JPS6092865U - High-density mounting structure for electronic components - Google Patents

High-density mounting structure for electronic components

Info

Publication number
JPS6092865U
JPS6092865U JP18556183U JP18556183U JPS6092865U JP S6092865 U JPS6092865 U JP S6092865U JP 18556183 U JP18556183 U JP 18556183U JP 18556183 U JP18556183 U JP 18556183U JP S6092865 U JPS6092865 U JP S6092865U
Authority
JP
Japan
Prior art keywords
electronic components
mounting structure
density mounting
printed board
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18556183U
Other languages
Japanese (ja)
Inventor
中村 名治
富田 孝治
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP18556183U priority Critical patent/JPS6092865U/en
Publication of JPS6092865U publication Critical patent/JPS6092865U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、従来の電子部品の実装構造を説明するための
側面図、aは水平実装図、bは垂直実装図、第2図は、
本考案に係る電気子部品の高密度実装構造の一実施例を
説明するためのaは正面図、bは側面図、第3図は、本
考案に係る電子部品の高密度実装構造の共通接続部材の
一実施例を説明するための斜視図、第4図は、本考案に
係る電子部品の高密度実装構造の共通接続部材の他の実
施例を説明するための斜視図である。 図において、1はプリント板、2は電子部品、3は一方
のリード、4は他方のリード、5は半田、6および8は
共通接続部材、7はリード線、61は電子部品のリード
接続部、62および82はリード線接続部、81は凹部
をそれぞれ示す。
FIG. 1 is a side view for explaining a conventional electronic component mounting structure, a is a horizontal mounting diagram, b is a vertical mounting diagram, and FIG.
For explaining one embodiment of the high-density mounting structure for electronic components according to the present invention, a is a front view, b is a side view, and FIG. 3 is a common connection of the high-density mounting structure for electronic components according to the present invention. FIG. 4 is a perspective view for explaining one embodiment of the member. FIG. 4 is a perspective view for explaining another embodiment of the common connection member of the high-density mounting structure of electronic components according to the present invention. In the figure, 1 is a printed board, 2 is an electronic component, 3 is one lead, 4 is another lead, 5 is solder, 6 and 8 are common connecting members, 7 is a lead wire, and 61 is a lead connection part of the electronic component. , 62 and 82 are lead wire connection parts, and 81 is a recessed part, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント板に搭載する両端に端子を有する複数の電子部
品の高密度実装構造であって、該電子部品の一方の端子
をプリント板に接着し、他方の複数の端子を共通の接続
部材でプリント板に取着するようにしたことを特徴とす
る電子部品の高密度実装構造。
A high-density mounting structure of a plurality of electronic components having terminals at both ends to be mounted on a printed board, in which one terminal of the electronic component is glued to the printed board, and the other terminals are connected to the printed board using a common connecting member. A high-density mounting structure for electronic components, characterized in that the electronic components are attached to the .
JP18556183U 1983-11-29 1983-11-29 High-density mounting structure for electronic components Pending JPS6092865U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18556183U JPS6092865U (en) 1983-11-29 1983-11-29 High-density mounting structure for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18556183U JPS6092865U (en) 1983-11-29 1983-11-29 High-density mounting structure for electronic components

Publications (1)

Publication Number Publication Date
JPS6092865U true JPS6092865U (en) 1985-06-25

Family

ID=30401042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18556183U Pending JPS6092865U (en) 1983-11-29 1983-11-29 High-density mounting structure for electronic components

Country Status (1)

Country Link
JP (1) JPS6092865U (en)

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