JPS62218588A - Formation of conductor passage - Google Patents
Formation of conductor passageInfo
- Publication number
- JPS62218588A JPS62218588A JP5931886A JP5931886A JPS62218588A JP S62218588 A JPS62218588 A JP S62218588A JP 5931886 A JP5931886 A JP 5931886A JP 5931886 A JP5931886 A JP 5931886A JP S62218588 A JPS62218588 A JP S62218588A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- hole
- metal
- laser beam
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 23
- 230000015572 biosynthetic process Effects 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 238000000151 deposition Methods 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 16
- 238000003754 machining Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
この発明は、回路基板の導体路など、特にレーザビーム
を利用して絶縁基板に導体路を形成する導体路形成方法
に関する。[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a method for forming conductor paths on an insulating substrate using a laser beam, particularly for forming conductor paths on a circuit board. .
（従来の技術）
電子機器の小形高密度化にともなって、小形高密度の回
路基板を形成するために、基板の両面さらにはその中間
部に導体路を形成して５．所要の導体路を基板を貫通し
て設けられたスルーホールで接続するようにした多層配
線板が広く使用されている′。(Prior Art) As electronic devices become smaller and more dense, conductor paths are formed on both sides of the substrate as well as in the middle of the substrate in order to form a small and high-density circuit board.5. Multilayer wiring boards are widely used in which required conductor paths are connected through through holes provided through the board.
かかる多層配線板の製作方法として、従来よりこれを銅
積層板を素材として形成する方法（サブトラクティブ法
）、および接着剤付き基板などを用いて、めっきにより
導体路を形成するアディティブ法がある。しかし、いづ
れの製作方法についても、これら従来の製作方法は、ド
リリングやパンチングなど機械的方法により基板に貫通
孔を形成したのち、この貫通孔の内面を無電解めっき、
ついで電解めっきなどをしてスルーホールを形成するた
め、製作に工数がかかる。Conventional methods for producing such multilayer wiring boards include a subtractive method in which a copper laminate is used as a material, and an additive method in which conductor paths are formed by plating using an adhesive-coated substrate. However, these conventional manufacturing methods involve forming a through hole in the substrate by mechanical methods such as drilling or punching, and then electroless plating the inner surface of the through hole.
The through holes are then formed by electrolytic plating, which requires a lot of man-hours to manufacture.
上記従来の回路基板の製作方法のほかに、レーザを利用
して基板に導体路を形成する方法がある。In addition to the conventional circuit board manufacturing method described above, there is a method of forming conductor paths on the board using a laser.
たとえば特開昭５６−６４９７号公報には、基板にレー
ザビームを照射して溝加工し、この溝に導体ベーストを
流しこんで導体路を形成する方法が示されている。しか
し、レーザを利用した従来の回路基板の製作方法は、導
体路形成に対して、レーザを二次的に利用して回路基板
を製作しているにすぎない。For example, Japanese Unexamined Patent Publication No. 56-6497 discloses a method in which a substrate is irradiated with a laser beam to form a groove, and a conductor base is poured into the groove to form a conductor path. However, in the conventional circuit board fabrication method using a laser, the laser is only used secondarily to form the conductor path to fabricate the circuit board.
（発明が解決しようとする問題点）
上記のように従来の回路基板の導体路形成方法は、スル
ーホールについて述べたように、異質の加工処理を必要
とし、また、製作に工数がかかる。(Problems to be Solved by the Invention) As described above, the conventional method for forming conductor paths on a circuit board requires different types of processing, as described for through holes, and also requires a lot of man-hours to manufacture.
この発明は、かかる問題点にかんがみ、レーザビームを
利用して、基板の加工と同時にその加工部に導体路を形
成する方法を得ることを目的とする。SUMMARY OF THE INVENTION In view of these problems, it is an object of the present invention to provide a method for simultaneously processing a substrate and forming a conductor path in a processed portion using a laser beam.
