JPS62204344U - - Google Patents

Info

Publication number
JPS62204344U
JPS62204344U JP9137486U JP9137486U JPS62204344U JP S62204344 U JPS62204344 U JP S62204344U JP 9137486 U JP9137486 U JP 9137486U JP 9137486 U JP9137486 U JP 9137486U JP S62204344 U JPS62204344 U JP S62204344U
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
center line
frame
longitudinal direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9137486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9137486U priority Critical patent/JPS62204344U/ja
Publication of JPS62204344U publication Critical patent/JPS62204344U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案による半導体装置用リードフレ
ームの一実施例の平面図、第2図は従来例の平面
図、第3図は第2図―線に沿う断面図である
。 21……ダイパツド、22……サポートリード
、23,24……サイドレール、25……リード
、26……ダムバー、27……タイバー、28,
29……ガイドホール、30……送り孔、31…
…マーク、L……中心線。
FIG. 1 is a plan view of an embodiment of a lead frame for a semiconductor device according to the present invention, FIG. 2 is a plan view of a conventional example, and FIG. 3 is a sectional view taken along the line of FIG. 2. 21... Die pad, 22... Support lead, 23, 24... Side rail, 25... Lead, 26... Dam bar, 27... Tie bar, 28,
29... Guide hole, 30... Spread hole, 31...
...Mark, L...center line.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プレス加工により成形される半導体装置用リー
ドフレームにおいて、フレームパターンがリード
フレームの長手方向の中心線に関して対称に構成
されていることを特徴とする半導体装置用リード
フレーム。
1. A lead frame for a semiconductor device formed by press working, wherein a frame pattern is configured symmetrically with respect to a center line in a longitudinal direction of the lead frame.
JP9137486U 1986-06-17 1986-06-17 Pending JPS62204344U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9137486U JPS62204344U (en) 1986-06-17 1986-06-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9137486U JPS62204344U (en) 1986-06-17 1986-06-17

Publications (1)

Publication Number Publication Date
JPS62204344U true JPS62204344U (en) 1987-12-26

Family

ID=30952100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9137486U Pending JPS62204344U (en) 1986-06-17 1986-06-17

Country Status (1)

Country Link
JP (1) JPS62204344U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294073A (en) * 1976-02-04 1977-08-08 Hitachi Ltd Leading-in frame and process for preparing it
JPS554985A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5294073A (en) * 1976-02-04 1977-08-08 Hitachi Ltd Leading-in frame and process for preparing it
JPS554985A (en) * 1978-06-27 1980-01-14 Nec Kyushu Ltd Lead frame for semiconductor device

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