JPS62190343U - - Google Patents

Info

Publication number
JPS62190343U
JPS62190343U JP1986079860U JP7986086U JPS62190343U JP S62190343 U JPS62190343 U JP S62190343U JP 1986079860 U JP1986079860 U JP 1986079860U JP 7986086 U JP7986086 U JP 7986086U JP S62190343 U JPS62190343 U JP S62190343U
Authority
JP
Japan
Prior art keywords
capillary
wire bonding
tip surface
view
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986079860U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0445241Y2 (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986079860U priority Critical patent/JPH0445241Y2/ja
Publication of JPS62190343U publication Critical patent/JPS62190343U/ja
Application granted granted Critical
Publication of JPH0445241Y2 publication Critical patent/JPH0445241Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1986079860U 1986-05-26 1986-05-26 Expired JPH0445241Y2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986079860U JPH0445241Y2 (zh) 1986-05-26 1986-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986079860U JPH0445241Y2 (zh) 1986-05-26 1986-05-26

Publications (2)

Publication Number Publication Date
JPS62190343U true JPS62190343U (zh) 1987-12-03
JPH0445241Y2 JPH0445241Y2 (zh) 1992-10-23

Family

ID=30930127

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986079860U Expired JPH0445241Y2 (zh) 1986-05-26 1986-05-26

Country Status (1)

Country Link
JP (1) JPH0445241Y2 (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
CN108389806A (zh) * 2018-01-22 2018-08-10 潮州三环（集团）股份有限公司 一种提高引线键合强度的劈刀
CN109332901A (zh) * 2018-09-14 2019-02-15 深圳市商德先进陶瓷股份有限公司 陶瓷劈刀及其制作方法和应用
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
JP2022114619A (ja) * 2021-01-27 2022-08-08 三菱電機株式会社 ワイヤボンディング装置および半導体装置の製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014116334A (ja) * 2012-12-06 2014-06-26 Mitsubishi Electric Corp ウェッジボンディング用ツール、及びウェッジボンディング方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD821468S1 (en) 2015-02-03 2018-06-26 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824970S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD824969S1 (en) 2015-02-03 2018-08-07 Coorstek, Inc. Ceramic bonding tool with textured tip
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
CN108389806A (zh) * 2018-01-22 2018-08-10 潮州三环（集团）股份有限公司 一种提高引线键合强度的劈刀
CN109332901A (zh) * 2018-09-14 2019-02-15 深圳市商德先进陶瓷股份有限公司 陶瓷劈刀及其制作方法和应用
CN109332901B (zh) * 2018-09-14 2021-01-08 深圳市商德先进陶瓷股份有限公司 陶瓷劈刀及其制作方法和应用
JP2022114619A (ja) * 2021-01-27 2022-08-08 三菱電機株式会社 ワイヤボンディング装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0445241Y2 (zh) 1992-10-23

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