JPS62296525A - Apparatus for manufacturing electronic device - Google Patents

Abstract

PURPOSE:To improve the production efficiency of an electronic apparatus by providing a plurality of steps before the step of cutting leads, cutting and bending the leads, a buffer separator, socket pallet conveying means, and inspecting means. CONSTITUTION:Steps are processed while moving a lead frame F while carrying it in a conveying unit 3 from the step of molding with resin to the step of bending and cutting the leads. When the step 29 of bending and cutting the leads is finished, an electronic device D, a prescribed number of which are carried on a lead frame, is separated to sole units, the sole units of electronic devices are aligned at every predetermined number by a buffer separator 37, and transferred to measuring step. In the measuring step, a plurality of aligned electric device are attached to sockets on a pallet 50, a connector connected to an inspecting unit is connected with the pallet to be inspected differently. Thus, the production efficiency is improved.

Description

[Detailed description of the invention]

3. Detailed description of the invention

[Industrial application field]

The present invention relates to an apparatus for manufacturing electronic devices such as ICs and LSIs, and more specifically, the present invention relates to a manufacturing device for electronic devices such as ICs and LSIs. The present invention relates to a device that has been integrated into a line including the II+ regular process of each individual electronic device, reducing troubles between these processes and dramatically increasing manufacturing efficiency.

[Conventional technology]

Semiconductor devices such as ICs and LSIs require a chip bonding process to bond a semiconductor chip onto a lead frame, a wire bonding process to connect each pad on the chip and leads, and a resin to seal the chip and wires in a resin package. The molding process, the marking process that prints the model number, manufacturer name, etc. on the surface of the resin package, the lead cutting process that separates the lead foot part from the lead frame and removes unnecessary parts such as dam bars, and the lead foot that extends from the package part. After going through a lead bending process in which the wire is bent in a specific direction, it is then subjected to measurement inspections such as open/short measurement, final measurement, and measurement for each rank.Only those that pass these inspections are placed in container tubes for each rank and shipped. be done.

[Problems to be solved by the invention]

By the way, from the wire bonding process to the marking process to the lead cutting process, each lead frame is processed, and the efficiency in each process is relatively high.Moreover, each T weight can be efficiently connected using a lead frame magazine. was possible. However, after the lead cutting process, the device is separated from the lead frame and handled individually, so there is a high probability that problems will occur due to handling mistakes, and the efficiency is very low. In this way, the efficiency of the process after the electronic device is separated into individual units is low, so even if the efficiency of the wire bonding process to the lead cutting process is good, the overall production rate is only the lead bending process or measurement. It depends on the efficiency of the process, and the flow of work-in-process products is poor, resulting in extra interest charges, and the resulting cost increase cannot be ignored. Furthermore, for the same reason, it has conventionally been difficult to create a continuous line from the wire bonding process to the measurement process. This invention was conceived under the above circumstances,
The objective is to provide an electronic device manufacturing device that can dramatically improve overall production efficiency by connecting the process of processing each lead frame and the process of each device as a single unit in a series. shall be.

[Means to solve the problem]

In order to solve the above problem, the apparatus of the present invention is configured as follows. A conveyance means in which a plurality of conveyance units each carrying a lead frame that has completed a resin molding process is sequentially pitch-fed; a plurality of process means before a lead cutting process that are arranged in the middle of the conveyance path of this conveyance means; A lead cutting and lead bending process in which each individual electronic device is taken out from the lead frame which is sequentially transferred from each transport unit at the end of the transport path and the leads are bent; a buffer separator for arranging a predetermined number of individual electronic devices at equal intervals, and sequentially transferring the predetermined number of arranged electronic devices at once; a socket pallet conveying means for feeding a plurality of socket pallets in a circular pitch, each of which has a predetermined number of sockets arranged in parallel with the same pitch as the buffer separator, and which sequentially receives and receives a predetermined number of electronic devices from the buffer separator; Inspection means is arranged in the middle of the conveyance path of the socket pallet conveyance means and is configured to connect a connector to the socket pallets that are sequentially conveyed and to measure the electronic devices on the socket pallets.

