JPS6219856A - Positioning method for substrate where pattern is to be formed - Google Patents

Positioning method for substrate where pattern is to be formed

Info

Publication number
JPS6219856A
JPS6219856A JP60159444A JP15944485A JPS6219856A JP S6219856 A JPS6219856 A JP S6219856A JP 60159444 A JP60159444 A JP 60159444A JP 15944485 A JP15944485 A JP 15944485A JP S6219856 A JPS6219856 A JP S6219856A
Authority
JP
Japan
Prior art keywords
alignment
glaze
substrate
key
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60159444A
Other languages
Japanese (ja)
Other versions
JPH0560584B2 (en
Inventor
Takanari Nagahata
隆也 長畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP60159444A priority Critical patent/JPS6219856A/en
Publication of JPS6219856A publication Critical patent/JPS6219856A/en
Publication of JPH0560584B2 publication Critical patent/JPH0560584B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electronic Switches (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To perform accurate positioning on the basis of a positioning mark which is viewed through a cut part formed by cutting part of a circle and a partial circle part by shaping an alignment key in a partial concentric circle consisting of the cut part and partial circle part. CONSTITUTION:A glaze layer 2 is formed on a pattern formation substrate 1 by screen printing and a circular glaze 3 for alignment is formed simultaneously with the formation of the layer 2. This glaze 3 is formed nearby the end part of two corresponding sides in the extension direction of the layer 2. The alignment key 5 corresponding to the position of the glaze 3 is formed at the end part of two sides of a photomask made of transparent glass. Further, the desired pattern of the substrate 1 is formed in the photomask 4. The key 5 consists of the partial circle part 5a and cut part 5b and the circular glaze 3 is nearly as large as the key 5; when the both are put one over the other, the glaze 3 can be seen through the cut part 5b, so that the glaze 3 and key 5 are positioned accurately.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 この発明は、例えばサーマルプリントヘッド等のパター
ン被形成基板の位置合わせ方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a method for aligning a substrate on which a pattern is formed, such as a thermal print head.

(ロ)従来の技術 サーマルプリントヘッドの製造過程において、グレーズ
層上に適性に電極パターンや発熱抵抗体パターンを形成
するのに、プリントヘッド基板をマスクに位置合わせす
る必要がある。この位置合わせは、従来、グレーズ層の
直交方向に対しては、マスクに設けたアライメントキー
とグレーズ層のピッチとで行い、グレーズ層の延長方向
に対しては、ピンアライメント装置に固設された複数本
のピンに基板の端辺を当接させて行っていた。しかしな
がら、基板寸法精度誤差のため、延長方向のアライメン
ト精度を向上させるには、一定の限界があった。
(B) Prior Art In the manufacturing process of a thermal print head, it is necessary to align the print head substrate with a mask in order to properly form an electrode pattern or a heating resistor pattern on a glaze layer. Conventionally, this alignment was performed in the orthogonal direction of the glaze layer using an alignment key provided on the mask and the pitch of the glaze layer, and in the extending direction of the glaze layer, it was performed using a pin fixed to the alignment device. This was done by touching the edge of the board to multiple pins. However, due to substrate dimensional accuracy errors, there is a certain limit to improving alignment accuracy in the extension direction.

そこで、この問題を解決し、さらにアライメント精度を
向上させるために、この出願の出願人は、基板の対向す
る2辺の端部近傍に円形のアライメント用グレーズをグ
レーズ層と同時に形成し、この後、前記アライメント用
グレーズに対応して設けられた同心円のアライメントキ
ーを備えたマスクでもって前記基板との位置合わせを行
う方法を開発し、すでに出願した。
Therefore, in order to solve this problem and further improve alignment accuracy, the applicant of this application formed a circular alignment glaze near the ends of two opposing sides of the substrate at the same time as the glaze layer, and then , has developed and already filed an application for a method of aligning with the substrate using a mask equipped with concentric alignment keys provided corresponding to the alignment glaze.

