JPS6220727B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement of a triplate line type microwave circuit that transmits and processes microwaves using a triplate line.

Figures 1a and 1b show the configuration of a conventional triplate line type microwave circuit. Figure 1a is a plan view showing the main parts cut away, and Figure 1b is a cross-sectional view. .

In the figure, 1a and 1b are first and second dielectric substrates,
2a and 2b are first and second outer conductors, 3 is an inner conductor, and 4a and 4b are first and second input/output terminals. Here, the input/output terminals 4a and 4b are shown as through-hole conductors realized by chemical technology, and the internal conductor 3 is shown only as a transmission line for the sake of simplification of explanation.

This conventional triplate line type microwave circuit will be briefly described below. Conventionally, outer conductor 2
a, 2b, dielectric substrates 1a, 1b and internal conductor 3
In the case of a triplate line type microwave circuit in which the input/output terminals 4a and 4b are formed perpendicularly to the adhering surfaces of the outer conductors 2a and 2b on the overlapping triplate line, the inner conductor 3 is attached. The input/output terminals 4b formed on the dielectric substrate 1b are directly connected to the internal conductor 3 using chemical technology, and the input/output terminals 4a formed on the dielectric substrate 1a to which the internal conductor 3 is not attached are connected to the internal conductor 3. This was achieved by connecting in a point contact state.

However, in this conventional triplate line type microwave circuit, the reliability between the internal conductor 3 and the input/output terminal 4a, which are connected in a point contact state, is poor.
The phenomenon of not being able to connect electrically was often observed.

Conventionally, in order to overcome this drawback, there has been a method in which the contact portion between the internal conductor 3 and the input/output terminal 4a is made convex with solder or the like for connection. However, even with this method, when the number of input/output terminals 4a taken out from the dielectric substrate 1a to which the internal conductor 3 is not adhered increases, a great deal of effort is required for solder maintenance and positioning of the protrusions. .

The triplate line type microwave circuit of the present invention eliminates the above-mentioned drawbacks and is characterized by simplified manufacturing and improved reliability.

FIGS. 2a and 2b are configuration diagrams showing an embodiment of the triplate line type microwave circuit of the present invention,
Figure 2a is a plan view showing the main parts cut away, Figure 2b
shows this cross-sectional view. In the figure, 1a and 1b are first and second dielectric substrates, 2a and 2b are first and second outer conductors, 3a and 3b are first and second inner conductors, and 4
a and 4b are input/output terminals.

Here, the input/output terminals 4a, 4b are shown as through-hole conductors realized by chemical technology, and the internal conductors 3a, 3
b shows only the transmission line to simplify the explanation.

Hereinafter, the triplate line type microwave circuit according to the present invention will be explained in detail. In this invention, the outer conductors 2a, 2b, the dielectric substrates 1a, 1b
The input/output terminals 4a, 4b are connected to the outer conductor 2 by superimposing the inner conductors 3a, 3b on a triplate line.
In the case of a triplate line type microwave circuit installed perpendicularly to the adhering surfaces of a and 2b, the internal conductor 3
Two dielectric substrates 1a, 1b are connected so that a, 3b are directly connected to input/output terminals 4a, 4b using chemical technology.
The two dielectric substrates 1a and 1b are separated and adhered to each other.
Internal conductors 3a and 3b attached to each other overlap each other in a predetermined section to realize overall connection.

Therefore, the connection between the input/output terminals 4a and 4b is not a point contact between the input/output terminal 4a and the internal conductor 3 as in the past, but a surface contact between the internal conductors 3a and 3b, which increases the reliability of the connection. In addition, since it is a surface connection, there is no need for maintenance using soldering as in the conventional method, making manufacturing very simple.

In addition, in the triplate line type microwave circuit according to the present invention, an internal conductor section wider than a normal transmission line such as a filter or a matching line can be used as a surface connection section, and in this case, the effect is increased.

On the other hand, in the triplate line type microwave circuit according to the present invention, if the overlapping internal conductors 3a, 3b are misaligned, a change appears in the electrical characteristics;
It is sufficient to make the width dimension of either one narrower.

3a and 3b are configuration diagrams showing other embodiments of the triplate line type microwave circuit of the present invention, and FIG. 3a is a plan view showing a main part cut away;
Figure b shows its cross-sectional view. In the figure, 1a and 1b are dielectric substrates, 2a and 2b are external conductors, 3a and 3b are internal conductors, 4a and 4b are input/output terminals, and 5 is a hole. Here, the input/output terminals 4a and 4b are shown as connectors, and the internal conductor 3 is shown only as a transmission line to simplify the explanation.

Hereinafter, a triplate line type microwave circuit according to another embodiment of the present invention will be described.

In this invention, holes are made in the dielectric substrates 1a and 1b facing the input/output terminals 4a and 4b, and internal conductors 3
a and 3b are separately attached to two dielectric substrates 1a and 1b so as to be directly connected to input/output terminals 1a and 1b, and are also attached to two dielectric substrates 1a and 1b. The inner conductors 3a and 3b are formed so as to overlap in a predetermined section.

Therefore, after forming the triplate line, the connections between the input/output terminals 4a, 4b and the internal conductors 3a, 3b,
For example, soldering can be done through the hole 5, and a tri-plate line type microwave circuit that is highly reliable and easy to manufacture can be realized.

As described above, the triplate line type microwave circuit according to the present invention is effective in improving reliability and simplifying manufacturing.

Although this invention has been described with reference to a case where a connector or a single through-hole conductor is used for the input/output terminals 4a and 4b, the present invention is not limited to this, and may also be applied to a case where a plurality of through-hole conductors are used. I can do it.

[Brief explanation of the drawing]

Figures 1a and 1b show the configuration of a conventional triplate line type microwave circuit, in which figure a is a plan view showing the main parts cut away, figure b is a cross-sectional view,
Figures 2a and 2b show configuration diagrams of a triplate line type microwave circuit according to the present invention. Figures a and b show configuration diagrams of a triplate line type microwave circuit according to another embodiment of the present invention. It is. In the figure, 1a and 1b are the first and second dielectric substrates, 2
a and 2b are first and second outer conductors, 3a and 3b are inner conductors, and 4a and 4b are first and second input/output terminals 5 are holes. In the drawings, the same or corresponding parts are denoted by the same reference numerals.

Claims (1)

[Claims] 1. A first dielectric substrate 1a and a first external conductor 2 attached to one side of the first dielectric substrate 1a.
a, a first internal conductor 3a deposited on the other surface of the first dielectric substrate 1a, and a first input/output for connecting the first external conductor 2a and the first internal conductor 3a. The terminal 4a, the second dielectric substrate 1b that overlaps the first dielectric substrate 1a, and the first internal conductor 3a on the joint surface of the second dielectric substrate with the first dielectric substrate 1a. a second internal conductor 3b deposited so as to overlap a predetermined section with the second internal conductor 3b;
a second outer conductor 2b attached to the surface opposite to the bonding surface of the dielectric substrate 1b; and a second outer conductor 2b for connecting the second inner conductor 3b and the second outer conductor 2b.
A triplate line type microwave circuit characterized by comprising an input/output terminal 4b. 2. The triplate line type microwave circuit according to claim 1, wherein the width of one of the overlapping internal conductors is narrowed. 3. The triplate line type microwave circuit according to claim 1, characterized in that a hole is formed in the dielectric substrate facing the input/output terminals.