JPS62216328A - Hot plate type baking apparatus - Google Patents

Abstract

PURPOSE:To eliminate damages on the back surface of a substrate and the front surface of a hot plate by supporting part of a semiconductor substrate at a predetermined position on the front surface of the hot plate to provide a recess for containing the substrate, thereby correctly setting the substrate on the plate. CONSTITUTION:A recess 2 of a lateral width size or slightly wider than the width is formed at a predetermined position on the front surface of each hot plate 1 of a baking apparatus, and the recess 2 is opened at the front and rear edges of the plate 1. Oblique surfaces 4, 4 for supporting the lower edge 5 of a substrate 3 inclined from the bottom are formed at the corners of the bottom of the recess 2. Accordingly, since the substrate 3 is supported at the lower edge 5 in a horizontal state to the oblique surfaces 4, 4 to be contained in the recess 2, the lateral displacement of the substrate 3 is restricted to be set at a predetermined position on the plate 3. Since the substrate 3 is supported at the lower edges 5 by the oblique surfaces 4, 4, no dust is inserted between the substrate 3 and the plate 1. Thus, the damages to the back surface of the substrate 3 and plate 1 can be eliminated.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a hot plate baking device.

[Prior art] In the semiconductor manufacturing process, a resist coated substrate is
Baking treatment is performed as a pre-exposure process. Baking methods include an oven method, a hot plate method, etc., but in view of semiconductor miniaturization, higher density, throughput, etc., the hot plate method is becoming more important in the future.

By the way, this type of conventional one-plate baking apparatus has a plurality of hot plates 1,1.
..., and the substrate to be betatized is sent to each hot plate 1 via a conveyance system 7 such as an arm and subjected to baking treatment.

[Problems to be Solved by the Invention] The surface of the hot plate of the above-mentioned conventional hot plate baking apparatus is an extremely uniform flat surface, and the back surface of the semiconductor substrate is also an extremely uniform flat surface. When placing a substrate on the hot plate, the substrate may shift laterally due to the reaction force generated when the air present between the substrate and the hot plate is compressed, and there is a possibility that the substrate may not be set in the correct position. Therefore, when moving the substrate to the next hot plate, it becomes difficult to lift the substrate from the hot plate using a transfer system consisting of an arm, or even if it is lifted, it is difficult to set the substrate in the correct position on the next hot plate. There is a disadvantage that it becomes impossible to perform the baking process and the prescribed baking process cannot be carried out. In addition, if the board is placed on the hot plate with dirt caught between the board and the hot plate, it may cause scratches on the back side of the board or the surface of the hot plate, which may result in the production of good products, especially for mask boards. The drawback is that it cannot be done.

An object of the present invention is to provide an apparatus for accurately setting a substrate on a hot plate, eliminating scratches on the back surface of the substrate and the surface of the hot plate, and manufacturing semiconductors with high precision.

[Means for Solving the Problems] The present invention provides a baking apparatus equipped with a hot plate for baking a semiconductor substrate, in which a part of the semiconductor substrate is supported and accommodated at a predetermined position on the surface of the hot plate. This is a hot plate type baking device characterized by having a recessed portion.

[Example] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

1 and 2, a recess 2 having a width equal to or slightly wider than the width of the substrate 3 is formed at a predetermined position on the surface of each hot plate 1 of the baking apparatus. The recess 2 is open at the front and rear edges of the hot plate 1. Roughly, at the bottom corners of the recessed portion 2, inclined surfaces 4, 4 are respectively formed which are inclined upward from the bottom surface and support the lower surface edge 5 of the substrate 3.

Therefore, the semiconductor substrate 3 is in a horizontal state with its bottom edge 5
Since the substrate 3 is supported by the inclined surfaces 4, 4 and accommodated in the recess 2, displacement of the substrate 3 in the lateral direction is restricted and the substrate 3 is set at a fixed position on the hot plate 3. Furthermore, since the lower edge 5 of the semiconductor substrate 3 can be supported by the inclined surface 4° 4, there is no possibility of dust being caught between the semiconductor substrate 3 and the hot plate 1, and the back surface of the substrate 3 and the front surface of the hot plate 1 can be It won't hurt.

[Effects of the Invention] As explained above, the present invention allows the substrate to be set in the correct position on the hot plate, and also eliminates the occurrence of scratches due to dust etc. caught between the hot plate and the substrate. In particular, since a mask substrate without scratches can be manufactured, the yield in the process using this mask can be improved.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view thereof, and FIG. 3 is a perspective view of a hot plate baking apparatus. 1... Hot plate 2... Concavity 3... Substrate 4... Inclined surface 5... Board edge 6... Back side of the board

Claims (1)

[Claims] (1) A baking apparatus equipped with a hot plate for baking a semiconductor substrate, characterized in that a recess for supporting a part of the semiconductor substrate and accommodating the substrate is provided at a predetermined position on the surface of the hot plate. Plate baking equipment.