JPS62204559A - Lead bending method and apparatus thereof in manufacturing process of electronic device - Google Patents

Abstract

PURPOSE:To perform a roller bending on a plurality of leads of the semimanufactured article before they are bent without making the constitution of the device complicate by a method wherein semimanufactured leads are bent using the roller bending method arranged corresponding to the interval of the semimanufactured articles. CONSTITUTION:A cutting and picking out means 2a and 2b are arranged at two places in feeding direction of a lead frame F leaving the interval of 3 pitches in the midway of a conveying path 1, the electronic device which is cut off and drops on the lower side of said means 2a and 2b is received, and a shooter 4 with which the electronic device D is conveyed to the roller bending position of the roller bending means 3a and 3b which are positioned on the side of the cutting and picking out means. The roller bending means 3a and 3b have a receiving jig 5 with the cross-section same as that of a guide rail and a pair of rollers 6 and 6 which perform a vertical movement by a vertically moving means. The electronic device is placed on the receiving jig 5, and when the rollers 6 and 6 are moved downward, a lead L is pressed against the side face of the receiving jig 5 by the rollers 6 and 6, and it is bent downward at right angle.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a lead bending method and an apparatus used therein in the manufacturing process of dual-in-line electronic devices, and more specifically, to an efficient lead bending method using a roller bending method without complicating the apparatus. This invention relates to methods that can be used to improve the manufacturing efficiency of electronic devices.

[Conventional technology]

This type of electronic device consists of a wire bonding process that attaches the electronic device chip to a predetermined position on a lead frame, a wire bonding process that connects the bonding panode on the chip and the leads, and a predetermined area surrounding the chip. It is manufactured through a resin puff casing process for resin sealing, a marking process for printing the product number on the surface of the package, a lead cutting process for cutting the leads from the frame, and a lead bending process for bending the leads into a predetermined shape. FIG. 5 schematically shows the state before the lead cutting step in the manufacturing process of the dual-in-line electronic device on which the present invention is based. From this state, the unnecessary parts, that is, the dam bars that connect each lead or the island support, are cut off using a cut brace, and each lead is removed from the package from the lead frame F as shown in Figure 6. Take out a semi-finished product with a shape that extends in a straight line,
Then, in a lead bending step, the lead is usually bent downward to obtain a product as shown in FIG. The transition from the lead cutting process to the bending process is normally carried out by sliding the semi-finished product that has been dropped onto a guide located below by cutting the lead in the lateral direction and moving it to the lead bending position. As shown in Fig. 8, the lead bending method is the so-called ironing bending method, in which a spatula-shaped ironing jig is applied to the lead placed on a mold, and the lead is rubbed and bent.
As shown in Fig. 9, roller R is attached to the lead atted on the mold.
There is a so-called roller bend method that bends by applying The above ironing and bending method bends the lead L while rubbing it, so there is a problem with the durability of the ironing jig and the bent lead is prone to ironing scratches. There is a tendency to use the roller bend method, which eliminates the worry of However, when the roller bending method is adopted, the two rollers R on the front and back, which are arranged to sandwich the package part in the front and back and move up and down, occupy a considerable amount of space in the front and back direction, and one by one from the lead frame F before the lead bend. This method can only be used with a so-called one-piece device configuration in which semi-finished products are taken out on the guide, resulting in poor production efficiency. In addition, in order to simply increase production efficiency, it is conceivable to take out two semi-finished products lined up one after the other in the lead cutting process and lead-bend these two semi-finished products at the same time. occupies a considerable amount of space in the front and back direction, so a mechanism is required to widen the space between the front and rear of the two semi-finished products taken out as described above to the space required to line up the bend rollers 2 cents back and forth. The problem is that the whole thing becomes very complicated. The present invention was conceived under the above circumstances, and provides a method and apparatus for roller bending a plurality of semi-finished leads before lead bending, without complicating the packaging structure. The task is to provide the following.

[Means to solve the problem]

In order to solve the above problem, in the lead bending method of the present invention, a lead frame is intermittently fed at N pitch intervals on a conveyance path equipped with cutting/retrieving means arranged at N locations every N+1 pitches, and each pitch of the lead frame is After feeding, the above-mentioned cutting/retrieval means is operated to take out N semi-finished products with leads before bending from the lead frame, and the leads of these N semi-finished products are set at the interval between these semi-finished products in the taken out state. The bending is performed by roller bending means arranged at N+1 pitch intervals in correspondence with the above. The apparatus for using this method includes a conveyance path that intermittently feeds the lead frame by N pitches, and is arranged at N locations along the length of this conveyance path at intervals of N+1 pitches, and is activated after each pitch of the lead frame is fed. a cutting/retrieval means for taking out N semi-finished products having leads before bending from the lead frame; a chute for transporting the taken-out semi-finished products to a predetermined lead bending position; and N roller bending means for bending the leads of each of the N semi-finished products. Note that the above N represents an integer of 2 or more.

[Effect]

For example, when bending the leads of two semi-finished products, the above N is 2. First, the pitch feeding device sends out two pitches, that is, the first and second electronic devices on the lead frame onto the conveyance path. At this time, the first cutting/removing means on the upstream side of the conveyance path is positioned corresponding to the second electronic device. When the first cutting and extracting means is actuated,
The second electronic device is removed from the lead frame. At this time, the first electronic device is still supported on the lead frame. Subsequently, the pitch feeding device feeds the lead frame two more pitches onto the conveyance path. Then, the above first
The fourth electronic device reaches the second cutting and extracting means located three pitches downstream from the first cutting and extracting means, and the fourth electronic device reaches the first cutting and extracting device. do. Then, when the first and second cutting/removing means are operated, the first electronic device and the fourth electronic device are separated from the lead frame. At this time, the third electronic device is still supported on the lead frame. Further, the pitch feeding device feeds the lead frame two more pitches onto the conveyance path. Then, the third electronic device reaches the second cutting/extracting means, the sixth electronic device reaches the first cutting/extracting means, and these third and sixth electronic devices At the same time, it is taken out from the lead frame. In this way, the first cutting and taking out means takes out even numbered electronic devices, and the second cutting and taking out means takes out odd numbered electronic devices from the lead frame. There is a gap of 3 pitches between the electronic device and the electronic device taken out by the second cutting and taking out means. This 3-pitch interval is sufficient to arrange the roller bending means at 2 m in the front-rear direction. As described above, for example, the first and fourth electronic devices taken out from the lead frame at the same time are transported laterally as they are and moved to the lead bend position,
The leads of these two electronic devices can be bent by the two roller bending means without any problem. The completed electronic device subjected to lead bending in this manner is sent to the next process, for example, an inspection process.

【effect】

As described above, according to the lead bending method of the present invention, the leads of a plurality of electronic devices taken out from a plurality of locations sufficiently apart in the feeding direction of the lead frame are roller-bended, so that the leads of the electronic devices taken out are The roller bending means can be spaced sufficiently apart to be comparable to the spacing of the devices. Therefore, the electronic device can be easily transported from the position where the electronic device is taken out from the lead frame to the roller bending means, and the device configuration is not complicated. In this way, the efficiency of high-quality lead bending using rollers is doubled, and the manufacturing efficiency of electronic devices that maintain high appearance quality is dramatically increased.

[Explanation of Examples]

