JPS62210695A - Attaching apparatus for electronic controller - Google Patents
Attaching apparatus for electronic controllerInfo
- Publication number
- JPS62210695A JPS62210695A JP5247986A JP5247986A JPS62210695A JP S62210695 A JPS62210695 A JP S62210695A JP 5247986 A JP5247986 A JP 5247986A JP 5247986 A JP5247986 A JP 5247986A JP S62210695 A JPS62210695 A JP S62210695A
- Authority
- JP
- Japan
- Prior art keywords
- electronic controller
- wiring board
- printed wiring
- case
- operation panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000945 filler Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は電子コントローラの取付方法に係り、特に洗濯
機等の水を使用する機器の電子コントローラに好適な取
付装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method for mounting an electronic controller, and particularly to a mounting device suitable for an electronic controller of an appliance that uses water, such as a washing machine.
従来の防水性充填材により電子部品を充填固化した電子
コントローラの取付方法としては実開昭６０−１１４７
５号公報および特開昭６０−１８３７９５号公報に記載
のように、一側が開口した樹脂成形によるケースの開口
側を上方または多少傾けた状態で操作パネルに取付けら
れており、開口側が水平方向または下方に向けられて取
付けられたものはなかった。従来例のように、ケースの
開口側を上方に向けて操作パネルに取付けた場合第１図
および第２図に示すように、樹脂成形によるケース１内
に充填固化された防水性充填材２の上面に、操作パネル
３表面に設けられたスイッチ操作子４同囲のすき間５等
上り浸入した水６かたまり、電子部品７を腐蝕させたり
、電子部品７と防水性充填材２との境界面に生じた剥離
部８から水が浸入し、電子部品７の端子９や印刷配線板
１０の導体回路パターン（図示せず）を腐蝕させたりす
る不具合があった。Utility Model Application Publication No. 60-1147 is a method for installing an electronic controller in which electronic components are filled and solidified with a conventional waterproof filler.
As described in Publication No. 5 and Japanese Patent Application Laid-open No. 183795/1983, a resin-molded case with an opening on one side is attached to the operation panel with the opening side facing upward or slightly tilted, and the opening side facing horizontally or slightly tilted. None were mounted facing downwards. When the case is attached to the operation panel with the opening side facing upward, as in the conventional case, as shown in Figs. On the top surface, water 6 that has entered the gap 5 surrounding the switch operator 4 provided on the surface of the operation panel 3 may corrode the electronic component 7 or cause damage to the interface between the electronic component 7 and the waterproof filler 2. There was a problem in that water entered through the resulting peeled portion 8 and corroded the terminal 9 of the electronic component 7 and the conductive circuit pattern (not shown) of the printed wiring board 10.
本発明の目的は、このような従来の問題点に着目し、外
部から水等が浸入しても、ケース１内に充填固化された
防水性充填材２および電子部品７の表面に水等が付着し
たり、多量の水に浸されたりすることがないような電子
コントローラの取付方法を提供することにある。The purpose of the present invention is to focus on such conventional problems, and to prevent water from entering the surface of the waterproof filler 2 filled and solidified in the case 1 and the electronic components 7 even if water or the like infiltrates from the outside. It is an object of the present invention to provide a method for mounting an electronic controller that does not get stuck or immersed in a large amount of water.
本発明においてはケース１の開口部を下方に向けて操作
パネル３に取付けることにより、操作パネル３表面のす
き間５より浸入した水６をケース１の底部で受け、ケー
ス１内に充填固化された防水性充填材２および、電子部
品７が直接浸入した水６に触れることがないような構造
としたものである。In the present invention, by attaching the case 1 to the operation panel 3 with the opening facing downward, water 6 that has entered through the gap 5 on the surface of the operation panel 3 is received at the bottom of the case 1, and the water is filled and solidified into the case 1. The structure is such that the waterproof filler 2 and the electronic components 7 do not come into direct contact with the water 6 that has entered.