（問題点を解決するための手段）
この発明は、絶縁基板の片面または両面に、金属板また
は金属膜を密着してレーザビームを照射し、絶縁基板を
レーザ加工すると同時に、金属板または金属膜を蒸発ま
たは溶融させて、絶縁基板のレーザ加工部に付着させる
ことにより、導体路を形成するようにしたものである。(Means for Solving the Problems) This invention provides a method for irradiating a laser beam on one or both sides of an insulating substrate with a metal plate or metal film in close contact with the insulating substrate, processing the insulating substrate with the laser, and simultaneously processing the metal plate or metal film. The conductor path is formed by evaporating or melting the wafer and attaching it to the laser-processed portion of the insulating substrate.
（作用）
絶縁基板の片面または両面に金属板または金属膜を密着
させてレーザビームを照射すると、絶縁基板の加工と同
時に、その加工部に蒸発金属または溶融金属を付着させ
ることができ、容易に導体路を形成すること力くできる
。(Function) When a metal plate or metal film is closely attached to one or both sides of an insulating substrate and irradiated with a laser beam, evaporated metal or molten metal can be attached to the processed part at the same time as processing the insulating substrate, making it easy to process. Easy to form conductor paths.
（実施例）
以下、図面を参照してこの発明を実施例に基づいて説明
する。(Example) Hereinafter, the present invention will be described based on an example with reference to the drawings.
まず、第１図（Ａ）図に示すように、セラミックスまた
はプラスチックなどからなる絶縁基板■の片面に金属板
■を密着して配置する。しかるのち、（Ｂ）図に示すよ
うに、金属板■の反対側から絶縁基板■の所要部分に、
レーザ発振器から放出されたレーザビーム■を集光レン
ズ（イ）で集光して照射する。First, as shown in FIG. 1(A), a metal plate (2) is placed in close contact with one side of an insulating substrate (2) made of ceramics, plastic, or the like. After that, as shown in figure (B), from the opposite side of the metal plate ■ to the required part of the insulating substrate ■,
The laser beam (■) emitted from the laser oscillator is focused by a condensing lens (A) and irradiated.
このレーザビーム■の照射により、絶縁基板■の所要部
分に貫通孔が形成され、さらにこの貫通孔を通過したレ
ーザビーム■により、金属板■が溶融蒸発する。そして
この溶融蒸発金属が上記貫通孔を通って噴出するとき、
貫通孔内面に付着して導電層■を形成する。なお、上記
レーザビーム■を照射するとき、絶縁基板■および金属
板■から発生する溶融飛散物から集光レンズ（イ）を保
護するために、その前面にガラスなどからなる保護板■
またはプラスチックフィルムなどを配置するとよい、な
おまた、レーザビーム■の照射を不活性ガス雰囲気中で
おこなうと、酸化の少い導電層■を形成することができ
る。By irradiating the laser beam (2), a through hole is formed in a required portion of the insulating substrate (2), and the laser beam (2) passing through this through hole melts and evaporates the metal plate (2). When this molten evaporated metal ejects through the through hole,
It adheres to the inner surface of the through hole to form a conductive layer. In addition, in order to protect the condenser lens (A) from melted debris generated from the insulating substrate ■ and metal plate ■ when irradiating the laser beam ■ mentioned above, a protective plate made of glass or the like is placed in front of the condenser lens (A).
Alternatively, a plastic film or the like may be disposed.Furthermore, conductive layer (2) that is less oxidized can be formed by performing irradiation with laser beam (2) in an inert gas atmosphere.
つぎに、第２図に示すように、上記レーザ加工された絶
縁基板■から金属板■を取除くことにより、貫通孔の内
面に導電層■からなる導体路が形成された絶縁基板が得
られ１回路基板のスルーホールとして用いることができ
る。Next, as shown in FIG. 2, by removing the metal plate ■ from the laser-processed insulating substrate ■, an insulating substrate with a conductor path made of a conductive layer ■ formed on the inner surface of the through hole is obtained. It can be used as a through hole in one circuit board.
