JPS6221534U - - Google Patents
Info
- Publication number
- JPS6221534U JPS6221534U JP11412085U JP11412085U JPS6221534U JP S6221534 U JPS6221534 U JP S6221534U JP 11412085 U JP11412085 U JP 11412085U JP 11412085 U JP11412085 U JP 11412085U JP S6221534 U JPS6221534 U JP S6221534U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- probe
- probe needles
- semiconductor chip
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
第１図は本考案の実施例を示すプローブカード
の使用時の縦断面図、第２図は従来のプローブカ
ードの使用時の平面図、第３図は第２図の縦断面
図、第４図は第２図中の半導体ウエハの全体平面
図、第５図は第２図のプローブカード使用時に用
いられるマーカペンの図、第６図は第３図の部分
拡大図、第７図は従来の他の不良マークを示す図
、第８図は第１図の部分拡大図、第９図は本考案
の他の実施例を示すプローブ針の図である。
１０……半導体ウエハ、１１……半導体チツプ
、１２……インク、２１……プローブカード、２
２……基板、２２ａ……開口部、２３……取付部
材、２４……プローブ針、２４ａ……折り曲げ箇
所。
Fig. 1 is a longitudinal sectional view of a probe card according to an embodiment of the present invention when in use, Fig. 2 is a plan view of a conventional probe card in use, Fig. 3 is a longitudinal sectional view of Fig. 2, and Fig. 4 is a longitudinal sectional view of a probe card in use. The figure is an overall plan view of the semiconductor wafer in Figure 2, Figure 5 is a diagram of a marker pen used when using the probe card in Figure 2, Figure 6 is a partially enlarged view of Figure 3, and Figure 7 is a conventional 8 is a partially enlarged view of FIG. 1, and FIG. 9 is a view of a probe needle showing another embodiment of the present invention. 10...Semiconductor wafer, 11...Semiconductor chip, 12...Ink, 21...Probe card, 2
2...Substrate, 22a...Opening, 23...Mounting member, 24...Probe needle, 24a...Bending portion.
Claims (1)
配置される基板と、一端が前記基板の下面に固定
され他端が前記電極部と接触、離脱するバネ性を
有する複数本のプローブ針とを具えたプローブカ
ードにおいて、 前記プローブ針の他端附近を折り曲げ、その折
り曲げ箇所から一端方向への部分を、前記半導体
チツプから所定距離離して該プローブ針を前記基
板に固定したことを特徴とするプローブカード。[Claims for Utility Model Registration] A substrate disposed facing a semiconductor chip having a plurality of electrode parts, and a spring having one end fixed to the lower surface of the substrate and the other end coming into contact with and separating from the electrode parts. In a probe card equipped with a plurality of probe needles, the probe needles are fixed to the substrate by bending the vicinity of the other end of the probe needles, and fixing the probe needles to the substrate with a portion from the bending point toward one end separated from the semiconductor chip by a predetermined distance. A probe card that is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11412085U JPS6221534U (en) | 1985-07-25 | 1985-07-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11412085U JPS6221534U (en) | 1985-07-25 | 1985-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6221534U true JPS6221534U (en) | 1987-02-09 |
Family
ID=30996561
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11412085U Pending JPS6221534U (en) | 1985-07-25 | 1985-07-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6221534U (en) |
-
1985
- 1985-07-25 JP JP11412085U patent/JPS6221534U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6221534U (en) | ||
| JPS61127880U (en) | ||
| JPS6249239U (en) | ||
| JPH0463133U (en) | ||
| JPS6343435U (en) | ||
| JPS61192877U (en) | ||
| JPH01147455U (en) | ||
| JPS62171014U (en) | ||
| JPS61173143U (en) | ||
| JPS622260U (en) | ||
| JPS6371536U (en) | ||
| JPH0232063U (en) | ||
| JPH0380373U (en) | ||
| JPS63172148U (en) | ||
| JPS6226026U (en) | ||
| JPS5997763U (en) | nozzle pick | |
| JPS63155663U (en) | ||
| JPS62131438U (en) | ||
| JPS6115761U (en) | Semiconductor integrated circuit device | |
| JPS6271885U (en) | ||
| JPH0436465U (en) | ||
| JPS61158966U (en) | ||
| JPS6237893U (en) | ||
| JPH0323945U (en) | ||
| JPS6113161U (en) | piezoelectric ignition device |