JPS62188214A - Manufacture of laminated ceramic capacitor - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for manufacturing a wL layer ceramic capacitor, and more particularly to a method for manufacturing a multilayer ceramic capacitor in which thermocompression bonding work and stamping work are simplified by FM. Technology] An example of the conventional manufacturing method of multilayer ceramic capacitors is shown in the second example.
It is shown in Figure (b) and Figures 7 to 10. FIG. 2(b) is a flowchart of the manufacturing process of a conventional multilayer ceramic capacitor, and the conventional method of manufacturing a multilayer ceramic capacitor related to the present invention will be explained with reference to FIGS. 7 to 10. As shown in the laminated structure during thermocompression bonding in FIG. 7, Teflon or silicone resin is applied to both sides of the metal plate 8 having the rigidity shown in FIGS. 8(a) and (b) in the hole 6a of the lower mold 6. A mold release spacer 14 coated with a mold release agent 7 with a thickness of 5 to 20 μm is inserted, and a plurality of printed raw sheets 1 on which internal electrodes are printed, and a plurality of protective raw sheets 2. A ceramic laminate 3 composed of the above is placed. Thereafter, after stacking a plurality of ceramic laminates 3 according to the above-mentioned order, an upper mold 5 whose surface in contact with the ceramic laminate 3 is coated with the same mold-flying agent 7 as the mold release spacer 14 is placed, and the laminate 3 is hoisted. .../1 ~ The ceramic molded body 23 shown in FIG. 9 was formed by heat-pressing and integrating with a thermocompression bonding device such as a press, and the ceramic molded body 23 was supplied to a subsequent process.

However, in the conventional manufacturing method, the ceramic molded body 23 is divided into individual chips and sintered in a subsequent process.

After attaching the external electrodes, as shown in FIG. 10, the surface of the chip-shaped multilayer ceramic capacitor 10 on which the external electrodes 16 are formed centering on the opposing end faces is individually stamped using an offset type stamping machine. Multilayer Ceramic Capacitor] 0 was stamped with a symbol 9 indicating the product name or standard.

[Problem that the invention seeks to solve]

Therefore, the conventional manufacturing method described above has the following drawbacks. <1)? ? It took a lot of man-hours to stamp the i-layer ceramic capacitor 10, and (2) the thermal stress during the drying of the stamp accelerated the deterioration of the reliability and quality of the multilayer ceramic capacitor. (3) Furthermore, since a thermosetting resin was used for the ink used for the stamp, the solvent resistance was inferior to that of metal-based pastes.

An object of the present invention is to provide a method for manufacturing a multilayer ceramic capacitor that eliminates such conventional drawbacks, has less deterioration in quality due to ripening stress, has excellent solvent resistance, and can significantly shorten the stamping process.

[Means for Solving the Problems] The method for manufacturing a multilayer ceramic capacitor of the present invention includes stacking a plurality of printed raw sheets each having an electrode pattern on them so as to form opposing electrodes, and stacking the stacked printed raw sheets. A method for manufacturing a multilayer ceramic capacitor, which includes a step of forming a laminate by arranging a protective raw sheet on the upper and lower surfaces, arranging release spacers on the upper and lower surfaces of the laminate, and thermocompression molding. A mold release spacer having a symbol printed on at least one side with a fine powder paste of the above is inserted in place of the mold release spacer so that the printed surface of the mold release spacer is in contact with at least one surface of the laminate, and thermocompression molding is performed. It is constructed by stamping the above-mentioned symbol on the surface of the laminate simultaneously with thermocompression molding of the laminate.

Further, as the conductive or insulating fine powder paste, it is convenient to use an Ag-Pd paste for forming an electrode pattern from the viewpoint of the process and characteristics.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a laminated structure during thermocompression bonding to explain an embodiment of the present invention, and FIG. 2(a) is a manufacturing process diagram to explain a manufacturing method of an embodiment of the present invention. Flowchart 1 and FIG. 2(b) are flowcharts of a conventional manufacturing process for comparison and explanation with the present invention, and FIG. 3 is a mold release spacer without printing a seal symbol used in an embodiment of the present invention. , FIG. 4 is a perspective view of a ceramic molded body after completion of thermocompression bonding according to an embodiment of the present invention, FIG. 5 is a sectional view taken along the line A-A in FIG. 3, and FIG. It is a sectional view of the BB section of.

Embodiments of the present invention will be described below with reference to FIGS. 1 to 6.

First, as shown in FIGS. 3 and 5, a symbol such as the product name or standard is placed on at least one surface of a conventional mold release spacer 14 having peelability, using the same Ag-I'd paste as the internal electrodes. Four female spacers with a thickness of 3 to 7 μm and printed at regular intervals are manufactured.

A multilayer ceramic capacitor element according to an embodiment of the present invention is formed by the steps shown in FIG.