以下、本発明の一実施例を第１図、第２図により説明す
る。An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
トランジスタ、ＩＣ，抵抗、コンデンサ等の電子部品７
は印刷配線板１０の片面に配置され、印刷配線板１０の
他面に形成されている導体回路パターンに前記電子部品
７の端子９の先端が半田１１で固定されて、一方、チッ
プ形トランジスタ。Electronic components such as transistors, ICs, resistors, and capacitors 7
is arranged on one side of the printed wiring board 10, and the tips of the terminals 9 of the electronic component 7 are fixed with solder 11 to the conductive circuit pattern formed on the other side of the printed wiring board 10, and on the other hand, a chip type transistor.
ダイオード、抵抗、コンデンサ等の部品１２は前記導体
回路パターン上に接着剤にて仮止めされた後、半田槽に
浸されて、やはり半田１１にて固定されている。一方、
ケース１には印刷配線板１０を浸した状態で印刷配線板
１０上の電子部品７の端子９が十分覆われるだけの深さ
まで、ウレタン樹脂等の防水性充填材２が注入されてい
る。特に。Components 12 such as diodes, resistors, capacitors, etc. are temporarily fixed on the conductor circuit pattern with adhesive, then immersed in a solder bath and fixed with solder 11 as well. on the other hand,
A waterproof filler 2 such as urethane resin is injected into the case 1 to a depth sufficient to cover the terminals 9 of the electronic components 7 on the printed wiring board 10 while the printed wiring board 10 is immersed. especially.
主剤及び硬化剤より成る２液性の樹脂を使用する際には
２液がムラなく均一に混合されるように、十分撹拌する
必要がある。また、防水性充填材２内部に気泡が残留す
ると、防水性能が低下する為、防水性充填材２全体を真
空脱泡するのが効果的である。さらに、印刷配線板１０
を防水性充填材２に浸した際に、印刷配線板１ｏと防水
性充填材２との温度差により防水性充填材２が発泡する
のを防ぐため、前もって電子部品７．チップ形部品１２
が実装された印刷配線板１０を８０℃にて５分程度予備
加熱しておくことが望ましい。印刷配線板１ｏを防水性
充填材２に浸す際、まず初めに印刷配線板１ｏの片側を
斜けて防水性充填材２に浸し、あとは自重により自然に
印刷配線板１０が沈むようにする。この方法により、印
刷配線板１０の下部に残った気泡は自然に印刷配線板１
０の下面を伝わって上昇し、残留する気泡は少なくなる
。When using a two-component resin consisting of a base resin and a curing agent, sufficient stirring is required so that the two components are mixed evenly and uniformly. Furthermore, if air bubbles remain inside the waterproof filler 2, the waterproof performance will deteriorate, so it is effective to degas the entire waterproof filler 2 under vacuum. Furthermore, printed wiring board 10
In order to prevent the waterproof filler 2 from foaming due to the temperature difference between the printed wiring board 1o and the waterproof filler 2 when the electronic component 7. is immersed in the waterproof filler 2, the electronic component 7. Chip-shaped part 12
It is desirable to preheat the printed wiring board 10 on which is mounted at 80° C. for about 5 minutes. When the printed wiring board 1o is immersed in the waterproof filler 2, first, one side of the printed wiring board 1o is immersed in the waterproof filler 2 at an angle, and then the printed wiring board 10 is allowed to sink naturally under its own weight. By this method, air bubbles remaining at the bottom of the printed wiring board 10 are naturally removed from the printed wiring board 10.
0 and rises, leaving fewer bubbles.
印刷配線板１０を収納する樹脂成形によるケース１は第
１図および第２図に示す如く、片側のリブの内側には印
刷配線板１０を係止する内側爪部１３を有し、もう一端
には印刷配線板をネジ止めするボス１４が設けられてい
る。また、ケース１のリブの両端外側には操作パネル３
に係止するための外側爪部１５が設けられている。さら
にケース１を固定した操作パネル３は洗濯機（図示せず
）上部を覆うトップカバー１６に固定されている。As shown in FIGS. 1 and 2, a resin-molded case 1 that houses a printed wiring board 10 has an inner claw part 13 on the inside of a rib on one side for locking the printed wiring board 10, and a rib on the other end. is provided with bosses 14 to which the printed wiring board is screwed. In addition, there is an operation panel 3 on the outside of both ends of the rib of case 1.
