JPS62200789A - Electronic parts mounting structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] $7: The invention relates to a component mounting structure for an electronic device, and particularly to a component mounting structure for an electronic device having two circuits of component components of the same circuit.

[Conventional technology]

Conventionally, the electronic component mounting structure of an electronic device having two circuits of the same electronic component has been constructed as shown in FIGS. 7 to 11. The frame shown in FIGS. 7 and 8 includes a frame 1 for mounting electronic components, and electronic components 2 for two circuits.
A board 6 on which one circuit of each of 3 and 4.5 is mounted
．． 7 are installed in parallel on the same plane. In addition, the device Vi shown in FIGS. 9, 10, and 11 is provided with a mounting portion 1a erected at right angles to the frame 1 for mounting child parts, and two circuits are provided on the left and right sides or behind the mounting portion 1a. °
Board 6.71 with one circuit each of Naruko components 2.3 and 4.5 mounted! :, these electronic components 2.3 and 4.5 are mounted so as to be symmetrical with respect to the mounting portion 1a.

In addition, as a proposal of this kind, as disclosed in Japanese Utility Model Application Publication No. 60-30568, the central part of a jumper wire with both ends soldered to the board is bent and inserted into a through hole formed in the board. There is a proposal to expose the back side of the board.

[Problem that the invention seeks to solve]

According to the mounting structure shown in FIGS. 7 and 8, α child component 2
．． 3.4.5 are mounted in a two-dimensional arrangement, the height of the electronic device is determined by the height of the Nariko parts, and the size of the entire electronic device is determined by the selection of the printed circuit board. Therefore, there was a problem in that it was difficult to downsize the device.

For this reason, the mounting structures shown in FIGS. 9 to 11 are often used at present, but even in this case, the size of the entire electronic device is determined by the height of the electronic components. At this time, if an attempt was made to lower the height of the mounted components by mounting the electronic components laterally, there was a problem in that the area of the printed circuit board 6.7 would increase and the overall size of the electronic device would become larger. It should be noted that the proposal in the above-mentioned Japanese Utility Model Application Publication No. 60-30568 does not solve the above problem.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide an electronic component mounting structure that can downsize an electronic device having two circuits of the same electronic component.

[Means for solving problems]

In order to achieve the above object, the electronic component mounting structure according to the present invention arranges the electronic component mounting surfaces of these two circuits to face each other in an electronic device configured with two circuits having the same circuit alpha component, and The electronic components are arranged so that they do not interfere with each other.

[Effect]

According to the above configuration, electronic components that can be mounted vertically are mounted vertically as much as possible to reduce the mounting area, and at the same time, because these α-child components do not intertwine and interfere with each other, the height is the same as that of one circuit. Therefore, the entire electronic device can be downsized.

[Implementation row]

EMBODIMENT OF THE INVENTION Hereinafter, one embodiment of a structure for mounting a component according to the present invention will be described with reference to the drawings.

An embodiment of the present invention is shown in FIGS. 1 to 6.

In this figure, the same or equivalent parts as in the conventional column shown in FIG. 7 are designated by the same reference numerals. As shown in FIG. 5, identical circuit electronic components 2 and 3 and 4 and 5 are mounted symmetrically on printed circuit boards 6 and 7 having the same shape, with their mounting surfaces facing each other.

Here, electronic components 2 and 4 and 3 and 5 are the same electronic component. If one of these printed circuit boards 6.7, for example 7, is rotated 180 degrees within the same plane with respect to the other printed circuit board 6, the electronic components 2.3 and 4.5 will be separated as shown in FIG. They will not interfere with each other even if they are brought close together. In this state, as shown in FIGS. 2, 3, and 4, if the printed circuit board 6.7 is fixed to the frame 1 with the electronic component mounting surfaces facing each other and approaching each other, the electronic components 2.3 and 4. 5
can be mounted as shown in plan view in FIG. 1 without interfering with each other.

According to this embodiment, the area of the printed circuit board 6.7 can be reduced by vertically mounting the electronic components 2.3.4.5 as much as possible, and the electronic components mounted on both boards 6.7 The heights of the circuits cancel each other out and become close to the height of one circuit. As a result, the area and height of the electronic device can be reduced to make it more compact. In addition, since the mounting structure of the α-child components for two circuits can be the same as that for t1 circuit, the structural parts and materials can be the same, and the assembly work can also be the same, reducing design time. , the manufacturing process and assembly work can be simplified, and the cost and weight of the device can be reduced.

In this embodiment, the case where the electronic component is attached to the frame via a printed circuit board has been described, but the same effect can be obtained when the electronic component 1 is directly mounted on the frame.

〔Effect of the invention〕

As described above, according to the present invention, two circuits having the same circuit electronic components are arranged with their mounting surfaces facing each other, and these electronic components are arranged so that they do not interfere with each other. The d-child device can be made smaller.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of an electronic component mounting structure according to the present invention, FIG. 2, FIG. 3, and FIG. 4 are respectively a front view, a side view, and a back view of FIG. 1, and FIG. and FIG. 6 are perspective views showing interference states of mounted electronic components, FIGS. 7 and 8 are front and side views showing conventional electronic component mounting structures, and FIGS. 9, 10, and FIG. 11 is a plan view, a front view, and a side view, respectively, showing an improved conventional electronic component mounting structure. 2.3.4.5...Seiko parts.

Claims (1)

[Claims] 1. In an electronic component mounting structure of an electronic device composed of two circuits having the same circuit electronic components, the electronic component mounting surfaces of the two circuits are arranged facing each other, and these electronic components are mutually arranged. An electronic component mounting structure characterized by being arranged so as not to interfere with each other. 2. Claim 1 states that two circuits of identical electronic components are arranged in substantially the same way, and one of these two circuits is mounted by rotating approximately 180 degrees within the same plane with respect to the other. Characteristic electronic component mounting structure.