JPS62203361A - Integrated circuit with built-in chip name display circuit - Google Patents
Integrated circuit with built-in chip name display circuitInfo
- Publication number
- JPS62203361A JPS62203361A JP4572786A JP4572786A JPS62203361A JP S62203361 A JPS62203361 A JP S62203361A JP 4572786 A JP4572786 A JP 4572786A JP 4572786 A JP4572786 A JP 4572786A JP S62203361 A JPS62203361 A JP S62203361A
- Authority
- JP
- Japan
- Prior art keywords
- name display
- circuit
- chip
- product name
- buffers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000872 buffer Substances 0.000 claims abstract description 21
- 230000002457 bidirectional effect Effects 0.000 claims description 25
- 238000012360 testing method Methods 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract 2
- 238000012790 confirmation Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
Landscapes
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 「産業上の利用分野」 この発明は試験誤りを少な(された集積回路に関する。[Detailed description of the invention] "Industrial application field" The present invention relates to integrated circuits with reduced test errors.
「従来の技術」
従来、集積回路とその回路試験に必要なテストパターン
との品名対応はテストパターンが記憶される媒体上の管
理に委ねられていた。``Prior Art'' Conventionally, the correspondence between product names of integrated circuits and test patterns necessary for circuit testing has been left to management on the medium in which the test patterns are stored.
「発明が解決しようとする問題点」
上述したように従来においては集積回路とその回路試験
に必要なテストパターンとの品名対応は、テストパター
ンが記憶される媒体上の管理に委ねられていたため、集
積回路の少量多品種化の傾向が強まるにつれて、集積回
路チップとテストパターンとの対応確認に不整合が生じ
やすい環境となり、その不整合のために試験のやり直し
や、不良解析等に無駄な時間を要することが起こりやす
いという欠点があった。"Problems to be Solved by the Invention" As mentioned above, in the past, the correspondence between product names of integrated circuits and the test patterns necessary for circuit testing was left to the management of the medium in which the test patterns were stored. As the trend towards small-volume, high-mix integrated circuits increases, the environment is becoming more likely to cause inconsistencies in checking the correspondence between integrated circuit chips and test patterns, and these inconsistencies lead to unnecessary time being wasted in redoing tests and analyzing failures. The disadvantage is that it is likely to require
「問題点を解決するための手段」
この発明によればチップ品名表示信号を出力するクラン
プ・ソース回路と、上記チップ品名表示信号を出力させ
ることができる双方向バッファと、その双方向バッファ
に接続された双方向端子と、上記双方向バッファを制御
する信号が入力する制御端子とが集積回路に設けられ□
る。"Means for Solving the Problem" According to the present invention, there is a clamp source circuit that outputs a chip product name display signal, a bidirectional buffer that can output the chip product name display signal, and a connection to the bidirectional buffer. The integrated circuit is provided with a bidirectional terminal that is configured to control the bidirectional buffer, and a control terminal that receives a signal that controls the bidirectional buffer.
Ru.
この集積回路を試験する際に上記制御端子の制御信号に
より双方向バッファを制御して、チップ品名表示信号を
双方向バッファを通じて双方向端子へ出力させ、このチ
ップ品名表示信号によりその集積回路の試験に必要なテ
ストパターンの品名対応との確認をとることにより両者
の不整合をいちはやく発見することができる。When testing this integrated circuit, the bidirectional buffer is controlled by the control signal of the control terminal to output the chip product name display signal to the bidirectional terminal through the bidirectional buffer, and the integrated circuit is tested using this chip product name display signal. By confirming that the test pattern required for the product name corresponds to the product name, inconsistencies between the two can be quickly discovered.
「実施例」 次にこの発明について図面を参照して説明する。"Example" Next, the present invention will be explained with reference to the drawings.
第1図はこの発明の実施例を示し、4ビツトでチップ品
名表示を行う場合であり、第2図は第1図の真理値表で
ある。FIG. 1 shows an embodiment of the present invention, in which a chip product name is displayed using 4 bits, and FIG. 2 is a truth table of FIG. 1.
この発明では集積回路チップにチップ品名表示回路が設
けられる。そのチップ品名表示回路は第1図の例では双
方向端子11112.13.14と、これら双方向端子
11.12.13.14に接続された双方向バッファ2
1.22.23.24と、チップ品名表示回路制御端子
11と、そのチップの品名表示を出力するクランプ・ソ
ース回路12とから構成される。In this invention, a chip product name display circuit is provided on an integrated circuit chip. In the example shown in FIG. 1, the chip product name display circuit includes bidirectional terminals 11112.13.14 and a bidirectional buffer 2 connected to these bidirectional terminals 11.12.13.14.
1.22.23.24, a chip product name display circuit control terminal 11, and a clamp source circuit 12 that outputs the chip product name display.
チップ品名表示回路制御端子11のチップ品名表示回路
制御信号20がttOn信号時は、双方向バッファ2□
、 22.23.24は端子11+ 12+ IL 1
4よりの入力信号をそれぞれ内部論理回路13に入力信
号31..32.33.34として入力する回路構成と
なり、集積回路本来の機能をはたす。When the chip name display circuit control signal 20 of the chip name display circuit control terminal 11 is a ttOn signal, the bidirectional buffer 2□
, 22.23.24 is terminal 11+ 12+ IL 1
The input signals from 31.4 are input to the internal logic circuit 13, respectively. .. 32, 33, and 34, and performs the original function of an integrated circuit.
