JPS62204339U - - Google Patents
Info
- Publication number
- JPS62204339U JPS62204339U JP9266786U JP9266786U JPS62204339U JP S62204339 U JPS62204339 U JP S62204339U JP 9266786 U JP9266786 U JP 9266786U JP 9266786 U JP9266786 U JP 9266786U JP S62204339 U JPS62204339 U JP S62204339U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dip
- dissipation fin
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266786U JPS62204339U (it) | 1986-06-17 | 1986-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266786U JPS62204339U (it) | 1986-06-17 | 1986-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204339U true JPS62204339U (it) | 1987-12-26 |
Family
ID=30954575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9266786U Pending JPS62204339U (it) | 1986-06-17 | 1986-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204339U (it) |
-
1986
- 1986-06-17 JP JP9266786U patent/JPS62204339U/ja active Pending
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