JPS62193623U - - Google Patents
Info
- Publication number
- JPS62193623U JPS62193623U JP8189586U JP8189586U JPS62193623U JP S62193623 U JPS62193623 U JP S62193623U JP 8189586 U JP8189586 U JP 8189586U JP 8189586 U JP8189586 U JP 8189586U JP S62193623 U JPS62193623 U JP S62193623U
- Authority
- JP
- Japan
- Prior art keywords
- particles
- conductive film
- anisotropic conductive
- thermoplastic resin
- dispersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000012212 insulator Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 1
Description
第１図ａは本考案の実施例による異方性導電膜
の構成を示す図、ｂはその使用状態を示す図、第
２図ａは従来の異方性導電膜の構成を示す図、ｂ
はその使用状態を示す図である。
１，２……回路板、１ａ，２ａ……回路板の端
子、３……異方性導電膜、３ａ……導電体（金属
粒子）、３ｂ……絶縁体粒子、３ｃ……熱可塑性
樹脂。
FIG. 1a is a diagram showing the structure of an anisotropic conductive film according to an embodiment of the present invention, b is a diagram showing its usage state, FIG. 2a is a diagram showing the structure of a conventional anisotropic conductive film, b
is a diagram showing its usage state. 1, 2... Circuit board, 1a, 2a... Terminal of circuit board, 3... Anisotropic conductive film, 3a... Conductor (metal particles), 3b... Insulator particle, 3c... Thermoplastic resin .
Claims (1)
粒子に比べ高融点の複数の絶縁体粒子とを分散、
混合したことを特徴とする異方性導電膜。 A plurality of conductor particles and a plurality of insulator particles having a higher melting point than the particles are dispersed in a thermoplastic resin layer,
An anisotropic conductive film characterized by being mixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8189586U JPS62193623U (en) | 1986-05-30 | 1986-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8189586U JPS62193623U (en) | 1986-05-30 | 1986-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62193623U true JPS62193623U (en) | 1987-12-09 |
Family
ID=30934049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8189586U Pending JPS62193623U (en) | 1986-05-30 | 1986-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62193623U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0329207A (en) * | 1988-12-05 | 1991-02-07 | Hitachi Chem Co Ltd | Composition for circuit connection and connection method and connection structure of semiconductor chip using the composition |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5287663A (en) * | 1975-10-23 | 1977-07-21 | Chomerics Inc | Separate current path connector |
| JPS6280912A (en) * | 1985-10-02 | 1987-04-14 | セイコーエプソン株式会社 | Anisotropic conductive film |
-
1986
- 1986-05-30 JP JP8189586U patent/JPS62193623U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5287663A (en) * | 1975-10-23 | 1977-07-21 | Chomerics Inc | Separate current path connector |
| JPS6280912A (en) * | 1985-10-02 | 1987-04-14 | セイコーエプソン株式会社 | Anisotropic conductive film |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0329207A (en) * | 1988-12-05 | 1991-02-07 | Hitachi Chem Co Ltd | Composition for circuit connection and connection method and connection structure of semiconductor chip using the composition |
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