[Effect]

The device of the present invention is capable of processing processes from the resin molding process to the lead cutting/lead cutting process, after the lead bending/lead cutting process, connecting electronic devices separated from the lead frame to the measurement process, and measuring. It is characterized by the processing in the process. After the resin molding process and up to the lead bending/lead cutting process, there are processes such as cleaning, marking, appearance inspection, and drying of the resin package, but the device of the present invention can perform these processes in one general feeding unit. The lead frame is carried by the lead frame, and each process is carried out while the lead frame is moved. Therefore, there are fewer re-holdings of the lead frame, and 11 times between each process! There is no need to worry about feeding problems or problems caused by changing the lead frame in each process. In addition, since the processes up to the lead bending and lead cutting processes are performed in a series, the accumulation of work-in-progress is eliminated and production efficiency is uniformly increased. When the lead bending/lead cutting process is completed, the electronic devices carried in a predetermined number on the lead frame are separated into individual units and discharged. However, in the device of the present invention, these individual electronic devices are re-assembled. By arranging a predetermined number of electronic devices using a buffer separator and transferring them to the measurement process, the probability of handling errors is reduced compared to handling each individual device, and the electronic devices are arranged in a predetermined number at a time. Since individual parts are transferred all at once, the processing speed after the lead cutting process is dramatically increased. Furthermore, in the measurement process of the present invention, a plurality of arrayed electronic devices received from the buffer separator are attached to each socket on the pallet, and the electronic devices are inspected while being attached to each socket on the pallet. The connectors that connect to the equipment are connected to the pallet, making it possible to perform various types of inspections. Therefore, compared to the conventional inspection process in which a single electronic device is attached to the socket and throat for each different measurement, damage to the leads is extremely reduced, making it possible to suppress the occurrence of defective products as much as possible. There is no need to reinstall the device into the socket for each different measurement, dramatically increasing the efficiency of the inspection process.

【effect】

As described above, the electronic device manufacturing apparatus of the present invention can perform each process after the resin molding process continuously and efficiently while minimizing the occurrence of defective products due to handling mistakes, and the overall , the manufacturing efficiency of electronic devices increases exponentially. Furthermore, since the work-in-progress flows through each process continuously, no extra interest is generated due to the accumulation of work-in-progress, and cost reduction can also be achieved from this point of view. Furthermore, since each process means is arranged in series, it is also possible to save space within the factory.

[Explanation of Examples]