(ハ)発明が解決しようとする問題点 グレーズ層はガラス層であるため、基板に形成される円
形のアライメント用グレーズ層は、その形状や中心がわ
かりにくい。その上、上記先願に係るアライメントキー
15は、形状が第2図(a)に示すように、同心円に形
成されたものであるため、第2図(b)に示すように、
グレーズ層13のパターンがほぼアライメントキー15
の同心円と等しい場合、これを重ねると、第2図(C)
に示すように、グレーズ層13のパターンがアライメン
トキー15の同心円に隠れてしまい、非常に見にくく、
位置合わせに時間がかかるという問題があった。
(c) Problems to be Solved by the Invention Since the glaze layer is a glass layer, the shape and center of the circular alignment glaze layer formed on the substrate are difficult to discern. Moreover, since the alignment key 15 according to the prior application is formed in concentric circles as shown in FIG. 2(a), as shown in FIG. 2(b),
The pattern of the glaze layer 13 is almost the alignment key 15
If it is equal to the concentric circles of
As shown in the figure, the pattern of the glaze layer 13 is hidden by the concentric circles of the alignment key 15, making it very difficult to see.
There was a problem that alignment took time.

この発明は、上記に鑑み、位置合わせが速く、正確にな
し得るパターン被形成基板の位置合わせ方法を提供する
ことを目的としている。
In view of the above, an object of the present invention is to provide a method for positioning a substrate on which a pattern is to be formed, in which positioning can be performed quickly and accurately.

(ニ)問題点を解決するための手段及び作用この発明の
パターン被形成基板の位置合わせ方法は、パターン被形
成基板の対向する2辺の端部近傍に円形の位置合わせマ
ーク(アライメント用グレーズ層)を形成しておく一方
、マスクに前記位置合わせマークに対応するアライメン
トキーを設けておき、このアライメントキーに前記位置
合わせマークを合致させることにより位置合わせを行う
ものにおいて、前記アライメントキーの形状を、円の一
部を切除した切除部と部分内部とからなる部分同心円と
し、切除部から目視される前記位置合わせマークと部分
内部とにより位置合わせを行うようにしている。
(d) Means and Effects for Solving Problems The method for aligning a pattern-formed substrate of the present invention is characterized in that circular alignment marks (alignment glaze layers) are placed near the ends of two opposing sides of a pattern-formed substrate. ), and an alignment key corresponding to the alignment mark is provided on the mask, and alignment is performed by matching the alignment mark with the alignment key, in which the shape of the alignment key is , a partial concentric circle is formed by cutting out a part of a circle and the inside of the part, and alignment is performed using the positioning mark visually observed from the cut out part and the inside of the part.

(ホ)実施例 以下、実施例により、この発明をさらに詳細に説明する
(E) Examples The present invention will be explained in more detail with reference to Examples below.

第3図は、基板にグレーズ層とアライメント用のグレー
ズを形成した状態を示す説明図、第4図は、マスクに形
成されたアライメントキーを示す説明図である。
FIG. 3 is an explanatory diagram showing a state in which a glaze layer and a glaze for alignment are formed on a substrate, and FIG. 4 is an explanatory diagram showing an alignment key formed on a mask.

第3図において、セラミック等からなる基板1にスクリ
ーン印刷によって塗布・焼成されたグレーズN2が形成
され、このグレーズN2の形成と同時に、円形のアライ
メント用グレーズ3が形成されている。このアライメン
ト用グレーズ3は、グレーズN2の延長方向に相当する
対向した2辺の端部近傍に形成されている。
In FIG. 3, a glaze N2 is formed on a substrate 1 made of ceramic or the like by screen printing and fired, and at the same time as the glaze N2 is formed, a circular alignment glaze 3 is formed. This alignment glaze 3 is formed near the ends of two opposing sides corresponding to the extending direction of the glaze N2.

第4図において、ホトマスク4は超透明度なガラスより
成り、前記アライメント用グレーズ3の位置に対応して
、ホトマスク4の2辺の端部にアライメントキー5を形
成している。なお、図示していないが、ホトマスク4に
は基板1に所望のパターンを形成するためのマスクパタ
ーンを備えている。
In FIG. 4, a photomask 4 is made of ultra-transparent glass, and alignment keys 5 are formed at the ends of two sides of the photomask 4, corresponding to the positions of the alignment glaze 3. Although not shown, the photomask 4 includes a mask pattern for forming a desired pattern on the substrate 1.

この実施例では、アライメントキー5の形状に最も特徴
を有する。つまり、アライメントキー5は、第1図(a
lに示すように、同心円を456ずつ分解して、交互の
部分内部5aと切除部5bとから構成されている。
This embodiment is most characterized by the shape of the alignment key 5. In other words, the alignment key 5 is
As shown in FIG. 1, the concentric circles are divided into 456 parts and are made up of alternating interior parts 5a and cutout parts 5b.

次に、上記基板1とホトマスク4の位置合わせ方法につ
いて説明する。
Next, a method for aligning the substrate 1 and the photomask 4 will be explained.

