JPS5978658U - Hybrid type circuit board - Google Patents

Hybrid type circuit board

Info

Publication number
JPS5978658U
JPS5978658U JP17526082U JP17526082U JPS5978658U JP S5978658 U JPS5978658 U JP S5978658U JP 17526082 U JP17526082 U JP 17526082U JP 17526082 U JP17526082 U JP 17526082U JP S5978658 U JPS5978658 U JP S5978658U
Authority
JP
Japan
Prior art keywords
circuit board
component mounting
type circuit
hybrid type
protective portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17526082U
Other languages
Japanese (ja)
Other versions
JPS6221023Y2 (en
Inventor
博文 松本
Original Assignee
日本メクトロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本メクトロン株式会社 filed Critical 日本メクトロン株式会社
Priority to JP17526082U priority Critical patent/JPS5978658U/en
Publication of JPS5978658U publication Critical patent/JPS5978658U/en
Application granted granted Critical
Publication of JPS6221023Y2 publication Critical patent/JPS6221023Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

−第１図は本考案の一実施例に従ったハイブリット型回
路基板の概念的な構成斜視図、第２図は回路部品実装処
理後に行なわれるフローソルダリング等の回路部品接続
工程並びに回路部品のリード線突出部に対する切除処理
を本考案との関連において股間する図である。 １・・・硬質基材、２．３・・・部品実装部、４・・・
連結部、５・・・保護部、６・・・フレキシブル回路基
板、７゜８・・・対応実装部、９・・・接続部、１４．
１５・・・スリー％ＩＬ- Fig. 1 is a conceptual structural perspective view of a hybrid circuit board according to an embodiment of the present invention, and Fig. 2 shows the circuit component connection process such as flow soldering performed after the circuit component mounting process and the circuit component connection process. FIG. 6 is a diagram illustrating the cutting process for the lead wire protrusion in relation to the present invention. 1... Hard base material, 2.3... Component mounting section, 4...
Connecting part, 5... Protective part, 6... Flexible circuit board, 7°8... Corresponding mounting part, 9... Connection part, 14.
15...Three%IL

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の部品実装部間に配設した保護部と該保護部に対す
る前記各部品実装部の隣接域に形成したスリットと及び
前記保護部を上記部品実装部に連設する為の連結部とを
硬質材に設け、前記各部品実装部に必要な回路パターン
の所要部間を電気的に接続する為のフレキシブル回路基
板を備え、該フレキシブル回路基板を前記スリットを通
して前記保護部を潜抜けるように配装したことを特徴と
するハイブリット型回路基板。A protective portion arranged between a plurality of component mounting portions, a slit formed in an area adjacent to each of the component mounting portions with respect to the protective portion, and a connecting portion for connecting the protective portion to the component mounting portion are made of a hard material. a flexible circuit board for electrically connecting required parts of circuit patterns necessary for each of the component mounting sections, and arranged so that the flexible circuit board passes through the slit and passes through the protection section. A hybrid circuit board characterized by:
JP17526082U 1982-11-19 1982-11-19 Hybrid type circuit board Granted JPS5978658U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17526082U JPS5978658U (en) 1982-11-19 1982-11-19 Hybrid type circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17526082U JPS5978658U (en) 1982-11-19 1982-11-19 Hybrid type circuit board

Publications (2)

Publication Number Publication Date
JPS5978658U true JPS5978658U (en) 1984-05-28
JPS6221023Y2 JPS6221023Y2 (en) 1987-05-28

Family

ID=30381338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17526082U Granted JPS5978658U (en) 1982-11-19 1982-11-19 Hybrid type circuit board

Country Status (1)

Country Link
JP (1) JPS5978658U (en)

Also Published As

Publication number Publication date
JPS6221023Y2 (en) 1987-05-28

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