Embodiments of the apparatus of the present invention will be specifically described below with reference to the drawings. FIG. 1 is a plan view showing the overall configuration of an example of the apparatus of the present invention. As described above, the apparatus of the present invention generally includes a first part A that performs various process treatments on the lead frame on the transport unit.
It is divided into an intermediate part B, where the units are aligned and transferred after lead cutting and lead bending, and a second part C, where various inspections are performed while the electronic devices transferred onto the socket pallet are mounted on the socket pallet. . Each of these parts A, B, and C will be explained in detail below. The resin-molded lead frame F transported to the frame stock dock 1 is sequentially held on a transport unit 3 which is pitch-fed at equal intervals by a chuck 2 placed at the top of the frame stock. . As shown in FIG. 2, the transport unit 3 basically includes a movable frame 4 and a pair of left and right workpiece holding members 5.5. A pair of left and right wheels 6.6 using bearings are provided at the front and rear of the lower part of the movable frame 4, so that the frame 4 can run smoothly on the conveyance base 7. The holding member 5.5 is formed of a plate material that is arranged to face each other on the left and right in a standing position, and gears 8.8 that mesh with each other are provided on each opposing inner surface of the holding member 5.5, and a support shaft 9 that is inserted and fixed through the gears 8.8 , 9 provided on the front and rear of the underframe 4. By rotatably supporting the IO, the upper parts can swing toward and away from each other. In addition, both clamping members 5.5 are always urged in a direction in which the upper portion thereof approaches toward each other by interposing a tension spring 11.11 between them, and both ends in the front and rear direction are attached to the placket 10.10. By coming into contact with the shoulder, the swing end in the closest state is regulated. Both of the clamping members 5.5 are then opened against the springs 11.11 by rotating the lever 12 extending from one of the support shafts 9 from the outside. Linear grooves 13°13 with a 7-shaped cross section are formed on the inner surface of the upper end of both the clamping members 5.5 over the entire length in the front-rear direction, and both edges of the frame F are engaged with these grooves 13°13. Frame F
can be stably maintained. Further, on both left and right sides of the movable frame 4, a plurality of vertical guide rollers 14 are provided at the same pitch as the arrangement pitch of the electronic devices WD carried on the lead frame F. . This guide roller 14 cooperates with a guide rail (not shown) provided on the conveyance base 7 to move the underframe 4
In addition to preventing the lateral displacement of the underframe 4, the longitudinal position of the underframe 4 is prevented by moving forward and backward from the side of the guide rail and being sequentially restrained by a stopper (not shown) having a V-groove at the tip. It has the role of determining the Further, the underframe 4 can be moved on the transport base by being pushed, for example, by an endless chino disposed on the transport base 7-I-. 3 is carried to the beginning of transport base 7, Il! A drive arm placed at a suitable position near the feed base pushes the -F lever 12, so that the workpiece holding member 5.5 is opened and waits for the frame F to be carried by the chuck 2. When the frame F is carried between the clamping members 5.5, the lever 12 is released, and the clamping members 5.5 are closed to clamp the frame F between the linear grooves 13.13. Hold. This conveyance unit 3 is then pitch-fed as described above. The 1ull feeding unit 3, which is pitch-fed on the conveying base 7 in this manner, reaches the marking means 20 after passing through a cleaning means 19 that cleans the marking surface of each resin bath cage on the Ralem F. In this marking means 20, a stand bar 22 that reciprocates between a stamp stand 21 and a marking position is provided, and each resin package D on the transport unit 3 is sequentially positioned at a fixed position in the transport direction of the transport base. The manufacturer, model number, etc. are marked on the top. The transport unit 3 carrying the frame F that has completed the marking process in this way then reaches an appearance inspection process 24 consisting of a TV camera 23 and recognition means linked thereto, where, for example, a marking or package appearance is inspected. The frame F is inspected for defects, and the defective frame F is ejected by the ejecting means 25. This includes, for example, a chuck 26 that moves in conjunction with the visual inspection step 24 and a drive arm (not shown) for opening the clamping member 5.5. Next, the transport unit 3 carrying the good frame F,
It passes through a drying means 27 consisting of a drying oven for drying the marking part, and reaches the end of the conveyance base. The frame F on the transport unit 3, which has reached the end of the transport base in this way, is then transferred by a reciprocating chuck 28 to a lead cutting/lead bending process 29 located at a position displaced to the side of the transport base. Ru. The transport unit 3, which has finished transferring the frame F, is held by, for example, another endless chain device and returned to the starting end of the king transport base 7, and repeats the same operation as described above. In the lead cutting/lead bending process 29, a plurality of cutters are sequentially applied to the lead frame F that is being fed in the longitudinal direction to cut off unnecessary dam bars and to cut the connection between the lead tip and the flares J and F. , frame F
