JPS62206741A - Indium sealing method - Google Patents

Abstract

PURPOSE:To enable sealing without unevenness to be performed, by cutting an indium inner plate one side by one side to be used in a symmetrical shape so that a cut surface without unevenness can be made. CONSTITUTION:Indium 7 in an indium ring is cut one side by one side. Thus, scraps cut 7a are extruded in the side-plane direction, automatically removed without adhering to a cut plane. Without requiring to draw out the scraps cut 7a therefore, the cutting becomes easy, without skillfulness in doing. And, because a blade part 30a of a cutting tool 30 is made not in a hollow shape but in a simple one in which one side is opened, manufacture of the cutting tool 30 becomes easy, available for processing with high precision. Therefore, a cut plane without unevenness can be made. Besides, without the scraps cut 7a being extruded separate in two directions, the amount of cutting the indium 7 by the cutting tool 30 becomes decreased to make the cut surface without unevenness. Therefore, sealing without unevenness can be performed.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to an indium seal method.

[Summary of the invention]

The present invention utilizes an indium sealing method in which an indium ring is sandwiched between a glass face plate on which a photoconductive film is formed of an image pickup tube and a glass bulb, and the indium ring is crimped to form a symmetrical shape by cutting the inner surface of the indium ring one side at a time. This makes it easier to cut indium and manufacture Nonoite, and also enables high-precision cutting and strengthens the adhesion of the sealing surface. It is.

[Conventional technology]

Taking advantage of the soft yet extremely strong adhesive properties of indium, an indium ring is sandwiched and pressure-bonded between the glass face plate on which the photoconductive film of the image pickup tube is formed and the glass norpe, resulting in so-called cold sealing. It has been known.

For example, in FIG. 6A, (1) is a glass face plate, and a transparent conductive film (2) and a photoconductive film (3) are sequentially formed on this glass face plate (1). Also, (4) is a glass bulb! I), (5) is this glass bulb (4
), and (6) is a mesh holder. Also, (7) is indium, (8)
is a metal ring, for example a stainless steel ring. After being arranged as shown in FIG. 6A, as shown in FIG. 6B, the glass face plate (1) and the glass plate (4) are pressed together and cold-sealed. In this example, the transparent conductive film (2)
is electrically connected to a metal ring (8) through indium (indium) force, and the imaging signal is extracted through this metal ring (8).

There is also a method in which the mesh holder (6) is fixed (embedded) with indium (7) during cold sealing. For example, in FIG. 7A, (1) is a glass face plate, and on this glass face plate (1) is a transparent conductive film (2),
Photoconductive films (3) are sequentially formed, and (9) is a pin electrode for signal extraction provided through the glass face plate (1) and electrically connected to the transparent conductive film (2). .

Further, (4) is a glass plate, and α[ and aυ are electrodes formed on the inner surface thereof. Also, (5) is mesh-like! ffl, (6) is a mesh holder. Further, (7) is indium, and (8) is a metal ring. After being arranged as shown in FIG. 7A, the glass face plate (1) and the glass nozzle (4) are pressed together and cold-sealed as shown in FIG. 7B. In this example, the mesh-like electrode (5) includes a mesh holder (6) and an indium (
It is electrically connected to the gold fi 1.1 ring (8) via force, and a predetermined voltage is applied to the mesh-like electrode (5) from this metal ring (8). Further, an imaging signal is extracted from the pin electrode (9) for signal extraction.

[Problem that the invention seeks to solve]

In the indium sealing method shown in Fig. 6, the indium ring in which indium (7) is arranged on the inner peripheral surface of the metal ring (8) is as shown in Fig. 8.
For example, the indium (7) is formed by cutting using a cutting device as shown in FIG. That is, the indium ring is fixed in the chuck and rotated together with the chuck at a predetermined speed, and the user's handle t21
) by rotating the indium (7)
) is controlled, and indium (7) is cut.

By the way, in the case of an indium ring, the cut surface of the indium ring needs to have a mirror-like surface with no cutting unevenness in order to improve the degree of adhesion of the sealing surface.

Therefore, the above-mentioned cutting operation of indium (7) is carried out at high speed rotation with a small amount of cutting into the indium (force) of Nonoito@.
) (shown by the dashed line in FIG. 9) is pushed out for a long time.

These chips (7a) adhere to the cutting surface due to the nature of metal, so use a pincer, for example, to prevent the chips (7a) from cutting.
(23), etc., and work to prevent adhesion was required, and it required considerable skill to perform this work while monitoring the dimensional scale of the handle OD to control the cutting dragon.

Similarly, the indium ring in the indium seal method shown in FIG. 7 is produced by cutting indium (7) using a cutting device as shown in FIG. It is formed. This first
The cutting device shown in FIG. 0 is the same as the cutting device shown in FIG. 9, except that the square shape of Nonoite (2) is different. The indium (7) of the indium ring shown in FIG. 7 is asymmetrical and has a step for fixing the mesh holder (6). Therefore, in order to obtain a mirror-like surface with no uneven cutting, indium (7
) If the depth of the cut is reduced, the chips (7a) will be separated into two and extruded as shown in Figure 1. In this way, the chips (78) that separate during rotation and are ejected in any direction cannot be taken out with tweezers, so in the end, the chips (78) that are cut into the indium (7) of 2z are cut to some extent. The amount is increased to prevent the chips (7a) from cracking.However, a large amount of cutting depth increases cutting resistance and makes uneven cutting more likely to occur. This could cause a vacuum leak and deteriorate the performance of the image pickup tube.

