JPS6222440A - Pure water flowing tank for semiconductor wafer - Google Patents

Abstract

PURPOSE:To improve the degree of washing of a wafer in a short time by forming a hole for feeding pure wafer to the bottom of a box-shaped water flowing tank proper, an upper section thereof is opened, while forming the uppermost section of a side wall in said water flowing tank proper to a serrated shape and making the thickness of a root section in the serrated section thinner than that of a crest section. CONSTITUTION:The uppermost section of a side wall 11 takes a serrated shape, and consists of crest sections 11a and root sections 11b. Since the thickness of the root sections 11b is made thinner than that of the crest sections 11a in the uppermost section of the side wall 11, foul water is discharged easily outside a tank along inner walls in the root sections 11b, and replaced quickly with novel pure water. Accordingly, the pure water flowing tank for a semiconductor wafer having excellent workability capable of improving the degree of washing of the wafer in a short time can be acquired.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement in a pure water flow tank for semiconductor wafers used in semiconductor book manufacturing.

[Technical background of the invention]

As is well known, cleaning of semiconductor urchins in the semiconductor manufacturing process is carried out as follows. First, to improve cleanliness, about 25 wafers are placed in a carrier and cleaned in a cleaning tank filled with various chemicals for a specified time (usually about 1 minute), then transferred to a running water tank. Specified time (usually 10
(about 1 minute) Rinse with pure water to wash off the chemical solution adhering to the wafer and carrier. Finally, the wafer is dried by spin rotation or the like.

By the way, the ones shown in FIGS. 2 and 3 are conventionally known as the running water tank. Here, FIG. 3 is a partially enlarged perspective view of FIG. 2. 1 in the figure is the main body of the water tank, which is a box with an open top. This running water tank body 1 is
A bottom part 4 having a hole 3 for introducing pure water 2, and a side wall 5.
It consists of The top of the side wall 5 is shown in FIG.
(As shown, it has a serrated shape with peaks 51 and valleys 5b, but the inner wall is flat.

In a running water tank with such a structure, the pure water 2 is fed through the hole 3 in the bottom 4.
... and is discharged from the trough 5b of the side wall 5. However, after chemical cleaning, the chemical solution -
The effectiveness of running pure water during washing depends on how the dirty water in the running water tank is replaced with fresh pure water.

[Problems with background technology]

However, according to the conventional running water tank, the pure water 2 flows through the side wall 5.
When the water is discharged from the troughs 5b, dirty pure water tends to remain on the inner walls 6 of the peaks 5a. Therefore, there is a drawback that it takes a lot of time to improve the degree of cleaning of the wafer.

[Purpose of the invention]

The present invention was made in view of the above circumstances, and an object of the present invention is to provide a pure water flow tank for semiconductor wafers that can improve the degree of cleaning of wafers in a short time.

[Summary of the invention]

The present invention provides a hole for supplying supplementary water at the bottom of a box-shaped running water tank main body with an open top, and also has a sawtooth shape at the top of the side wall of the running water tank main body, and the troughs of this sawtooth-shaped part By making the wall thickness thinner than the wall thickness of the ridges, it is possible to reduce the amount of dirty pure water remaining on the inner walls of the ridges of the side wall than before, and to improve the cleaning efficiency of the wafer in a short time. be.

[Embodiments of the invention] An embodiment of the present invention will be described below with reference to FIG.

In addition, the same parts as before are given the same symbols and are referred to as F! Omit A.

11 in the figure is a side wall. The top of this side wall 11 is serrated and has peaks 11a and valleys 11b. Here, the wall thickness of the valley portion 11b is thinner than the wall thickness of the peak portion 11&.

According to the present invention, at the top of the side wall 11, the thickness of the valley portion 11b is thinner than that of the peak portion 11a, so that dirty water easily flows along the inner wall of the valley portion 11b. The purified water is then drained out of the tank and immediately replaced with fresh pure water.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to provide a pure water flow tank for semiconductor wafers with good workability that can improve the degree of cleaning of wafers in a short time.

[Brief explanation of drawings]

FIG. 1 is a perspective view of the main parts of a pure water tank for semiconductor wafers according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a conventional pure water tank for semiconductor wafers, and FIG. FIG. 1... Water tank body, 2... Pure water, 3... Hole, 4...
...bottom, 1no...side wall, 11a...mountain, llb
...Tanibe. Applicant's agent Patent attorney Takehiko Suzue Figures 1 and 2

Claims (1)

[Claims] In a pure water flow tank for cleaning semiconductor wafers, a hole for supplying pure water is provided at the bottom of the box-shaped flow tank body with an open top, and the top of the side wall of the flow tank body is serrated. A pure water flow tank for semiconductor wafers, characterized in that the wall thickness of the valley portion of the portion is made thinner than the wall thickness of the peak portion.