Take out the electronic device from the holder and bend the lead leg of the electronic device downward. FIGS. 3 to 5 show an example of a lead cutting/lead bending process with significantly improved efficiency. As shown in FIG. 3, the frame F transferred to the lead cutting/lead bending process is moved two pitches at a time on the conveyance path 30 by a pitch feeding means (not shown), that is, the electrons carried on the lead frame are It is intermittently fed by a distance twice the pitch interval of the mounted WD. On this 1ull feeding path 30, two cutting/removing means 31a and 31b are arranged at three pitch intervals, front and rear in the feeding direction of the lead frame F. To take out the electronic device from the lead frame F, it is not done by one cut press, but actually involves a lead cutting process in which the tip of the lead is separated from the dam bar or tie bar, and a support cutting process in which the island support and the side frame are separated. , and a dam bar cutting process in which unnecessary portions of the dam bar or tie bar are cut off. This is the process of separating it from the frame. The lower side of each of the cutting and taking out means 31a and 31b receives the electronic device that is cut off and falls, and conveys the electronic device to the roller bend position of the roller bending hands 32a and 32b located on the side thereof. shooter 3
3 is placed. As clearly shown in FIG. 4, this shooter 33 includes a support portion 33a that receives leads extending back and forth from the package portion, and a central groove 3 that accommodates the package portion.
3b, and a protruding rod 33 that pushes the electronic device (Wr) that has fallen onto this guide rail in the longitudinal direction of the guide rail. Roller bending means for bending the front and rear leads of the electronic device downward is provided on an extension of each of the guide rails. These roller bending means 32a, 32
b is a jig 3 with a cross section equivalent to the above guide rail.
5, and a pair of rollers 36, 36 which are supported at appropriate intervals in the front and rear and are moved downward by a lifting means. Then, when the electronic device in front of the lead head is placed on the jig 35 and the rollers 36 and 36 are moved down,
The lead I4 is bent downward at a substantially right angle by the rollers 36, 36 so that the lead I4 is pressed against the side surface of the jig 35. In this lead cutting/lead bending process, each means operates as follows. First, the lead frame F is sent out by two pitches by the pitch feeding means, resulting in a state as shown in FIG. and the second electronic device D2 is sent to a position corresponding to the first cutting and taking out means 31a on the upstream side of the two cutting and taking out means. Cutting and taking out means 31
a is activated, and the second electronic device D2 is taken out from the lead frame F and dropped onto the shooter 33 as shown in FIG. 5(b). At this time, the first electronic device DI is still supported on the lead frame F. Next, the lead frame F is fed out two more pitches,
The state will be as shown in FIG. 5 (m). At this time, the first electronic device D1 left on the lead frame F in the above process reaches the position corresponding to the second cutting/retrieval means 31b, and the fourth electronic device D4 A position corresponding to the first cutting/retrieving means 31a is reached. In this state, the first cutting and taking out means 31a and the second cutting and taking out means 31b operate, and the fourth electronic device D4 and the first electronic device Dl are operated as shown in FIG.
is fired from the lead frame F, and each shooter 33
dropped on top. At this time, the third electronic device D3 is still supported on the lead frame J)-. Furthermore, when the lead frame F is fed out two pitches,
As shown in FIGS. 5 (el and (fl), the sixth electronic device D6 and the third electronic device D3 are taken out and dropped onto the respective shooters. 31a is in charge of taking out the even-numbered electronic devices, and the second cutting and taking-out means 31b is in charge of taking out the odd-numbered electronic devices, so that all the electronic devices are taken out from the lead frame F. The first and second cutting/retrieval means 31
The respective electronic devices WD dropped onto the respective shooters 33 corresponding to WDs a and 31b are sequentially transported 1ull by the protruding rods 33c to the roller bending positions of the respective roller bending means 32a and 32b, and then the leads L thereof are transferred as described above. is roller bent. The electronic device WD as a product thus obtained is sent to the buffer separator 37 as the intermediate portion B of the apparatus of the present invention via a guide shooter (not shown). In this buffer separator 37, a predetermined number of electronic devices that are roller-bent and sent to the guide shooter at unequal intervals are arranged at equal intervals. The structure of this buffer separator 37 is shown in FIGS. 6 and 7. Reference numeral 38 is a stock stand to which the electronic devices after the roller bending are sent at irregular intervals. The stock stand 38 has a width corresponding to the width of the electronic device package, and is formed to extend in the longitudinal direction. and electronic device tD