In addition, in the indium seal method shown in the examples in Figures 6 and 7, the blade shape of the No9ite @ used for cutting indium (7) is valley-like and complicated, and the height of the blade edge is complicated. Precision machining was difficult.

In view of these points, the present invention is designed to eliminate the above-mentioned drawbacks.

[Means for solving problems]

In order to solve the above-mentioned problems, the present invention uses indium (7) of an indium ring by cutting one side at a time to create a symmetrical shape.

[Effect]

Indium (force is applied to cut one side at a time, chips (7
a) is extruded laterally and is automatically discharged without adhering to the cutting surface, eliminating the need for skill in cutting.

In addition, the shape of the sheet is simplified, making it easier to manufacture the sheet. In addition, by making Nonoito M-making easier, a highly accurate cutting edge can be obtained, and an even cutting surface can be achieved.
Enables even sealing.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to FIG. In FIG. 1, parts corresponding to those in FIG. 7 are designated by the same reference numerals, and detailed explanation thereof will be omitted.

In this example, the indium of the indium ring is cut from one side at a time to create a symmetrical shape. That is, this indium ring is formed by cutting indium (7) of an indium ring as shown in FIG.

First, as shown in FIG. 2A, an indium ring is fixed to the chuck of a cutting device, and one side of the indium (7) is cut. In this case, the chips (7a) are pushed out in the lateral direction as shown by the dashed line in the figure, and even if the chips (7a) are not removed with tweezers or the like,
It will not stick to the cutting surface. Next, as shown in Fig.
The other side of is cut. In this case as well, the cuttings (7a)
The chips (7a) are pushed out in the lateral direction as shown by the dashed line in the figure, and even if the chips (7a) are not removed with tweezers or the like, they will not adhere to the cutting surface. The cutting device shown in FIG. 2 is the same as the cutting device shown in FIG. 9 except for the square shape of the point (to), and corresponding parts are designated by the same reference numerals. There is.

FIG. 3 shows the specific shape of the nonoite (7), and FIG. 4 shows a cross section of the blade portion (30a).

A step P for fixing the indium (7) K mesh holder (6) is formed at the stepped portion P of the blade portion (30a) of this No. 9 point (to), and also
The chips (7a) are pushed out in the lateral direction at the inclined portion Q in a).

Further, in FIG. 4, θ is a so-called rake angle, for example, approximately 30° to 35°.

In this example, the indium ring formed by K as described above is used, and after being arranged as shown in Figure 1A, the glass face plate (1) and the glass nozzle (4) are placed as shown in Figure 1B. are crimped and cold-sealed.

According to this example described above, the indium (7) of the indium ring is cut one side at a time, and the chips (7a) are pushed out in the lateral direction and are automatically discharged without adhering to the cutting surface. Therefore, there is no need to take out the chips (7a), making cutting easy and requiring no skill. In addition, since the shape of the blade part (30a) of the nonoito (to) is not a valley shape but a simple shape with one side open, the actual production of the nonoito (to) is easy and high-precision machining is possible. becomes possible. Therefore, a uniform cutting surface is possible. In addition, the chips (7a) are not separated into two parts and extruded, and the indium (7a) is not extruded.
) can be cut with a reduced depth of cut, allowing for an even cut surface. Therefore, according to this example, even sealing is possible.

Incidentally, the present invention can be similarly applied to the indium seal method as shown in FIG. 5A and 5B show the state of the indium ring in this case being cut using indium (force). In FIG. 5, parts corresponding to those in FIG. 2 are denoted by the same reference numerals.

〔Effect of the invention〕

According to the method of the present invention described above, since the indium of the indium ring is cut one side at a time and used in a symmetrical shape, the indium can be easily cut and the noite shape for cutting is simplified. This makes it easier to prepare the material, and a highly accurate cutting edge can be obtained. In addition, high-precision, even cutting is possible, and the degree of adhesion of the sealing surface is strengthened.

[Brief explanation of drawings]

1 to 4 are diagrams for explaining one embodiment of the present invention,
FIG. 5 is a diagram for explaining another embodiment of the present invention, FIGS. 6 and 7 are diagrams showing an example of the indium seal method, and FIG.
Figures 1 to 10 are diagrams for explaining the same. (1) is a glass face plate, (4) is a glass lubricant, (7)
is indium, (8) is a metal ring, and (to) is ・ζite.

Claims (1)

[Claims] In the indium sealing method, in which an indium ring is inserted and crimped between the glass face plate on which the photoconductive film of the image pickup tube is formed and the glass bulb, the inner surface of the indium ring is cut on one side and used to create a symmetrical shape. The indium seal method is characterized by: