JPS62193131A - Molding apparatus - Google Patents

Molding apparatus

Info

Publication number
JPS62193131A
JPS62193131A JP3294586A JP3294586A JPS62193131A JP S62193131 A JPS62193131 A JP S62193131A JP 3294586 A JP3294586 A JP 3294586A JP 3294586 A JP3294586 A JP 3294586A JP S62193131 A JPS62193131 A JP S62193131A
Authority
JP
Japan
Prior art keywords
cavity
sub
resin
main cavity
gate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3294586A
Inventor
Tomoo Sakamoto
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3294586A priority Critical patent/JPS62193131A/en
Publication of JPS62193131A publication Critical patent/JPS62193131A/en
Application status is Granted legal-status Critical

Links

Abstract

PURPOSE: To avoid the yield of voids in a molded product with damages of molds being avoided, by inserting a part of a material, which is inserted in a main cavity, in a sub-cavity so that the molded product in the sub-cavity at least supports the inserting part.
CONSTITUTION: A material to be packaged 10 is set on a bottom force 2 so that a pellet 18, inner leads 15 and bonding wires 19 are contained in a main cavity. Then, a top force 1 is coupled with the bottom force 2, and the main cavity 3 and a sub-cavity 6 are formed. An outer frame 12 and outer leads of a lead frame 11 are held between the top and lower forces 1 and 2. A resin 21 in a runner 4 is injected in the main cavity 3 through a gate 5. Air in the main cavity 3 is exhausted to the outside through a sub-gate 7, the sub-cavity 6 and an air vent 8. When the injection of the resin 21 comes to a final stage, the resin 21 is injected into the upper part of the sub-cavity 6 through the main cavity 3 and the sub-gate 7. The resin also fills the upper part of the sub-cavity 6 through a positioning hole 20.
COPYRIGHT: (C)1987,JPO&Japio
JP3294586A 1986-02-19 1986-02-19 Molding apparatus Granted JPS62193131A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3294586A JPS62193131A (en) 1986-02-19 1986-02-19 Molding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3294586A JPS62193131A (en) 1986-02-19 1986-02-19 Molding apparatus

Publications (1)

Publication Number Publication Date
JPS62193131A true JPS62193131A (en) 1987-08-25

Family

ID=12373086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3294586A Granted JPS62193131A (en) 1986-02-19 1986-02-19 Molding apparatus

Country Status (1)

Country Link
JP (1) JPS62193131A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
US6403009B1 (en) 1994-11-15 2002-06-11 Vlt Corporation Circuit encapsulation
US6710257B2 (en) 1994-11-15 2004-03-23 Vlt Corporation Circuit encapsulation

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