It has side surfaces 31a or grooves that guide the inside of the lead L that extends downwardly from both sides of the lead L, and is configured to allow the electronic device to slide in the longitudinal direction without falling off laterally. In front of the stock stand 38, there is a conveyance path 39 of a predetermined quality that has the same height as the stock stand 38 and runs at a constant speed in the same direction.
is provided. This can be constructed by looping the endless belt 41 between a pair of front and rear belt pulleys 40.degree. 40, which are arranged at a predetermined distance apart, with at least one of them being a driving wheel. - The endless heald 41 also has the same width as the stock stand 38, and the lead I7 is guided on its side, so that the electronic device does not accidentally fall off from the side. . And this endless heald 41 is also -
At least the upper running portion 41a of the stock stand 38, which functions as the conveyance path 39, is supported from below by a backup plate (not shown) to prevent it from sagging. A feeding means 42 for feeding electronic devices on the stock stand 38 onto the conveying path 39 is provided near the entrance of the progressive path 39 . As shown in FIG. 6, this is simply constituted by an arm that moves along a trajectory indicated by a in the figure and sequentially pushes out the electronic devices on the stock stand 38 onto the conveyance path. Then, in the intermediate part of the conveyance path 38, a plurality of electronic devices sent from the stock stand 38 onto the conveyance path 39 at unequal intervals are temporarily retained at a fixed position, and then one by one Retention/separation means 4 that sends out to the destination of conveyance @39 at equal intervals
3 is provided. As shown in FIGS. 6 and 7, this retention/separation means 43 consists of a pair of units arranged in front and behind each other at the same distance as the length of the unit electronic device, and which is moved up and down by an actuator such as an air cylinder. It can be configured with locking bodies 43a and 43b. In the illustrated example, these locking bodies 43a, 43b
is composed of a plate-like member extending in the transverse direction. These locking bodies 43a and 43b have a stop phase in which they move upward and can hook the lead L of the electronic device, and a non-locking phase in which they move downward and cannot hook the lead L. Can be done. This retention/separation means 43 operates as follows. First, as shown in FIG. 7 ta+, the front locking body 43a
only takes a stationary phase. Since electronic devices are sent one after another to the conveyance path 39, the leading electronic device D1 is attached to the locking body 43.
a and is held in place in a manner that it empties on the conveyance path, and after this first electronic device D1, the electronic devices WaD are successively hit and stopped. It is made to stay on the conveyance path 39 after the stopper 43a. When a certain number of electronic devices are retained in this manner, as shown in FIG. The body 43b moves downward and assumes the unengaged 1F phase.
Only the first electronic device D1 is released while the subsequent electronic devices are stopped by the rear locking body 6b.
1i feed path 39. Next, the front locking body 4
3a assumes the stopped phase again, and the rear locking body 43b assumes the non-engaged 1F phase. Then, as shown in FIG. 7 tc+, the electronic device array that was stopped by the rear locking body 43b advances to the front locking body 43a. Then, when the locking body 4b on the i & side assumes the stop phase, the locking body 4b on the front side also stops.
3a assumes a non-locking phase, and the second electronic device D2 is sent out onto the conveyance path. In this way, the front and rear locking bodies 43a,
43b take turns in the stop phase, the electronic devices that had been retained as described above are separated one by one,
The signal is sent to the IN sending path 39''-. As described above, the electronic devices sent out on the conveyance path 39 at approximately equal intervals are arranged by an alignment means 44 provided at the front of the conveyance path.
This keeps them aligned at equal intervals. As shown in FIG. 6, this alignment means 44 includes alignment phases arranged at predetermined intervals and capable of catching the leads of the electronic device on the main path and stopping it in a fixed position; A predetermined number of supports 44a, 44b, . Each of the supports 44a, 44b, etc. in the embodiment has a frontmost block at the front end of a block having a predetermined length and having an upward groove capable of accommodating the lead of the heald 41a or an electronic device mounted thereon. It is constructed by pasting a locking plate onto which a lead can be hooked, and each can be moved up and down by an actuator such as an air cylinder (not shown). That is, each support 44a. When 44b... moves downward, the locking plate 4
7 becomes a retraction phase that does not interfere with the lead L of the electronic device,
When moved upward, the locking plate 47 assumes an alignment phase that interferes with the locus of movement of the lead of the electronic device. This alignment means 44 operates as follows. That is, when the retention/separation means 43 starts to send out the electronic device, in synchronization with this, the foremost support 44
Only the supports 44a move upward to take the alignment phase, and then the second and subsequent supports 44b... take the alignment phase with a delay of a certain period of time. More specifically, the distance between the electronic devices sent out from the retention/separation means 43 is at least as large as the distance between each of the supports 44a and 44.
4b . . . , so that when the first electronic device DI passes the second support 44b, the second support 44C takes an alignment phase. By doing this, the leading electronic device D1 is supported by the first support body 44a, and the second electronic device D2 is supported by the first supporting body 44a.
The N-th electronic device Dn is held in place by the N-th support 44b, and the N-th electronic device Dn is held in place by the N-th support 44n.
9, they are arranged at equal intervals. The N electronic devices arranged in this manner are collectively transferred to the inspection step 49 as the second portion C of the manufacturing apparatus. (This page, hereafter blank) In FIG. 6, reference numeral 48 indicates a chuck for transferring the N electron waves WD aligned as described above to the inspection process at once. This includes aligned electronic devices and a plurality of unit chucks 48a, 48a, . . . at equal pitches.
. . , and reciprocates along the locus already indicated by the reference numerals in FIG. In addition, the above 6th Ff! As shown in J (when a predetermined number of electronic devices are lined up on the forwarding path 39, the retention/separation means 43 is in a retention mode in which only the front locking body 43a is in a stopped phase. , the electronic devices are prevented from flowing onto the conveyance path. After the electronic devices aligned as described above are collectively transferred to the inspection process 49 by the chuck 48 as described above, the above-mentioned retention and While the separating means 43 takes on the feeding mode, each of the supports 44a, 44b of the aligning means...
・takes a predetermined movement and the next N electronic devices move to the transport path 3.
9. By repeating such a cycle, N pieces of electronic devices are transferred to the inspection step 49 in an arrayed state very efficiently. In the inspection process 49 of the apparatus of the present invention, as shown in FIG. A plurality of measurement stations 52, 53, and 54 are provided below the movement path of these socket pallets 50. That is, the socket pallet 50 has unit sockets 50a, 50b, . Sockets 55 are arranged at the same pitch as the electronic devices to be used, and at the bottom are sockets 55 that receive the connectors 52b, 53b, 54b of each measuring station 52, 53, 54.
is provided and configured. On the other hand, each of the measuring stations 52, 53, and 54 is arranged at predetermined intervals in the feeding direction of the endless checker 751, and the main body 55 houses the measuring circuit.
2a, 53a, 54a, and the connector 52b that moves up and down at the top of these main bodies. 53b and 54b. When the socket pallet 50 with each unit electronic device attached to the unit sockets 50a, 50b, etc. is sent onto the first measurement station 52, for example, an open/short measurement station, its connector 52b is It is moved upward and connected to the socket 55 at the bottom of the socket pallet 50, and a predetermined measurement is performed. At this time, if any electronic device is defective, which electronic device is defective is recorded. When this measurement is completed, connector 5
2b is moved down and the socket pallet 50 is then fed onto a second measuring station 53, for example a noise measuring station, and measurements are taken in the same manner as above. Then, at the final measurement station, the characteristics of the products that were good in the previous measurements are measured. After all such measurements have been made, only good electronic devices are ranked for their characteristics. That is, for example, at the final stage of the movement path of the socket pallet 50, several chucks 56.
57 are on standby, and each chuck 56, 57 chucks and takes out only the electronic device of the assigned characteristic rank from the socket pallet 50. and socket pallet 5
The last defective product remaining on the socket is also ejected from the socket pallet by the chuck in charge. The electronic device taken out from the socket pallet by each chuck 56, 57 in this way is loaded into a container tube and shipped, for example. After all the electronic devices have been taken out by the chuck, the socket pallet 50 is conveyed by the endless checker 751 and returned to the area adjacent to the buffer separator 37, and the plurality of electronic devices are removed from the buffer separator. The above-mentioned moving operation is repeated while receiving measurements at each measuring station. As described above, the electronic device manufacturing apparatus according to the present invention holds the side edges of the lead frame under pressure; the steps from the general feeding unit to the post-mold molding process to the dokasoto lead bending process are performed without moving the general feeding unit. The first part is a buffer separator as an intermediate part for arranging a predetermined number of electronic devices divided into individual units at a predetermined interval in the final stage of the lead cutting/lead bending process;
While moving the socket pallet on which multiple electronic devices that are sequentially transferred from the separator are mounted, the third section, in which the terminals of each measurement station are connected to this socket pallet for measurement, is connected in series. Since the system is structured in such a way that transportation troubles and handling errors in a series of processes are drastically reduced, yields are improved, and work-in-progress accumulation is eliminated, and as a result, the manufacturing efficiency of electronic devices is dramatically improved. Moreover, compared to the case where each process equipment is arranged separately, the equipment arrangement space within the process can be dramatically reduced.

