JPS62199398A - Method of boring multilayer printed board - Google Patents
Method of boring multilayer printed boardInfo
- Publication number
- JPS62199398A JPS62199398A JP4241186A JP4241186A JPS62199398A JP S62199398 A JPS62199398 A JP S62199398A JP 4241186 A JP4241186 A JP 4241186A JP 4241186 A JP4241186 A JP 4241186A JP S62199398 A JPS62199398 A JP S62199398A
- Authority
- JP
- Japan
- Prior art keywords
- drill
- multilayer printed
- drilling
- printed board
- intermediate layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 5
- 238000005553 drilling Methods 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 16
- 239000002344 surface layer Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 9
- 238000007796 conventional method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
本発明の多層プリント板は、中間層板の配線ランド上に
ドリルを誘導するための中空部が形成されている。DETAILED DESCRIPTION OF THE INVENTION [Summary] In the multilayer printed board of the present invention, a hollow portion for guiding a drill is formed above the wiring land of the intermediate layer board.
このため、本発明を適用すれば、ドリルと銅箔で形成さ
れた配線ランドとの摩擦、つまり金属と金属との摩擦に
起因する熱的障害、ならびに穿孔時におけるドリルの軌
道ズレ障害等を減少させることができる。Therefore, by applying the present invention, thermal problems caused by friction between the drill and the wiring land formed of copper foil, that is, friction between metals, and problems caused by the drill's track deviation during drilling can be reduced. can be done.
本発明は、多層プリント板に、例えばスルーホール用等
の穿孔加工を行う際の穴明は方法の改良に係り、特に中
間層板に形成された配線ランドにドリル誘導用の中空部
を設けることによって、穿孔時における諸障害を低減さ
せた、多層プリント板の穴明は方法に関する。The present invention relates to an improvement in the method for drilling holes, such as through-holes, in a multilayer printed board, and in particular to providing a hollow part for guiding a drill in a wiring land formed in an intermediate layer board. The present invention relates to a method for drilling holes in multilayer printed circuit boards with reduced obstacles during drilling.
第２図（ａ）、 （ｂｌは多層プリント板の従来の穴明
は方法を示す要部斜視図と、ドリル穴の側断面図である
。FIGS. 2A and 2B are a perspective view of a main part showing a conventional method for drilling holes in a multilayer printed board, and a side sectional view of a drilled hole.
第２図（ａ）および（ｂ）に示すように、多層プリント
板の穴明けには一般にドリル４が用いられ、表面銅箔６
−表面層板５−配線ランド３−中間層板２−表面層板５
−表面銅箔６の順に穿孔を行ってドリル穴８が形成され
る。As shown in FIGS. 2(a) and 2(b), a drill 4 is generally used to drill holes in a multilayer printed circuit board, and a surface copper foil 6 is used.
- Surface layer board 5 - Wiring land 3 - Intermediate layer board 2 - Surface layer board 5
- Drill holes 8 are formed by drilling holes in the surface copper foil 6 in this order.
なお同図では説明を解かり易くするため、中間層板２が
１枚になっているが、実際の場合は、少なくとも数枚の
中間層板２が使用される。そして各中間層板２の間、お
よび該中間層板２と表面層板５の間は、プリプレグと呼
ばれる図示されない接着材で互いに接合されている。In this figure, in order to make the explanation easier to understand, there is only one intermediate layer plate 2, but in actual case, at least several intermediate layer plates 2 are used. The intermediate layer plates 2 and the intermediate layer plates 2 and the surface layer plates 5 are bonded to each other with an adhesive (not shown) called prepreg.
しかしながら、上記従来の方法による穴明は加工の場合
は、ドリル４と配線ランド３との摩擦熱によってスミャ
ー（Ｓｍｅａｒ ） ９と呼ばれる生成物がドリル穴８
内に生じたり〔第２図中）参照〕、或いはドリル４の先
端がスリップして、ドリル４が正規の穿孔ルートＯ（第
１図（ａ）参照〕から逸れるといった事故が屡々発生し
ていた。However, when drilling by the above-mentioned conventional method, a product called smear 9 is formed in the drill hole 8 due to frictional heat between the drill 4 and the wiring land 3.
Accidents often occurred in which the tip of the drill 4 slipped and the drill 4 deviated from the normal drilling route O (see Figure 1 (a)). .