その集積回路の回路試験時には端子11のチップ品名表
示回路制御信号20が゛11″レベルにされ、このtt
1 nレベルはファン・アウト用ゲート14を通して
双方向バッファ21.22.23.24の信号導通方向
を切り換えて、クランプ・ソース回路12から出力され
る集積回路個有の品名表示信号41142゜43、44
が双方向バッファ21.22.23.24をそれぞれ通
じて双方向端子11.12.13.14 に出力され、
この出力によりチップの品名確認が容易に可能となり、
チップとテストパターンとの適合・不適合を判定するこ
とができる。第1図では集積回路個有のチップ品名表示
信号を4ビツト例で示しており、指定のチップ品名表示
信号41.42.43.44はクランプ・ソース回路1
2から11111 、 110I+ 、 11Qil
。During a circuit test of the integrated circuit, the chip product name display circuit control signal 20 of the terminal 11 is set to the "11" level, and this tt
1 n level switches the signal conduction direction of the bidirectional buffer 21, 22, 23, 24 through the fan-out gate 14, and outputs the integrated circuit product name display signal 41142.43 from the clamp source circuit 12. 44
are output to the bidirectional terminal 11.12.13.14 through the bidirectional buffers 21.22.23.24, respectively,
This output makes it easy to confirm the chip product name.
Compatibility or non-conformity between the chip and the test pattern can be determined. FIG. 1 shows a 4-bit example of a chip product name display signal unique to an integrated circuit, and designated chip product name display signals 41, 42, 43, and 44 are used in the clamp source circuit 1.
2 to 11111, 110I+, 11Qil
.
tt 1 nとして出力され、これが観測点である双方
向端子11.12.13.14に出力された時のみ、こ
の集積回路チップと回路試験時のテストパターンとの適
合が確認される。Only when this is output as tt 1 n to the bidirectional terminal 11.12.13.14 which is the observation point, is the compatibility between this integrated circuit chip and the test pattern used during circuit testing confirmed.
「発明の効果」
以上説明したようにこの発明は、集積回路チップ品名を
識別するために任意のピット幅で構成される品名表示信
号を出力する回路と、その品名表示信号を観測するため
出力させる任意の数の双方向バッファと、双方向端子と
、前記双方向バッファを制御する制御端子とを設けるこ
とにより、試験時に品名表示信号を出力することにより
回路試験の際に集積回路チップとテストパターンとの対
応確認がとれるため、両者の不整合が原因の試験のやり
直しや、不良解析不能やテストパターン記憶媒体上の管
理再確認等の無駄な時間を除くことができる効果がある
。"Effects of the Invention" As explained above, the present invention provides a circuit that outputs a product name display signal consisting of an arbitrary pit width in order to identify the product name of an integrated circuit chip, and a circuit that outputs the product name display signal for observation. By providing an arbitrary number of bidirectional buffers, bidirectional terminals, and control terminals for controlling the bidirectional buffers, a product name display signal can be output during testing, and integrated circuit chips and test patterns can be easily identified during circuit testing. This has the effect of eliminating wasted time such as redoing the test due to inconsistency between the two, inability to analyze failures, and reconfirming management on the test pattern storage medium.
第1図はこの発明によるチップ品名表示回路内蔵の集積
回路における要部を示す図、第2図は第1図の真理値表
を示す図である。
11〜1今: 双方向端子、21〜24:双方向バッ
ファ、31〜34:内部論理回路の入力信号、41〜4
4:品名表示信号、11:チップ品名表示回路制御端子
、12:クランプ・ソース回路、14:ファン・アウト
用ゲート、20:チップ品名表示回路制御信号。FIG. 1 is a diagram showing a main part of an integrated circuit incorporating a chip product name display circuit according to the present invention, and FIG. 2 is a diagram showing a truth table of FIG. 1. 11-1 now: bidirectional terminal, 21-24: bidirectional buffer, 31-34: input signal of internal logic circuit, 41-4
4: Product name display signal, 11: Chip product name display circuit control terminal, 12: Clamp source circuit, 14: Fan-out gate, 20: Chip product name display circuit control signal.
Claims (1)
回路と、 そのクランプ・ソース回路のチップ品名表示信号を出力
させることができる双方向バッファと、その双方向バッ
ファに接続された双方向端子と、前記双方向バッファを
制御する信号が入力する制御端子とを有するチップ品名
表示回路内蔵の集積回路。(1) A clamp source circuit that outputs a chip product name display signal, a bidirectional buffer that can output a chip product name display signal of the clamp source circuit, and a bidirectional terminal connected to the bidirectional buffer; and a control terminal into which a signal for controlling the bidirectional buffer is input, and an integrated circuit incorporating a chip product name display circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4572786A JPS62203361A (en) | 1986-03-03 | 1986-03-03 | Integrated circuit with built-in chip name display circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4572786A JPS62203361A (en) | 1986-03-03 | 1986-03-03 | Integrated circuit with built-in chip name display circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62203361A true JPS62203361A (en) | 1987-09-08 |
Family
ID=12727352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4572786A Pending JPS62203361A (en) | 1986-03-03 | 1986-03-03 | Integrated circuit with built-in chip name display circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62203361A (en) |
-
1986
- 1986-03-03 JP JP4572786A patent/JPS62203361A/en active Pending
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