Embodiments of the present invention will be specifically described below with reference to the drawings. In the following, a case will be described in which the lead frame is intermittently fed two pitches at a time and semi-finished products taken out two by two from the lead frame are lead bent. As shown in FIG. 1, the lead frame F that has undergone the resin puff caging process is moved along the conveyance path 1 two pitches at a time by a pitch feeding means (not shown), that is, the electronic device ff1D carried on the lead frame F. It is intermittently fed by a distance twice the pitch interval. In the middle of this conveying path 1, two cutting/removing means 2a*2b are arranged at three pitch intervals, front and rear in the feeding direction of the lead frame F. Removing the electronic device from the lead frame F is not done by a single cutting press, but actually requires a lead cutting process to separate the tip of the lead from the dam bar or quiver, and a support cut to separate the island support from the side frame. This process is carried out through multiple steps, including a dam bar cutting process and a dam bar cutting process in which unnecessary parts of the dam bar or tie bar are cut off. Refers to a process. The lower side of each of the cutting and taking-out means 2a, 2b receives the electronic device that is cut off and falls, and conveys the electronic device πD to the roller bending position of the roller bending means 3a, 3b located on the side thereof. A shooter 4 is arranged. As clearly shown in FIG. 2, this shooter has an abutment portion 4a that receives the leads extending back and forth from the package portion, and a central opening that accommodates the bar and seven cage portions. #4b and a protruding rod 4C that pushes an electronic device that has fallen onto this guide rail in the longitudinal direction of the guide rail. Roller bending means for bending the front and rear leads of the electronic device downward is provided on an extension of each of the guide rails. These roller bending means 3a, 3b include a receiver jig 5 having a cross section equivalent to that of the guide rail, and
It is provided with a pair of rollers 6.6 which are supported at appropriate intervals in the front and rear and are moved up and down by a lifting means. Then, when the electronic device before lead bending is placed on the jig 5 and the roller 6.6 is moved down, the lead L is
．． 6, the light is pressed against the side surface of the jig 5 and bent downward at a substantially right angle. Next, the continuous operation of the device of this example will be explained. First, the process by which each electronic device on the lead frame F is taken out two by two will be explained with reference to FIG. First, the pitch feeding means feeds out the lead frame F by two pitches, resulting in a state as shown in FIG. 3 (al). At this time, the first electronic device D1 and the second electronic device H
D2 is sent out onto the transport path l, and the second electronic device D2 reaches a position corresponding to the upstream first cutting and taking out means 2a of the two cutting and taking out means. In this state, the first cutting/retrieving means 2a operates, and as shown in FIG.
2 is taken out from the lead frame F and dropped onto the shooter 4. At this time, the first electronic device D1
remains carried on the lead frame F. Next, the lead frame F is fed out two more pitches,
A state as shown in FIG. 3 (C1) is reached. At this time, the first electronic device D2 left on the lead frame in the above process reaches a position corresponding to the second cutting/removing means 2b, Then, the fourth electronic device D4 reaches the position corresponding to the first cutting and taking out means 2a.In this state, the first cutting and taking out means 2a and the second cutting and taking out means 2b operate, and the fourth electronic device D4 reaches the position corresponding to the first cutting and taking out means 2a. As shown in Figure 3 id+, the fourth electronic device D4 and the first electronic device DI are taken out from the lead frame F and dropped onto each shooter.At this time, the third electronic device 'f! D3 still remains suspended on lead frame F. Furthermore, when lead frame F is fed out two pitches,
As shown in FIG. 3 (81 and (f)), the sixth electronic device and the third electronic device D3 are taken out and dropped onto each shooter. The means 2a is in charge of taking out the even-numbered electronic devices, and the second cutting and taking-out means 2 is in charge of taking out the odd-numbered electronic devices, so that all the electronic devices are taken out from the lead frame F. , the first and second cutting and taking-out means'l
The electronic devices dropped onto the two shooters 4 corresponding to the shutters 4a and 2b are sequentially conveyed to the roller bending positions of the roller bending means 3a and 3b by the protruding rods 4C, and then their leads are removed as described above. L is roller bent to obtain a finished product as shown in FIG. The electronic “AHD” completed by lead bending in this way is
For example, it is transported to the next inspection process. As described above, according to the glue bending method and the apparatus used therein of the present invention, it is possible to efficiently perform lead bending with high appearance quality by the roller bending method, and it is possible to avoid complication of the apparatus. Of course, the scope of the invention is not limited to the embodiments described above. That is, in the embodiment, two electronic devices are taken out from the lead frame and lead-bended in parallel. You can also do lead bends. For example, if you take three electronic devices and lead bend them,
As shown in FIG. 4, a cutting/removing means 2c is in charge of taking out the 3n+1th electronic device, a cutting/taking out means 2d is in charge of taking out the 31+2nd electronic device, and a cutting/taking out means 2d is in charge of taking out the 3nth electronic device. The cutting/retrieving means 2e may be arranged at 3+1=4 pitch intervals, and the apparatus may be configured with three shooters corresponding to these and three roller bending means arranged on an extension of the shooters. Note that the first cutting and taking-out means and the second cutting and taking-out means do not need to operate at the same time.

[Brief explanation of drawings]

Fig. 1 is an overall schematic configuration diagram of an embodiment of the device of the present invention;
The figure is a cross-sectional view thereof, FIG. 3 fa) or fl is an explanatory diagram of the operation, FIG. 4 is an explanatory diagram of another embodiment of the present invention, and FIG. 5 is a plan view of the lead frame after the puff caging process. 6th
Figure 7 is a side view of the semi-finished product before beam bending, Figure 7 is a side view of the product after beam bending, Figure 8 is an explanatory diagram of the ladder bending method, and Figure 9 is an explanatory diagram of the roller bending method. ■... Conveyance path, 2a, 2b... Cutting and taking out means,
. 3a, 3b...Roller bending means, F...Lead frame, L...Lead, D...Electronic device (semi-finished product).

Claims (2)

[Claims] (1) The lead frame is intermittently fed at N pitch intervals on a conveyance path equipped with cutting/take-out means arranged at N locations every N+1 pitches, and after each pitch of the lead frame is fed, the cutting/take-out means is activated to remove the cut and take-out means before bending. Roller bending means for taking out N semi-finished products having leads from the lead frame and disposing the leads of these N semi-finished products at N+1 pitch intervals corresponding to the spacing between these semi-finished products in the taken out state. 1. A lead bending method in an electronic device manufacturing process, characterized in that the lead is bent by the following steps. (2) A conveyance path that intermittently feeds the lead frame by N pitches, and N locations arranged at N+1 pitch intervals in the longitudinal direction of this conveyance path, and which operate after each pitch feed of the lead frame to hold the lead before bending. a cutting/retrieval means for taking out the N semi-finished products from the lead frame; a chute for transporting the taken out semi-finished products to a predetermined lead bending position; and a lead for each of the N semi-finished products transported to the lead bending position by the chute. 1. A lead bending device for use in the manufacturing process of electronic devices, characterized in that the lead bending device includes N roller bending means for bending.