JPS62163962U - - Google Patents
Info
- Publication number
- JPS62163962U JPS62163962U JP5156586U JP5156586U JPS62163962U JP S62163962 U JPS62163962 U JP S62163962U JP 5156586 U JP5156586 U JP 5156586U JP 5156586 U JP5156586 U JP 5156586U JP S62163962 U JPS62163962 U JP S62163962U
- Authority
- JP
- Japan
- Prior art keywords
- concave
- marker
- bonded
- serves
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003550 marker Substances 0.000 claims 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5156586U JPS62163962U (zh) | 1986-04-08 | 1986-04-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5156586U JPS62163962U (zh) | 1986-04-08 | 1986-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62163962U true JPS62163962U (zh) | 1987-10-17 |
Family
ID=30875945
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5156586U Pending JPS62163962U (zh) | 1986-04-08 | 1986-04-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62163962U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012253390A (ja) * | 2012-09-24 | 2012-12-20 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP2017199823A (ja) * | 2016-04-28 | 2017-11-02 | 株式会社ジェイデバイス | 半導体パッケージ及び半導体パッケージの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55127047A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Resin-sealed semiconductor device |
JPS5623896U (zh) * | 1979-07-30 | 1981-03-04 |
-
1986
- 1986-04-08 JP JP5156586U patent/JPS62163962U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55127047A (en) * | 1979-03-26 | 1980-10-01 | Hitachi Ltd | Resin-sealed semiconductor device |
JPS5623896U (zh) * | 1979-07-30 | 1981-03-04 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012253390A (ja) * | 2012-09-24 | 2012-12-20 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP2017199823A (ja) * | 2016-04-28 | 2017-11-02 | 株式会社ジェイデバイス | 半導体パッケージ及び半導体パッケージの製造方法 |