。FIG. 1 shows a cross-sectional view of an example of the configuration of an image sensor according to the present invention, and reference numeral 6 denotes a glass plate having a filter function, for example, a glass plate having a thickness of 0.51 mm and having a function of absorbing infrared rays. Predetermined circuit wiring 1 is integrally formed in the. However, the circuit wiring 1 of this lever has a thickness of, for example, 0.
The circuit wiring 1 is formed by selectively etching an Au film formed on the surface of the glass plate 6 to a thickness of about 5 um, and the circuit wiring 1 is mounted and mounted on the glass plate 6, that is, the glass substrate. Input/output terminal 3 of CCD element 3
Each corresponds to a. Further, the CCD element 3 forming the main body of the image sensor has its light receiving surface connected to the glass plate 6.
An Au bump serving as an input/output terminal 3a, which is opposed to and formed on the light-receiving surface side thereof, is electrically connected to the circuit arrangement jll. Further, 7 is a fixing resin layer which is attached to the peripheral edge of the CCD element 3 mounted on the glass plate 6 and which fixes and holds the CCD element 3 and the glass substrate 6 integrally. It is made of hardening resin.
［発明の効果］
本発明のイメージセンサにおいてはＣＣＤ素子を搭載、
実装する配線基板をフィルタ機能を有するガラス板で構
成し、且つこのガラス板自体をＣＣＤ素子の受光面に対
するフィルタの役割を果させる。このため従来のイメー
ジセンサの場合のようにフィルタを特に配設する必要も
なくそれだけ構造の簡略化と小形化が図られる。しかも
前記ＣＣＤ素子は、その受光面をガラス板と対向させ且
つＣＣＤ素子受光面側に形設した入出力端子をガラス板
上に形設されている回路配線に直接接続した構成を採っ
ている。つまりワイヤボンディングなどの手段を採って
いないため取扱い操作時ワイヤの断線を招来することも
ないので電気的接続の信頼性も、常に維持される。[Effect of the invention] The image sensor of the invention is equipped with a CCD element,
The wiring board to be mounted is made of a glass plate having a filter function, and the glass plate itself serves as a filter for the light receiving surface of the CCD element. Therefore, there is no need to specifically provide a filter as in the case of conventional image sensors, and the structure can be simplified and downsized accordingly. Moreover, the CCD element has a light-receiving surface facing the glass plate, and input/output terminals formed on the light-receiving surface side of the CCD element are directly connected to circuit wiring formed on the glass plate. In other words, since no means such as wire bonding is used, there is no possibility of wire breakage during handling operations, so the reliability of electrical connection is always maintained.
第１図は本発明に係るイメージセンサの構成例を示す断
面図、第２図は従来のイメージセンサの構成例を示す断
面図である。
１・・・・・・・・・回路配線
３・・・・・・・・・ＣＣＤ素子
６・・・・・・・・・フィルタ機能を有するガラス板第
２図FIG. 1 is a sectional view showing an example of the configuration of an image sensor according to the present invention, and FIG. 2 is a sectional view showing an example of the configuration of a conventional image sensor. 1...Circuit wiring 3...CCD element 6...Glass plate with filter function Fig. 2
Claims (1)
の所定面に一体的に形成された所定の回路配線と、前記
ガラス基板面に受光面を対向して固定され且つ前記回路
配線に電気的に接続したＣＣＤ素子を具備し、前記ガラ
ス基板の一定領域をＣＣＤ素子の受光面に対するフィル
タとして機能させることを特徴とするイメージセンサ。A glass substrate having a filter function, a predetermined circuit wiring integrally formed on a predetermined surface of the glass substrate, and a light-receiving surface fixed to the glass substrate surface facing the same and electrically connected to the circuit wiring. An image sensor comprising a CCD element, wherein a certain area of the glass substrate functions as a filter for a light receiving surface of the CCD element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63105901A JPH01276759A (en) | 1988-04-28 | 1988-04-28 | Image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63105901A JPH01276759A (en) | 1988-04-28 | 1988-04-28 | Image sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01276759A true JPH01276759A (en) | 1989-11-07 |
Family
ID=14419786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63105901A Pending JPH01276759A (en) | 1988-04-28 | 1988-04-28 | Image sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01276759A (en) |
-
1988
- 1988-04-28 JP JP63105901A patent/JPH01276759A/en active Pending
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