[Brief explanation of drawings]

FIG. 1 is a plan view showing the overall configuration of the apparatus of the present invention, FIG. 2 is an overall perspective view of the transport unit, FIG. 3 is a schematic side view of the lead cutting/lead bending process, and FIG. 4 is a cross-sectional view thereof.
Fig. 5 is an explanatory diagram of the operation of the ta+ or fl beam - dokasoto lead bending process, Fig. 6 is a perspective view of the overall configuration of the buffer separator, and Fig. 7 is an explanation of the operation of the retention/separation means. 8 are schematic side views of the measurement process. 3...1 general feed unit, 29...lead cut/lead bend process, 37...buffer separator, 4
9... Inspection process, 50... Socket pallet, 50
a. 50b...Unit socket, 51...Endless chino (socket pallet fil! Feeding means, 52, 53.54...
- Measuring station, 52b, 53b, 54b... Connector, F... Lead frame, D... Electronic device.

Claims (1)

[Claims] (1) A conveyance means in which a plurality of conveyance units each carrying a lead frame that has completed a resin molding process is sequentially pitch-fed, and a plurality of process means before the lead cutting process arranged in the middle of the conveyance path of this conveyance means. A lead cutting and lead bending process in which individual electronic devices are taken out from the lead frames sequentially transferred from each transport unit at the end of the transport path and the leads are bent, and after the lead bending process is finished, the electronic devices are removed at irregular intervals. a buffer separator for arranging a predetermined number of individual electronic devices to be discharged at equal intervals and sequentially transferring the predetermined number of arranged electronic devices at once; and electrons arranged by the buffer separator. A socket pallet conveying means for feeding a plurality of socket pallets with a circular pitch, each of which has a predetermined number of sockets arranged in parallel with the same pitch as the device, and which sequentially receives a predetermined number of electronic devices from the buffer separator; An inspection means arranged in the middle of the conveyance path of the pallet conveyance means and configured to connect a connector to the socket pallets that are sequentially sent and to measure the electronic devices on the socket pallets. , electronic device manufacturing equipment.