なお、上記のように形成された導体路の信頼性−４＝
を高めるために、上記絶縁基板を無電解めっき液に浸漬
して、導電層■上にめっき層を形成することは任意であ
る。In addition, in order to increase the reliability of the conductor path formed as described above, it is optional to immerse the above-mentioned insulating substrate in an electroless plating solution to form a plating layer on the conductive layer. .
つぎに他の実施例について述べる。Next, other embodiments will be described.
上記実施例では、絶縁基板の片面に金属板を密着してレ
ーザビームにより孔あけ加工したが、絶縁基板の両面に
金属板を密着して、レーザビームにより孔あけ加工して
も、同様に所要の導電路を形成することができる。In the above example, a metal plate was attached closely to one side of the insulating substrate and holes were drilled using a laser beam.However, it is also possible to attach metal plates to both sides of the insulating substrate and drill holes using a laser beam. A conductive path can be formed.
また、金属板のかわりに、第３図に示すように絶縁基板
■の両面または片面にＤ Ｂ Ｃ（ＤｉｒｅｃｔＢｏｎ
ｄｉｎｇ Ｃｕｐｐｓｒ）など金属膜■を密着して、レ
ーザビームにより孔あけ加工しても、同様の導電路を形
成することができ、また、第４図に示すように、絶縁基
板■の一方の面に金属板■、他方の面に金属膜■を密着
して加工しても、同様に所要の導電路を形成することが
できる。In addition, instead of the metal plate, as shown in Fig. 3, a D B C (Direct Bon
A similar conductive path can be formed by closely adhering a metal film (such as Ding Cupsr) and drilling holes with a laser beam. Even if the metal plate (1) is closely attached to the other surface and the metal film (2) is processed in close contact with the other surface, the required conductive path can be formed in the same way.
また、上記実施例は、絶縁基板を孔あけ加工してスルー
ホール形成する場合について述べたが、この発明は、絶
縁基板に溝加工など他の形状の加工を施すと同時に、そ
の加工部に導電層を形成する場合にも適用できる。Further, in the above embodiment, a case has been described in which a through hole is formed by drilling an insulating substrate, but the present invention is capable of processing other shapes such as grooves in an insulating substrate and at the same time making the processed portion conductive. It can also be applied when forming layers.
なお１回路基板の製作は、上記各実施例に示した方法に
より、たとえば絶縁基板にスルーホールを形成したのち
に、この絶縁基板面に配線パターンを形成してもよく、
また、あらかじめ配線パターンが形成された絶縁基板を
」二記実施例に示した方法により加工して、所要の回路
基板としてもよい。Note that one circuit board may be manufactured by, for example, forming through holes in an insulating substrate by the method shown in each of the above embodiments, and then forming a wiring pattern on the surface of this insulating substrate.
Alternatively, an insulating substrate on which a wiring pattern has been formed in advance may be processed by the method shown in the second embodiment to form a desired circuit board.
絶縁基板の片面または両面に、金属板または金属膜を密
着して、上記絶縁基板をレーザ加工すると同時に、金属
板または金属膜を蒸発または溶融させて、絶縁基板のレ
ーザ加工部に付着させるようにしたので、所要の導体路
を容易に形成することができる。A metal plate or metal film is closely attached to one or both sides of the insulating substrate, and at the same time as the insulating substrate is laser-processed, the metal plate or metal film is evaporated or melted and attached to the laser-processed part of the insulating substrate. Therefore, the required conductor path can be easily formed.
第１図（Ａ）および（Ｂ）図はそれぞれこの発明の一実
施例である絶縁基板にスルーホールを形成する工程図、
第２図はスルーホールが形成された絶縁基板の断面図、
第３図は他の実施例の説明図、第４図は同じく異なる他
の実施例の説明図である。
■・・・絶縁基板 ■・・・金属板■・・・レー
ザビーム ■・・・導電層■・・・金属膜FIGS. 1A and 1B are process diagrams for forming through holes in an insulating substrate according to an embodiment of the present invention, respectively;
Figure 2 is a cross-sectional view of an insulating substrate with through holes formed.