An outer claw portion 15 is provided for locking to. Furthermore, the operation panel 3 to which the case 1 is fixed is fixed to a top cover 16 that covers the top of a washing machine (not shown).
操作パネルには外部からの操作で操作パネル３の内側に
固定されたスイッチ板１７上のスイッチをＯＮ、ＯＦＦ
させるためのスイッチ操作子４が設けられ、スイッチ操
作子４の上面には、水の浸入を防ぐための、印刷シート
１８が貼られている。The operation panel has a switch on a switch plate 17 fixed to the inside of the operation panel 3 that can be turned on and off by external operation.
A switch operator 4 is provided to prevent water from entering, and a printed sheet 18 is pasted on the upper surface of the switch operator 4 to prevent water from entering.
本実施例によれば、操作パネル３と印刷シート１８の接
着部を通り、スイッチ操作子４のすき間５より浸入した
水および、操作パネル３とトップカバー１６のすき間よ
り浸入した水はケース１の底部および側面を伝わって落
下し、ケース１内部に留ることはない。According to this embodiment, water that has passed through the adhesive part between the operation panel 3 and the printed sheet 18 and entered through the gap 5 of the switch operator 4 and water that has entered through the gap between the operation panel 3 and the top cover 16 are removed from the case 1. It falls along the bottom and sides and does not stay inside the case 1.
本発明によれば、電子部品を実装した印刷配線板を収納
したケースに水が留り、電子部品本体や電子部品の端子
部、印刷配線板の導体回路パターンを腐蝕させることを
防止でき、電子コントローラの信頼性を高めることがで
きる。According to the present invention, it is possible to prevent water from remaining in a case housing a printed wiring board on which electronic components are mounted and corrode the electronic component itself, the terminal portion of the electronic component, and the conductor circuit pattern of the printed wiring board. The reliability of the controller can be increased.
【図面の簡単な説明】
第１図は防水性充填材で充填固化されたケース内の縦断
面図、第２図はトップカバーに固定された操作パネル部
の断面図。
１・・・ケース、２・・・防水性充填材、３・・・操作
パネル１，７．−７・・・電子部品。
゛、 ・ 。[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a longitudinal sectional view of the inside of the case filled and solidified with waterproof filler, and Fig. 2 is a sectional view of the operation panel fixed to the top cover. DESCRIPTION OF SYMBOLS 1...Case, 2...Waterproof filler, 3...Operation panel 1,7. -7...Electronic parts.゛、・。
Claims (1)
子部品を実装した電子コントローラを配置し、前記ケー
ス内部には、防水性充填材が電子部品の少なくとも導体
部を覆うまで充填固化され、前記電子コントローラを収
納した前記箱形の樹脂成形によるケースを、前記電子コ
ントローラを覆うように配した操作パネル内に開口部が
下向きになる状態にて固定した電子コントローラの取付
装置。1. An electronic controller with electronic components mounted inside a box-shaped resin-molded case with an opening on one side, and a waterproof filler filled and solidified inside the case until it covers at least the conductor part of the electronic component; A mounting device for an electronic controller, wherein the box-shaped resin-molded case housing the electronic controller is fixed in an operation panel arranged to cover the electronic controller with an opening facing downward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5247986A JPS62210695A (en) | 1986-03-12 | 1986-03-12 | Attaching apparatus for electronic controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5247986A JPS62210695A (en) | 1986-03-12 | 1986-03-12 | Attaching apparatus for electronic controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62210695A true JPS62210695A (en) | 1987-09-16 |
Family
ID=12915857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5247986A Pending JPS62210695A (en) | 1986-03-12 | 1986-03-12 | Attaching apparatus for electronic controller |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62210695A (en) |
-
1986
- 1986-03-12 JP JP5247986A patent/JPS62210695A/en active Pending
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