なお摩擦熱の影響が主として中間層板２側に集中するの
は、この加工段階で表面銅箔６側は未だパターン形成が
行われていない“ベタ銅箔”の状態で、しかも直接外気
に触れているため放熱性が良好であるのに対し、中間層
板２側はパターン形成が既に完了し、且つ表裏両面共に
密閉状態にあって内部に熱が籠るためである。The effect of frictional heat is mainly concentrated on the intermediate layer board 2 side because, at this processing stage, the surface copper foil 6 side is in a "solid copper foil" state with no pattern formation yet, and is directly exposed to the outside air. This is because the pattern formation on the intermediate layer plate 2 side has already been completed and both the front and back sides are in a sealed state, so heat is trapped inside.
前記スミャー９は、表面銅箔６．配線ランド３の切削屑
および表面層板５ならびに中間層板２を構成する合成樹
脂材が溶けたり、焦げたりしたものから生成される。The smear 9 has a surface copper foil 6. It is generated from the cutting waste of the wiring land 3 and the melted or burnt synthetic resin materials that constitute the surface layer plate 5 and the intermediate layer plate 2.
本発明は第１図（ａｌ、 （ｂｌに示すように、配線ラ
ンド３の略中央部分に中空部７を設け、穿孔用ドリル４
の先端が先ず最初に中間層板２の構成材料である合成樹
脂に作用し、ある程度穿孔加工が進行した後に配線ラン
ド３に対する穿孔が行われる構成になっている。As shown in FIGS. 1(al) and 1(bl), the present invention provides a hollow portion 7 approximately in the center of the wiring land 3, and a drilling drill 4.
The tip first acts on the synthetic resin that is the constituent material of the intermediate layer board 2, and after the drilling has progressed to a certain extent, the wiring land 3 is drilled.
このように構成されたものにおいては、ドリル４の穿孔
ルートが安定しにくいとされる穿孔開始時に、ドリル４
の先端と銅箔で形成された配線ランド３との接触が無い
ので、摩擦熱の発生も当然抑制され、特にドリル４の誘
導が該中空部７によって行われることになるため、ドリ
ル４の穿孔ルートが自然に正常化される。With this configuration, when the drilling route of the drill 4 is said to be difficult to stabilize, the drill 4
Since there is no contact between the tip of the wire and the wiring land 3 formed of copper foil, the generation of frictional heat is naturally suppressed, and in particular, since the drill 4 is guided by the hollow portion 7, the drilling of the drill 4 is prevented. The route will normalize naturally.
以下図面に示した実施例に基づいて本発明の詳細な説明
する。The present invention will be described in detail below based on embodiments shown in the drawings.
第１図（ａ）、 （ｂｌは本発明による多層プリント板
の穴明は方法の一実施例を示す要部斜視図と配線ランド
の詳細を示す斜視図であるが、前記第２図と同一部分に
は同一符号を付している。FIGS. 1(a) and (bl) are a perspective view of a main part showing an embodiment of the method for drilling holes in a multilayer printed board according to the present invention, and a perspective view showing details of a wiring land, which are the same as FIG. The same reference numerals are given to the parts.
第１図（ａ）および（ｂ）に示すように、本発明の多層
プリント板は、中間層板２上に設けられた配線ランド３
の略中央部分に、ドリル誘導用の中空部７が形成されて
いる。そして該中空部７の直径ｄはドリル穴８の直径り
に対して、ｄ＜［）となるように構成されている。As shown in FIGS. 1(a) and 1(b), the multilayer printed board of the present invention has a wiring land 3 provided on an intermediate layer board 2.
A hollow portion 7 for guiding a drill is formed approximately in the center of the hole. The diameter d of the hollow portion 7 is configured such that d<[] with respect to the diameter of the drill hole 8.
このためドリル４は、該中空部７による誘導を受けて、
所定の穿孔ルートＯに沿って正常に穿孔動作を行うこと
になる。Therefore, the drill 4 is guided by the hollow part 7,
The drilling operation will be performed normally along the predetermined drilling route O.
なお中空部７の形成位置は、ドリル４の穿孔ルー）Ｏ上
に位置しているので、穿孔時にドリル４の先端は銅箔で
形成された配線ランド３と接触することはなく、このた
め摩擦熱の発生が抑制されてドリル４の先端が正規の穿
孔ルートｏから逸れる現象も改善される。Note that the formation position of the hollow part 7 is located on the drilling hole (O) of the drill 4, so the tip of the drill 4 does not come into contact with the wiring land 3 formed of copper foil during drilling, and therefore friction is reduced. Heat generation is suppressed, and the phenomenon in which the tip of the drill 4 deviates from the normal drilling route o is also improved.