先ス、グレーズ層2及びアライメント用グレーズ3が形
成された基板1をビンアライメント装置にセットする。
First, the substrate 1 on which the glaze layer 2 and alignment glaze 3 are formed is set in a bin alignment device.

次に、ホトマスク4を基板1に関連してセットする。Next, the photomask 4 is set in relation to the substrate 1.

続いて、ビンアライメント装置により基板1を移動し、
アライメント用グレーズ3とアライメントキー5を照合
一致させて、位置合わせを行う。
Next, the substrate 1 is moved by a bin alignment device,
The alignment glaze 3 and the alignment key 5 are compared and matched to perform positioning.

この場合、アライメント用グレーズ3が円形であるため
に、基板1の対向する2辺にそれぞれ1個ずつ設けられ
るアライメント用グレーズ3によって、グレーズ層2の
延長方向及び直交方向の位置合わせがなされる。
In this case, since the alignment glaze 3 is circular, the alignment glaze 3 provided on each of the two opposing sides of the substrate 1 aligns the glaze layer 2 in the extending direction and in the orthogonal direction.

また、アライメントキー5が部分内部5aと切除部5b
とから構成されているので、第1図(blに示すように
、円形のアライメント用グレーズ3の大きさがアライメ
ントキー5の大きさと略同じでも、第1図(C1に示す
ように、両者を重合わせた場合、切除部5bを通してア
ライメント用グレーズ3を目視することが出来、この目
視されるアライメント用グレーズ3とアライメントキー
5の部分内部5aとを合致させることにより、位置合わ
せを正確に行うことができる。
In addition, the alignment key 5 is connected to the inner part 5a and the cutout part 5b.
Even if the size of the circular alignment glaze 3 is approximately the same as the size of the alignment key 5, as shown in FIG. When superimposed, the alignment glaze 3 can be visually observed through the cutout 5b, and alignment can be performed accurately by matching the visually observed alignment glaze 3 with the inner portion 5a of the alignment key 5. Can be done.

なお、上記実施例において、アライメントキ−の切除部
5bを45°きざみで設けているが、この切除部6bと
する角度及び部分同心内部5aとの比率は、適宜の値に
選定して使用すればよい。
In the above embodiment, the cutout portions 5b of the alignment key are provided in 45° increments, but the angle of the cutout portions 6b and the ratio to the partially concentric interior 5a may be selected to appropriate values. Bye.

また、上記実施例は、サーマルプリントヘッドを例に上
げて説明したが、この発明は、他のパターン被形成基板
にパターン形成する際の位置合わせにも広く適用できる
Furthermore, although the above embodiments have been described using a thermal print head as an example, the present invention can be widely applied to alignment when forming patterns on other pattern-forming substrates.

(へ)発明の効果 この発明によれば、アライメントキーの形状を円の一部
を切除した切除部と、部分内部とから成る部分同心円と
し、切除部から目視される円形の位置合わせマークと部
分内部とにより位置合わせを行うものであるから、アラ
イメントキーと位置合わせマークが完全に重なる場合で
も、切除部より位置合わせマークを目視して、正確に位
置合わせを行うことが出来、かつ位置合わせ時間を大幅
に短縮できる。
(F) Effects of the Invention According to the present invention, the shape of the alignment key is made into a partially concentric circle consisting of a cutout part which is a part of a circle cut out, and the inside of the part, and the circular alignment mark and the part that can be visually observed from the cutout part. Since the alignment is performed internally, even if the alignment key and the alignment mark completely overlap, the alignment mark can be visually checked from the resection area and alignment can be performed accurately, and the alignment time can be shortened. can be significantly shortened.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、この発明の位置合わせを説明するための図で
あり、第1図(a)はアライメントキーを、第1図(b
lはアライメント用グレーズのパターンを、第1図(C
)はアライメントキーとアライメント用グレーズを重合
わせた状態をそれぞれ示す図、第2図は、従来の位置合
わせを説明するための図であり、第2図fa)はアライ
メントキーを、第2図(telはアライメント用グレー
ズのパターンを、第2図1c)はアライメントキーとア
ライメント用グレーズを重合わせた状態を示す図、第3
図は、基板にグレーズ層とアライメント用のグレーズを
形成した状態を示す説明図、第4図は、マスクに形成さ
れたアライメントキーを示す説明図である。 工:基板、     2:グレーズ層、3:アライメン
ト用グレーズ、 4:ホトマスク、   5:アライメントキー、5a:
部分内部、5b:切除部。 特許出願人      ローム株式会社代理人    
弁理士 中 村 茂 信第1図 第2図 CC)            <b)<a) <a>
FIG. 1 is a diagram for explaining the alignment of the present invention, and FIG. 1(a) shows the alignment key.
l shows the alignment glaze pattern in Figure 1 (C
) is a diagram showing the state in which the alignment key and the alignment glaze are superimposed, FIG. 2 is a diagram for explaining conventional alignment, and FIG. tel is the alignment glaze pattern, Fig. 2 (1c) is a diagram showing the alignment key and alignment glaze overlapped, and Fig. 3
The figure is an explanatory diagram showing a state in which a glaze layer and a glaze for alignment are formed on a substrate, and FIG. 4 is an explanatory diagram showing an alignment key formed on a mask. Engineering: Substrate, 2: Glaze layer, 3: Alignment glaze, 4: Photomask, 5: Alignment key, 5a:
Part inside, 5b: resection part. Patent applicant ROHM Co., Ltd. agent
Patent Attorney Shigeru Nakamura Figure 1 Figure 2 CC) <b) <a) <a>