FIG. 3 is an explanatory diagram of another embodiment, and FIG. 4 is an explanatory diagram of another similarly different embodiment. ■・・・Insulating substrate ■・・・Metal plate ■・・・Laser beam ■・・・Conductive layer ■・・・Metal film
Claims (3)
この金属板または金属膜を介してレーザビームを照射し
て上記絶縁基板をレーザ加工すると同時に上記金属板ま
たは金属膜を蒸発または溶融させ、その金属蒸気または
金属溶融物を上記絶縁基板のレーザ加工部に付着させる
ことにより導体路を形成することを特徴とする導体路形
成方法。(1) A metal plate or metal film is closely attached to the plate surface of an insulating substrate, and a laser beam is irradiated through the metal plate or metal film to laser process the insulating substrate, and at the same time evaporate or melt the metal plate or metal film. A method for forming a conductor path, characterized in that the conductor path is formed by depositing the metal vapor or molten metal on a laser-processed portion of the insulating substrate.
ることを特徴とする特許請求の範囲第１項記載の導体路
形成方法。(2) A method for forming a conductor path according to claim 1, characterized in that a metal plate or a metal film is brought into close contact with one side of an insulating substrate.
ることを特徴とする特許請求の範囲第１項記載の導体路
形成方法。(3) A method for forming a conductor path according to claim 1, characterized in that a metal plate or a metal film is brought into close contact with both surfaces of an insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5931886A JPS62218588A (en) | 1986-03-19 | 1986-03-19 | Formation of conductor passage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5931886A JPS62218588A (en) | 1986-03-19 | 1986-03-19 | Formation of conductor passage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62218588A true JPS62218588A (en) | 1987-09-25 |
Family
ID=13109891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5931886A Pending JPS62218588A (en) | 1986-03-19 | 1986-03-19 | Formation of conductor passage |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62218588A (en) |
-
1986
- 1986-03-19 JP JP5931886A patent/JPS62218588A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5369881A (en) | Method of forming circuit wiring pattern | |
| JPH10190192A (en) | Process of manufacturing printed circuit board | |
| JP2002539630A (en) | Method for providing contact holes in an electrically insulated base material having metal layers on both sides | |
| JPH06223890A (en) | Method of forming electrical interconnection point in laminated via-hole | |
| JPH04283992A (en) | Manufacture of printed circuit board | |
| JPS62218588A (en) | Formation of conductor passage | |
| US6523257B1 (en) | Method for forming fine through hole conduction portion of circuit board | |
| DE60316832D1 (en) | MULTILAYER CIRCUIT ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF | |
| JP3154964B2 (en) | Printed circuit board and its laser drilling method | |
| GB2203290A (en) | Manufacture of printed circuit boards | |
| KR100434072B1 (en) | Through hole forming method of pcb using laser | |
| KR100873666B1 (en) | Method of processing double-sided core for printed circuit board | |
| JPH11121900A (en) | Production of circuit board | |
| JPH04150033A (en) | Bump on electronic circuit board; formation method of bump on electronic circuit board and of circuit pattern | |
| JP2881515B2 (en) | Printed circuit board manufacturing method | |
| JP2000503484A (en) | Method of forming at least two wiring surfaces on an electrically insulating support | |
| JPS61214497A (en) | Manufacture of printed wiring board | |
| JPS639194A (en) | Manufacture of multilayer printed circuit board | |
| JPS60134493A (en) | Method of machining circuit board | |
| JP2904756B2 (en) | Method of perforating printed circuit board and method of manufacturing printed circuit board having the method | |
| Manirambona et al. | Excimer laser microvia-technology in multichip modules | |
| JPS63169791A (en) | Method of forming wiring pattern | |
| JP2021163893A (en) | Circuit wiring board and wiring pattern formation method | |
| JPS63289990A (en) | Manufacture of printed wiring board | |
| JPH0336319B2 (en) |