以上の説明は、中間層板２上の配線ランｌ″３のみを対
象にしているが、表面層板５の内面に形成された図示さ
れない配線ランドにも適用されることはいうまでもない
。Although the above description is directed only to the wiring run l''3 on the intermediate layer board 2, it goes without saying that it is also applied to a wiring land (not shown) formed on the inner surface of the surface layer board 5.
本発明は以上説明したように、穿孔用のドリルが配線ラ
ンド上に設けた中空部に誘導される構成になっているた
め、ドリルが正規の穿孔ルートから逸脱するようなこと
が無く、特にドリルの先端と配線ランドとの摩擦による
諸障害が排除されるので、信頼性の高い多層プリント板
を製作することが可能となる。As explained above, the present invention is configured such that the drilling drill is guided into the hollow part provided on the wiring land, so the drill does not deviate from the regular drilling route, and in particular, the drill Since various problems caused by friction between the tip of the wire and the wiring land are eliminated, it is possible to produce a highly reliable multilayer printed board.
第１図（ａｌ、 （ｂｌは本発明の一実施例を示す要部
斜視図と配線ランドを示す斜視図、
第２図（ａ）、 （ｂｌは多層プリント板の従来の穴明
は方法を示す要部斜視図とドリル穴の側断面図である。
図中、２は中間層板、３は配線ランド、４はドリル、５
は表面層板、６は表面銅箔、７は中空部、８はドリル穴
、９はスミャー、０はドリルの穿孔ルートをそれぞれ示
す。
、Ｃ暉帥軒視図
＋ｂ＋ １と諜う＞ド゛／ｌ寥子声［１１軒視図不発明
め一突珀σＪｍ
第 １ 図Figure 1 (al), (bl is a perspective view of a main part showing an embodiment of the present invention and a perspective view showing a wiring land, Figure 2 (a), (bl is a conventional method for drilling holes in a multilayer printed board). 2 is a perspective view of the main parts shown and a side sectional view of a drill hole. In the figure, 2 is an intermediate layer board, 3 is a wiring land, 4 is a drill, and 5 is a side sectional view of a drill hole.
6 shows the surface layer plate, 6 shows the surface copper foil, 7 shows the hollow part, 8 shows the drill hole, 9 shows the smear, and 0 shows the drilling route of the drill. ,C 暉帉凉凉图view+b+ 1 and spy＞d゛/l寥子音[11 嚉帉凉图未发现每珏σJm Fig. 1
Claims (1)
層プリント板に、ドリル穴（８）を穿孔形成する際の穴
明け方法であって、 前記中間層板（２）の配線ランド（３）にドリル穴（８
）の直径よりも小さい直径の中空部（７）を形成し、該
中空部（７）にドリル（４）を位置決めして、前記多層
プリント板に対する穿孔加工を行うようにしたことを特
徴とする多層プリント板の穴明け方法。[Scope of Claims] A drilling method for forming a drill hole (8) in a multilayer printed board formed by laminating a surface layer board (5) and an intermediate layer board (2), comprising: Drill a hole (8) in the wiring land (3) of the layer board (2).
), and a drill (4) is positioned in the hollow part (7) to perform drilling on the multilayer printed board. How to drill holes in multilayer printed boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4241186A JPS62199398A (en) | 1986-02-26 | 1986-02-26 | Method of boring multilayer printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4241186A JPS62199398A (en) | 1986-02-26 | 1986-02-26 | Method of boring multilayer printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199398A true JPS62199398A (en) | 1987-09-03 |
Family
ID=12635324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4241186A Pending JPS62199398A (en) | 1986-02-26 | 1986-02-26 | Method of boring multilayer printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199398A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5102497A (en) * | 1988-09-30 | 1992-04-07 | Nissha Printing Co., Ltd. | Transfer member with a metallic luster pattern and method for manufacturing the same |
-
1986
- 1986-02-26 JP JP4241186A patent/JPS62199398A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5102497A (en) * | 1988-09-30 | 1992-04-07 | Nissha Printing Co., Ltd. | Transfer member with a metallic luster pattern and method for manufacturing the same |
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