Claims (1)

【特許請求の範囲】[Claims] (1)パターン被形成基板の対向する2辺の端部近傍に
円形の位置合わせマークを形成しておく一方、マスクに
前記位置合わせマークに対応するアライメントキーを設
けておき、このアライメントキーに前記位置合わせマー
クを合致させることにより位置合わせを行うパターン被
形成基板の位置合わせ方法において、 前記アライメントキーの形状を、円の一部を切除した切
除部と部分円部とからなる部分同心円とし、切除部から
目視される前記位置合わせマークと部分内部とにより位
置合わせを行うことを特徴とするパターン被形成基板の
位置合わせ方法。
(1) Circular alignment marks are formed near the ends of two opposing sides of the pattern formation substrate, and an alignment key corresponding to the alignment mark is provided on the mask, and the alignment key is attached to the alignment key corresponding to the alignment mark. In a method for aligning a patterned substrate in which alignment is performed by aligning alignment marks, the shape of the alignment key is a partially concentric circle consisting of a cutout section and a partial circle section, and A method for aligning a substrate on which a pattern is formed, characterized in that alignment is performed using the alignment mark visually observed from the part and the inside of the part.
JP60159444A 1985-07-18 1985-07-18 Positioning method for substrate where pattern is to be formed Granted JPS6219856A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60159444A JPS6219856A (en) 1985-07-18 1985-07-18 Positioning method for substrate where pattern is to be formed

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60159444A JPS6219856A (en) 1985-07-18 1985-07-18 Positioning method for substrate where pattern is to be formed

Publications (2)

Publication Number Publication Date
JPS6219856A true JPS6219856A (en) 1987-01-28
JPH0560584B2 JPH0560584B2 (en) 1993-09-02

Family

ID=15693885

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60159444A Granted JPS6219856A (en) 1985-07-18 1985-07-18 Positioning method for substrate where pattern is to be formed

Country Status (1)

Country Link
JP (1) JPS6219856A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246458A (en) * 1988-08-08 1990-02-15 Nec Corp Mask seam matching pattern
JPH0326230A (en) * 1989-06-26 1991-02-04 Kanebo Ltd Skin characteristic checking device
JPWO2012133760A1 (en) * 2011-03-30 2014-07-28 ボンドテック株式会社 Electronic component mounting method, electronic component mounting system, and substrate
CN106004096A (en) * 2016-05-13 2016-10-12 清华大学深圳研究生院 Ink-jet printing tray for printing sensitive layer of quartz crystal sensor
CN109358475A (en) * 2018-12-05 2019-02-19 全普光电科技(上海)有限公司 Alignment mark, mask plate and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0246458A (en) * 1988-08-08 1990-02-15 Nec Corp Mask seam matching pattern
JPH0326230A (en) * 1989-06-26 1991-02-04 Kanebo Ltd Skin characteristic checking device
JPWO2012133760A1 (en) * 2011-03-30 2014-07-28 ボンドテック株式会社 Electronic component mounting method, electronic component mounting system, and substrate
CN106004096A (en) * 2016-05-13 2016-10-12 清华大学深圳研究生院 Ink-jet printing tray for printing sensitive layer of quartz crystal sensor
CN109358475A (en) * 2018-12-05 2019-02-19 全普光电科技(上海)有限公司 Alignment mark, mask plate and preparation method thereof

Also Published As

Publication number Publication date
JPH0560584B2 (en) 1993-09-02

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