First, as shown in FIG. 1, in the hole (a) of the lower mold 6,
The release spacer 4 with the above-mentioned symbol 9 printed on one side is designated as symbol 9.
Insert it so that it is facing upwards, and place a soft 1
Thickness 20-70μ increases adhesion! A plurality of protective sheets 1.2 are placed on the lower part of No. 11, and on top of that, Ag-P is placed on the surface of a raw sheet of the same quality as the above-mentioned protective reciprocal sheet 1.2.
The internal electrode 15 of the conductive base made of d paste is
~12. A plurality of αm-printed raw sheets 1 are stacked at positions where opposing electrodes are formed. Next, a plurality of upper protective soil sheets 1-2 are stacked. The ceramic laminate 3 is formed in the lamination process up to this point, and the above-mentioned release spacer 4 is inserted thereon so that the symbol 9 faces upward, and thereafter, a plurality of ceramic laminates 3 are stacked according to the above-mentioned process order. . After the lamination process is completed in this way, the upper mold 5 is placed so that the side coated with the same mold release agent 7 as the mold release spacer 4 faces downward, and heated from above and below using a thermocompression bonding device such as a hot press. As shown in the perspective view of FIG. 4 and the sectional view of FIG.
Ceramic molded body 1 with is stamped on one side at regular intervals
Get 3. Next, this ceramic molded body 13 is divided into individual chips in the next cutting process, and thereafter, sintering and external molding are performed to obtain the chip-shaped multilayer capacitor 10 shown in FIG. It will be done.

Note that when marking symbols on both sides of the ceramic molded body 13, a mold release spacer with symbols printed on both sides may be used as the mold release spacer 4, and a double-sided symbol-printed mold release spacer may be used to stamp the symbol on one side of the ceramic molded body. When printing, it may be arranged alternately with non-printed release spacers.

〔Effect of the invention〕

As explained above, the present invention has the following effects.

(1) The process can be shortened because thermocompression bonding and stamping can be done at the same time, and multiple processes can be done at the same time, which can significantly reduce the number of man-hours. (2) Since the seal drying (baking) is also used as the sintering temperature in the sintering process, quality deterioration due to ripening stress can be reduced. (3) Since Aq-Pd paste is used as the marking ink and baked at a high temperature of 800 to 00°C, it has extremely excellent solvent resistance.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a laminated structure during thermocompression bonding to explain an embodiment of the present invention, FIG. 2(a) is a flowchart of a manufacturing process to explain an embodiment of the present invention, Second
Figure (b) is a flowchart of a conventional manufacturing process for comparison and explanation with Figure 2 (a), Figure 3 is a perspective view of a release spacer printed with a seal symbol used in an embodiment of the present invention, 4 is a perspective view of a ceramic molded body after completion of thermocompression bonding according to an embodiment of the present invention, FIG. 5 is a sectional view taken along the line AA in FIG. 3, and FIG. 6 is a sectional view taken along the line BB in FIG. 4. FIG. Fig. 7 is a perspective view showing the laminated structure during conventional thermocompression bonding, Fig. 8(a), (
b) is a perspective view and a sectional view of the C-0 part of a conventional mold release spacer, FIG. 9 is a perspective view of a conventional ceramic molded body after thermocompression bonding, and FIG. 10 is a conventional stamped chip-shaped multilayer ceramic. FIG. 3 is a perspective view of a capacitor. 1... Printing raw sheet, 2... Protective soil sheet 1~. 3
... Ceramic laminate before thermocompression bonding, 4.14... Mold release spacer, 5... Upper mold having mold releasability, 6...
Lower mold, 6a... Hole of lower mold, 7... Mold release agent, 8.
... Metal plate, 9 ... Symbol, 10 ... Multilayer ceramic capacitor, 13°23 ... Ceramic molded body after thermocompression bonding, 15 ... Internal electrode, 16 ... External electrode.

Claims (2)

[Claims] (1) A plurality of printed raw sheets coated with electrode patterns are stacked so as to form opposing electrodes, and protective raw sheets are placed on the upper and lower surfaces of the stacked printed raw sheets to form a laminate, and the laminate is In a method for manufacturing a multilayer ceramic capacitor, the method includes a step of disposing mold release spacers on the upper and lower surfaces of the capacitor and thermocompression molding the mold release spacers having a symbol printed on at least one side with a conductive or insulating fine powder paste. The mold release spacer is inserted in place of the mold release spacer so that the printed surface of the mold release spacer is in contact with one surface of the laminate, and thermocompression molding is performed, and at the same time as the thermocompression molding of the laminate, the symbol is stamped on the surface of the laminate. A method for manufacturing a multilayer ceramic capacitor, characterized by: (2) Ag-P in conductive or insulating fine powder paste
A method of manufacturing a multilayer ceramic capacitor according to claim (1) using the paste of d.